公开(公告)号：WO2006092200A1

公开(公告)日：2006-09-08

申请号：PCT/EP2006/001160

申请日：2006-02-09

Applicant: EPCOS AG ,  HAMMEDINGER, Robert ,  KASTNER, Konrad ,  MAIER, Martin ,  OBESSER, Michael

Inventor： HAMMEDINGER, Robert ,  KASTNER, Konrad ,  MAIER, Martin ,  OBESSER, Michael

IPC: H01L23/485

CPC classification number: H05K1/111 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05559 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K3/244 ,  H05K2201/0373 ,  Y02P70/611 ,  Y10T29/49149 ,  H01L2924/00

Abstract: Es wird ein lötfähiger Kontakt für ein elektrisches Bauelement vorgeschlagen, der eine Pad-Metallisierung und eine darüber aufgebrachte UBM-Metallisierung umfasst, und bei dem die Stabilität der Metallisierung durch eine Strukturierung der Pad-Metallisierung im Bereich der UBM-Metallisierung verbessert ist. Die Strukturierung kann ein Streifenmuster umfassen, zwischen denen die UBM-Metallisierung in Kontakt mit der Substratoberfläche treten kann.

Abstract translation: 提出了一种用于电气部件的可焊接的接触，包括焊盘金属化和上覆的施加UBM金属化，并且其中所述金属化的稳定性是通过在UBM金属化的区域构成所述垫金属化提高。 图案化可以包括条纹图案，该UBM金属化之间能够与基板表面相接触。

公开(公告)号：WO2008142081A9

公开(公告)日：2009-04-23

申请号：PCT/EP2008056200

申请日：2008-05-20

Applicant: EPCOS AG ,  MAIER MARTIN ,  OBESSER MICHAEL ,  KASTNER KONRAD ,  PORTMANN JUERGEN ,  BAUERNSCHMITT ULRICH

Inventor： MAIER MARTIN ,  OBESSER MICHAEL ,  KASTNER KONRAD ,  PORTMANN JUERGEN ,  BAUERNSCHMITT ULRICH

IPC: H01L23/485

CPC classification number: H01L24/05 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/0236 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2924/01005 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention relates to a component with multi-layered connection surfaces that can be soldered or bonded to a substrate (SU). Said component has, in addition to the electrically conductive pad metallisation (PM) and the UBM-metallisation (UBM), an electrically conductive stress compensation layer (SK) that is arranged between the substrate and pad-metallisation or between the pad-metallisation and the UBM-metallisation. The stress insensitivity of the connection metallisation is obtained by a stress compensation layer, the E-module thereof being lower than that of the UBM-metallisation.

Abstract translation: 它提出了一种基底（SU），在具有多层可焊接或粘合的衬垫的装置，其除了所述导电焊盘金属（PM）和UBM金属化（UBM）另外的导电应力补偿层（SK），则 在衬底和焊盘金属化之间或焊盘金属化和UBM金属化之间布置。 端子金属化的应力不敏感性通过其E模块低于UBM金属化的应力补偿层来实现。

公开(公告)号：WO2008142081A3

公开(公告)日：2009-03-05

申请号：PCT/EP2008056200

申请日：2008-05-20

Applicant: EPCOS AG ,  MAIER MARTIN ,  OBESSER MICHAEL ,  KASTNER KONRAD ,  PORTMANN JUERGEN ,  BAUERNSCHMITT ULRICH

Inventor： MAIER MARTIN ,  OBESSER MICHAEL ,  KASTNER KONRAD ,  PORTMANN JUERGEN ,  BAUERNSCHMITT ULRICH

IPC: H01L23/485

CPC classification number: H01L24/05 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/0236 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2924/01005 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention relates to a component with multi-layered connection surfaces that can be soldered or bonded to a substrate (SU). Said component has, in addition to the electrically conductive pad metallisation (PM) and the UBM-metallisation (UBM), an electrically conductive stress compensation layer (SK) that is arranged between the substrate and pad-metallisation or between the pad-metallisation and the UBM-metallisation. The stress insensitivity of the connection metallisation is obtained by a stress compensation layer, the E-module thereof being lower than that of the UBM-metallisation.

Abstract translation: 它提出了一种基底（SU），在具有多层可焊接或粘合的衬垫的装置，其除了所述导电焊盘金属（PM）和UBM金属化（UBM）另外的导电应力补偿层（SK），则 设置在基板和焊盘金属之间或焊盘金属化和UBM之间的金属化。 连接金属化的应力不敏感由应力补偿层，其模量比UBM金属化下实现的。

公开(公告)号：WO1989009496A1

公开(公告)日：1989-10-05

申请号：PCT/DE1989000155

申请日：1989-03-10

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  PÖTZLBERGER, Hans, Werner ,  KASTNER, Konrad ,  HÖSSELBARTH, Brigitta

Inventor： SIEMENS AKTIENGESELLSCHAFT

IPC: H01L49/02

CPC classification number: H05B3/148 ,  B41J2/14129 ,  H01C7/006 ,  H01C17/12 ,  H01L49/02

Abstract: A new type of electrically resistive material for thin-layer thermotransducers, in particular for printing heads of thermal printers, is produced by cathodic sputtering of suitable targets, and consists of four or five components including at least two elements chosen from the transition materials of sub-groups four to six and at least two nonmetallic elements of main groups three to five. The layers so obtained possess high resistance, long-term stability and good controllability and reproducibility during manufacture, and are therefore particularly suitable for use in thermal printers.

公开(公告)号：WO2008142081A2

公开(公告)日：2008-11-27

申请号：PCT/EP2008/056200

申请日：2008-05-20

Applicant: EPCOS AG ,  MAIER, Martin ,  OBESSER, Michael ,  KASTNER, Konrad ,  PORTMANN, Jürgen ,  BAUERNSCHMITT, Ulrich

Inventor： MAIER, Martin ,  OBESSER, Michael ,  KASTNER, Konrad ,  PORTMANN, Jürgen ,  BAUERNSCHMITT, Ulrich

IPC: H01L23/485

CPC classification number: H01L24/05 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/0236 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2924/01005 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Es wird ein Bauelement mit mehrschichtiger löt- oder bondbarer Anschlussfläche auf einem Substrat vorgeschlagen, welches neben der elektrisch leitfähigen Pad-Metallisierung und der UBM-Metallisierung zusätzlich noch eine elektrisch leitfähige Stresskompensationsschicht aufweist, die zwischen Substrat und Pad-Metallisierung oder zwischen Pad-Metallisierung und UBM-Metallisierung angeordnet ist. Die Stressunempfindlichkeit der Anschlussmetallisierung wird über eine Stresskompensationsschicht erreicht, deren E-Module niedriger als dasjenige der UBM-Metallisierung ist.

Abstract translation: 它提出了一种基板上，具有多层可焊接或粘合的连接面，其仍具有邻近所述导电焊盘金属化和UBM金属化此外，衬底焊盘金属化或焊盘金属化和之间的导电应力补偿层的装置 UBM金属化布置。 连接金属化的应力不敏感由应力补偿层，其模量比UBM金属化下实现的。