公开(公告)号：WO2009083582A1

公开(公告)日：2009-07-09

申请号：PCT/EP2008/068328

申请日：2008-12-29

Applicant: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM VZW ,  SOUSSAN, Philippe ,  RUYTHOOREN, Wouter ,  BEYNE, Eric ,  DE MUNCK, Koen

Inventor： SOUSSAN, Philippe ,  RUYTHOOREN, Wouter ,  BEYNE, Eric ,  DE MUNCK, Koen

IPC: H01L21/98 ,  H01L21/60 ,  H01L25/065 ,  F16B19/08 ,  F16B19/10 ,  H01H1/04 ,  H01H11/04 ,  H01L23/48 ,  H01L25/07 ,  H01R4/06

CPC classification number: H01L24/90 ,  F16B5/04 ,  H01H1/04 ,  H01H11/042 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76898 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/13025 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16146 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/75 ,  H01L2224/757 ,  H01L2224/81136 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2225/06541 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01R4/06 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: The present invention is related to a method for aligning and bonding a first element (1) and a second element (2), the first element being a semiconductor die or substrate, the method comprising: obtaining a first element (1) having at least one protrusion, the protrusion having a base portion (12) made of a first non-deformable material and an upper portion (13) made of a second, deformable material, different from the first material; obtaining a second element (2) having a first main surface and second main surface (8) and at least one through-hole between the first and second main surface; placing the first and second element onto each other; receiving in the through-hole of the second element (2) the protrusion of the first element (1), the protrusion being arranged and constructed so as to extend from an opening of the through-hole in the first main surface to a position beyond an opening of the through-hole in the second main surface (8); deforming the deformable portion (13) of the protrusion, such that the deformed portion mechanically fixes the second element (2) on the first element (1).

Abstract translation: 本发明涉及一种用于对准和接合第一元件（1）和第二元件（2）的方法，所述第一元件是半导体管芯或衬底，所述方法包括：获得至少具有第一元件（1） 一个突起，所述突起具有由第一不可变形材料制成的基部（12）和由不同于所述第一材料的第二可变形材料制成的上部（13）; 获得具有第一主表面和第二主表面（8）的第二元件（2）和在第一和第二主表面之间的至少一个通孔; 将第一和第二元件彼此放置; 在所述第二元件（2）的所述通孔中容纳所述第一元件（1）的所述突起，所述突起被布置和构造成从所述第一主表面中的所述通孔的开口延伸到超过 在第二主表面（8）中的通孔的开口; 使突起的可变形部分（13）变形，使得变形部分将第二元件（2）机械地固定在第一元件（1）上。