公开(公告)号：WO2012058656A2

公开(公告)日：2012-05-03

申请号：PCT/US2011/058487

申请日：2011-10-29

Applicant: RITEDIA CORPORATION ,  SUNG, Chien-Min ,  KAN, Ming, Chi ,  HU, Shao, Chung

Inventor： SUNG, Chien-Min ,  KAN, Ming, Chi ,  HU, Shao, Chung

IPC: H01L33/64 ,  H01L21/205

CPC classification number: H01L33/12 ,  H01L21/6835 ,  H01L23/373 ,  H01L23/3732 ,  H01L23/3735 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L33/46 ,  H01L33/641 ,  H01L2221/68363 ,  H01L2224/0345 ,  H01L2224/04026 ,  H01L2224/05139 ,  H01L2224/05638 ,  H01L2224/05649 ,  H01L2224/05666 ,  H01L2224/0567 ,  H01L2224/05671 ,  H01L2224/0568 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/05687 ,  H01L2224/27444 ,  H01L2224/2745 ,  H01L2224/27452 ,  H01L2224/2908 ,  H01L2224/29163 ,  H01L2224/29166 ,  H01L2224/29187 ,  H01L2224/29193 ,  H01L2224/32245 ,  H01L2224/83005 ,  H01L2924/01029 ,  H01L2924/12041 ,  H01L2924/045 ,  H01L2924/01006 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/3512 ,  H01L2924/00

Abstract: Stress regulated semiconductor devices and associated methods are provided. In one aspect, for example, a stress regulated semiconductor device can include a semiconductor layer, a stress regulating interface layer including a carbon layer formed on the semiconductor layer, and a heat spreader coupled to the carbon layer opposite the semiconductor layer. The stress regulating interface layer is operable to reduce the coefficient of thermal expansion difference between the semiconductor layer and the heat spreader to less than or equal to about 10 ppm/°C.

Abstract translation: 提供了受压调节的半导体器件和相关方法。 在一个方面，例如，应力调节半导体器件可以包括半导体层，包括形成在半导体层上的碳层的应力调节界面层和耦合到与半导体层相对的碳层的散热器。 应力调节界面层是可操作的，以将半导体层和散热器之间的热膨胀系数差减小到或等于约10ppm /℃。

公开(公告)号：WO2011094303A2

公开(公告)日：2011-08-04

申请号：PCT/US2011/022567

申请日：2011-01-26

Applicant: SUNG, Chien-Min ,  HU, Shao, Chung ,  TENG, Chien-Chung ,  YANG, Shang-Ray ,  SUNG, Michael

Inventor： SUNG, Chien-Min ,  HU, Shao, Chung ,  TENG, Chien-Chung ,  YANG, Shang-Ray ,  SUNG, Michael

IPC: H05K7/20 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0373 ,  H05K1/0203 ,  H05K1/0366 ,  H05K1/056 ,  H05K2201/0209 ,  H05K2201/10106 ,  Y10T428/2481 ,  Y10T428/24893

Abstract: Electrically insulating layers having increased thermal conductivity, as well as associated devices and methods are disclosed. In one aspect, for example, a printed circuit board is provided including a substrate and an electrically insulating layer coated on at least one surface of the substrate, the electrically insulating layer including a plurality of hBN particles bound in a binder material.

Abstract translation: 公开了具有增加的导热性的电绝缘层以及相关的装置和方法。 一方面，例如，提供印刷电路板，其包括基板和涂覆在基板的至少一个表面上的电绝缘层，电绝缘层包括以粘合剂材料结合的多个hBN颗粒。

