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    MINI WAVE SOLDERING SYSTEM AND METHOD FOR SOLDERING WIRES AND PIN CONFIGURATIONS
    3.
    发明申请
    MINI WAVE SOLDERING SYSTEM AND METHOD FOR SOLDERING WIRES AND PIN CONFIGURATIONS 审中-公开
    微波焊接系统和焊接线和引脚配置的方法

    公开(公告)号：WO2006099582A2

    公开(公告)日：2006-09-21

    申请号：PCT/US2006009778

    申请日：2006-03-15

    Applicant: MEDCONX INC ,  KENT HAROLD B ,  LEVANTE JAMES J ,  FINE AARON T ,  LAYTON JOSEPH R ,  FOX SARAH

    Inventor： KENT HAROLD B ,  LEVANTE JAMES J ,  FINE AARON T ,  LAYTON JOSEPH R ,  FOX SARAH

    IPC: G01R31/02

    CPC classification number: H05K3/3447 ,  B23K3/0653 ,  B23K2201/32 ,  H01R4/023 ,  H01R43/0242 ,  H01R43/0256 ,  H05K1/0212 ,  H05K1/116 ,  H05K3/3494 ,  H05K2201/09781 ,  H05K2203/0195

    Abstract: A mini wave solder system includes a dielectric substrate having a hole defined therethrough, a conductive heat transfer pad, and a conductive retention pad. A conductive material is associated with the hole. The heat transfer pad and retention pad are disposed adjacent to the hole and the retention pad has a thermally activated conductive material positioned thereon. The heat transfer pad, retention pad, and hole are in thermal communication with each other. A method for coupling a component to a substrate utilizing this system is also described. A wire termination system includes a dielectric substrate having a surface, a conductive material disposed on the surface of the dielectric substrate comprising a retention pad and a heat transfer pad in thermal communication with each other, and a thermally activated conductive material positioned on the retention pad. When heat is applied to the heat transfer pad, thermal energy travels to the retention pad to melt the thermally activated conductive material in order to secure a component to the conductive material. A method for coupling a component to a dielectric substrate in a wire termination system is also described. A pin connection system for coupling a pin to a dielectric substrate is also described. The pin connection system includes a dielectric substrate having a hole and electrical traces defined on a surface of the substrate, a pin positioned in the hole, and a connection solder disposed on a top surface of the pin. The pin has at least one radial protrusion disposed on an outer periphery thereof for perpendicularly aligning the pin with the substrate and for retaining the pin in the substrate in a substantially immobile manner. The connection solder at least one of strengthens the mechanical connection of the pin to the substrate and electrically connects the pin to the traces on the substrate.

    Abstract translation: 微型波峰焊系统包括具有通过其定义的孔的电介质基片，导电传热垫和导电保持垫。 导电材料与孔相关联。 传热垫和保持垫邻近孔设置并且保持垫具有定位在其上的热活化导电材料。 传热垫，保持垫和孔彼此热连通。 还描述了使用该系统将组件耦合到衬底的方法。 电线终端系统包括具有表面的电介质基板，设置在电介质基板的表面上的导电材料，其包括保持垫和彼此热连通的传热垫，以及定位在保持垫上的热活化导电材料 。 当将热量施加到传热垫时，热能传递到保持垫以熔化热活化的导电材料，以便将部件固定到导电材料上。 还描述了用于在线端接系统中将部件耦合到电介质基板的方法。 还描述了用于将引脚耦合到电介质基板的引脚连接系统。 引脚连接系统包括具有孔和限定在基板的表面上的电迹线的介质基板，位于孔中的销和布置在销的顶表面上的连接焊料。 销具有设置在其外周上的至少一个径向突起，用于使销与基板垂直对准并且以基本上不可移动的方式将销保持在基板中。 连接焊料至少有一个可以加强销到基板的机械连接，并将引脚电连接到基板上的迹线上。

    MINI WAVE SOLDERING SYSTEM AND METHOD FOR SOLDERING WIRES AND PIN CONFIGURATIONS
    6.
    发明申请
    MINI WAVE SOLDERING SYSTEM AND METHOD FOR SOLDERING WIRES AND PIN CONFIGURATIONS 审中-公开
    微波焊接系统和焊接线和引脚配置的方法

    公开(公告)号：WO2006099582A3

    公开(公告)日：2009-04-16

    申请号：PCT/US2006009778

    申请日：2006-03-15

    Applicant: MEDCONX INC ,  KENT HAROLD B ,  LEVANTE JAMES J ,  FINE AARON T ,  LAYTON JOSEPH R ,  FOX SARAH

    Inventor： KENT HAROLD B ,  LEVANTE JAMES J ,  FINE AARON T ,  LAYTON JOSEPH R ,  FOX SARAH

    IPC: H05K3/32

    CPC classification number: H05K3/3447 ,  B23K3/0653 ,  B23K2201/32 ,  H01R4/023 ,  H01R43/0242 ,  H01R43/0256 ,  H05K1/0212 ,  H05K1/116 ,  H05K3/3494 ,  H05K2201/09781 ,  H05K2203/0195

    Abstract: A mini wave solder system includes a dielectric substrate having a hole defined therethrough, a conductive heat transfer pad, and a conductive retention pad. The heat transfer pad and retention pad are disposed adjacent to the hole and the retention pad has a thermally activated conductive material positioned thereon. The heat transfer pad, retention pad, and hole are in thermal communication with each other. A method for coupling a component to a substrate utilizing this system is also described. A wire termination system includes a dielectric substrate having a surface, a conductive material disposed on the surface of the dielectric substrate comprising a retention pad and a heat transfer pad in thermal communication with each other, and a thermally activated conductive material positioned on the retention pad. When heat is applied to the heat transfer pad, thermal energy travels to the retention pad to melt the thermally activated conductive material.