公开(公告)号：WO2012058656A3

公开(公告)日：2012-07-19

申请号：PCT/US2011058487

申请日：2011-10-29

Applicant: RITEDIA CORP ,  SUNG CHIEN-MIN ,  KAN MING CHI ,  HU SHAO CHUNG

Inventor： SUNG CHIEN-MIN ,  KAN MING CHI ,  HU SHAO CHUNG

IPC: H01L33/64 ,  H01L21/205

CPC classification number: H01L33/12 ,  H01L21/6835 ,  H01L23/373 ,  H01L23/3732 ,  H01L23/3735 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L33/46 ,  H01L33/641 ,  H01L2221/68363 ,  H01L2224/0345 ,  H01L2224/04026 ,  H01L2224/05139 ,  H01L2224/05638 ,  H01L2224/05649 ,  H01L2224/05666 ,  H01L2224/0567 ,  H01L2224/05671 ,  H01L2224/0568 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/05687 ,  H01L2224/27444 ,  H01L2224/2745 ,  H01L2224/27452 ,  H01L2224/2908 ,  H01L2224/29163 ,  H01L2224/29166 ,  H01L2224/29187 ,  H01L2224/29193 ,  H01L2224/32245 ,  H01L2224/83005 ,  H01L2924/01029 ,  H01L2924/12041 ,  H01L2924/045 ,  H01L2924/01006 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/3512 ,  H01L2924/00

Abstract: Stress regulated semiconductor devices and associated methods are provided. In one aspect, for example, a stress regulated semiconductor device can include a semiconductor layer, a stress regulating interface layer including a carbon layer formed on the semiconductor layer, and a heat spreader coupled to the carbon layer opposite the semiconductor layer. The stress regulating interface layer is operable to reduce the coefficient of thermal expansion difference between the semiconductor layer and the heat spreader to less than or equal to about 10 ppm/°C.

Abstract translation: 提供了应力调节的半导体器件和相关方法。 在一个方面，例如，应力调节半导体器件可以包括半导体层，包括形成在半导体层上的碳层的应力调节界面层，以及耦合到与半导体层相对的碳层的散热器。 应力调节界面层可操作以将半导体层和散热器之间的热膨胀差异系数降低至小于或等于约10ppm /℃。

公开(公告)号：WO2011094303A3

公开(公告)日：2012-01-19

申请号：PCT/US2011022567

申请日：2011-01-26

Applicant: SUNG CHIEN-MIN ,  HU SHAO CHUNG ,  TENG CHIEN-CHUNG ,  YANG SHANG-RAY ,  SUNG MICHAEL

Inventor： SUNG CHIEN-MIN ,  HU SHAO CHUNG ,  TENG CHIEN-CHUNG ,  YANG SHANG-RAY ,  SUNG MICHAEL

IPC: H05K7/20 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0373 ,  H05K1/0203 ,  H05K1/0366 ,  H05K1/056 ,  H05K2201/0209 ,  H05K2201/10106 ,  Y10T428/2481 ,  Y10T428/24893

Abstract: Electrically insulating layers having increased thermal conductivity, as well as associated devices and methods are disclosed. In one aspect, for example, a printed circuit board is provided including a substrate and an electrically insulating layer coated on at least one surface of the substrate, the electrically insulating layer including a plurality of hBN particles bound in a binder material.

Abstract translation: 公开了具有增加的导热性的电绝缘层以及相关的装置和方法。 一方面，例如，提供印刷电路板，其包括基板和涂覆在基板的至少一个表面上的电绝缘层，电绝缘层包括以粘合剂材料结合的多个hBN颗粒。

公开(公告)号：WO2008051187A1

公开(公告)日：2008-05-02

申请号：PCT/US2006/031554

申请日：2006-08-11

Applicant: KINIK COMPANY ,  SUNG, Chien-Min ,  KAN, Ming-Chi ,  HU, Shao, Chung

Inventor： SUNG, Chien-Min ,  KAN, Ming-Chi ,  HU, Shao, Chung

IPC: H05K7/20

CPC classification number: H05K3/28 ,  H05K1/0209 ,  H05K7/20427 ,  H05K7/205 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0323

Abstract: Methods and devices for cooling printed circuit boards having at least one heat source are disclosed and described. The method can include coating a layer of diamond-like carbon (DLC) over at least a portion of the printed circuit board in order to accelerate movement of heat away from the heat source. Various heat sources may be present on a printed circuit board, hi one aspect, the heat source can be an active heat source such as a heat- generating electronic component.

Abstract translation: 公开并描述了用于冷却具有至少一个热源的印刷电路板的方法和装置。 该方法可以包括在印刷电路板的至少一部分上涂覆类金刚石碳（DLC）层，以加速远离热源的热运动。 各种热源可能存在于印刷电路板上。一方面，热源可以是诸如发热电子部件的活性热源。