    Abstract translation: 微型波峰焊系统包括具有通过其定义的孔的电介质基片，导电传热垫和导电保持垫。 传热垫和保持垫邻近孔设置并且保持垫具有定位在其上的热活化导电材料。 传热垫，保持垫和孔彼此热连通。 还描述了使用该系统将组件耦合到衬底的方法。 电线终端系统包括具有表面的电介质基板，设置在电介质基板的表面上的导电材料，其包括保持垫和彼此热连通的传热垫，以及定位在保持垫上的热活化导电材料 。 当热量传递到传热垫时，热能传递到保持垫以熔化热活化的导电材料。

    MECHANICAL LIMITER DEVICE
    7.
    发明申请
    MECHANICAL LIMITER DEVICE 审中-公开
    机械极限装置

    公开(公告)号：WO2005101436A1

    公开(公告)日：2005-10-27

    申请号：PCT/US2005/011779

    申请日：2005-04-06

    Applicant: MEDCONX, INC. ,  KENT, Harold, B. ,  LEVANTE, James, J. ,  FINE, Aaron, T.

    Inventor： KENT, Harold, B. ,  LEVANTE, James, J. ,  FINE, Aaron, T.

    IPC: H01H13/18

    CPC classification number: H01H13/18 ,  A61B2560/0276 ,  A61N1/048 ,  H01H2003/0273 ,  H01H2300/014 ,  H01R13/7032 ,  H01R13/7035 ,  H01R13/707 ,  H01R2201/12 ,  Y10T29/49105 ,  Y10T29/49158

    Abstract: A mechanical limiter device (10), having: a housing (12) with a slot (14) passing at least partially therearound, the slot forming a plurality of teeth (16) in a side of the housing; a plunger (20) movable within the housing; a biasing mechanism (22) configured to urge the plunger in a proximal direction within the housing; a contact member (25) extending through the slot in the side of the housing, the contact member being configured to advance past at least one of each of the plurality of teeth in the slot each time the plunger is moved back and forth within the housing.

    Abstract translation: 一种机械限制器装置（10），其具有：壳体（12），其具有至少部分地在其周围通过的槽（14），所述狭槽在所述壳体的一侧形成多个齿（16） 柱塞（20），其可在所述壳体内移动; 偏压机构（22），构造成沿着所述壳体内的近端方向推动所述柱塞; 接触构件（25），其延伸穿过所述壳体侧面中的所述狭槽，所述接触构件被配置成每当所述柱塞在所述壳体内前后移动时，经过所述槽中的所述多个齿中的每一个中的至少一个齿 。

    MINI WAVE SOLDERING SYSTEM AND METHOD FOR SOLDERING WIRES AND PIN CONFIGURATIONS
    8.
    发明申请
    MINI WAVE SOLDERING SYSTEM AND METHOD FOR SOLDERING WIRES AND PIN CONFIGURATIONS 审中-公开

    公开(公告)号：WO2006099582A9

    公开(公告)日：2006-09-21

    申请号：PCT/US2006/009778

    申请日：2006-03-15

    Applicant: MEDCONX, INC. ,  KENT, Harold, B. ,  LEVANTE, James, J. ,  FINE, Aaron, T. ,  LAYTON, Joseph, R. ,  FOX, Sarah

    Inventor： KENT, Harold, B. ,  LEVANTE, James, J. ,  FINE, Aaron, T. ,  LAYTON, Joseph, R. ,  FOX, Sarah

    IPC: G01R31/02

    Abstract: A mini wave solder system includes a dielectric substrate having a hole defined therethrough, a conductive heat transfer pad, and a conductive retention pad. A conductive material is associated with the hole. The heat transfer pad and retention pad are disposed adjacent to the hole and the retention pad has a thermally activated conductive material positioned thereon. The heat transfer pad, retention pad, and hole are in thermal communication with each other. A method for coupling a component to a substrate utilizing this system is also described. A wire termination system includes a dielectric substrate having a surface, a conductive material disposed on the surface of the dielectric substrate comprising a retention pad and a heat transfer pad in thermal communication with each other, and a thermally activated conductive material positioned on the retention pad. When heat is applied to the heat transfer pad, thermal energy travels to the retention pad to melt the thermally activated conductive material in order to secure a component to the conductive material. A method for coupling a component to a dielectric substrate in a wire termination system is also described. A pin connection system for coupling a pin to a dielectric substrate is also described. The pin connection system includes a dielectric substrate having a hole and electrical traces defined on a surface of the substrate, a pin positioned in the hole, and a connection solder disposed on a top surface of the pin. The pin has at least one radial protrusion disposed on an outer periphery thereof for perpendicularly aligning the pin with the substrate and for retaining the pin in the substrate in a substantially immobile manner. The connection solder at least one of strengthens the mechanical connection of the pin to the substrate and electrically connects the pin to the traces on the substrate.

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