公开(公告)号：WO2010030459A2

公开(公告)日：2010-03-18

申请号：PCT/US2009/053350

申请日：2009-08-11

Applicant: ANALOG DEVICES, INC. ,  MARTIN, John, R. ,  TSAU, Christine, H. ,  FREY, Timothy, J.

Inventor： MARTIN, John, R. ,  TSAU, Christine, H. ,  FREY, Timothy, J.

IPC: B81C1/00

CPC classification number: H01L23/10 ,  B81C1/00269 ,  B81C2203/0118 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

Abstract: A microchip has a bonding material that bonds a first substrate to a second substrate. The bonding material has, among other things, a rare earth metal and other material.

Abstract translation: 微芯片具有将第一衬底结合到第二衬底的结合材料。 除此之外，粘结材料还包括稀土金属和其他材料。

公开(公告)号：WO2007022179A2

公开(公告)日：2007-02-22

申请号：PCT/US2006/031825

申请日：2006-08-16

Applicant: ANALOG DEVICES, INC. ,  HARNEY, Kieran, P. ,  MARTIN, John, R. ,  FELTON, Lawrence, E.

Inventor： HARNEY, Kieran, P. ,  MARTIN, John, R. ,  FELTON, Lawrence, E.

IPC: B81B7/00

CPC classification number: B81B7/007 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A package for a micro-electromechanical (MEMS) device is described. A premolded leadframe base has opposing top and bottom surfaces. Each surface is defined by a topology having at least one electrically conductive portion and at least one electrically non-conductive portion, and the topology of the top surface differs from the topology of the bottom surface.

Abstract translation: 描述了用于微机电（MEMS）器件的封装。 预成型的引线框架底座具有相对的顶部和底部表面。 每个表面由具有至少一个导电部分和至少一个不导电部分的拓扑结构限定，并且顶表面的拓扑结构不同于底表面的拓扑结构。

公开(公告)号：WO2005078458A1

公开(公告)日：2005-08-25

申请号：PCT/US2005/001729

申请日：2005-01-20

Applicant: ANALOG DEVICES, INC. ,  CHAU, Kevin, H.-L. ,  FELTON, Lawrence, E. ,  GEEN, John, A. ,  JUDY, Michael, W. ,  MARTIN, John, R.

Inventor： CHAU, Kevin, H.-L. ,  FELTON, Lawrence, E. ,  GEEN, John, A. ,  JUDY, Michael, W. ,  MARTIN, John, R.

IPC: G01P15/12

CPC classification number: B81B7/0041 ,  B81B2201/0235 ,  B81C2203/0109 ,  B81C2203/0136 ,  B81C2203/019 ,  G01K1/08 ,  G01P1/023 ,  G01P15/008 ,  G01P15/0802

Abstract: A sensor element is capped by bonding or otherwise forming a cap on a sensor element. The sensor may be hermetically sealed by using a hermetic cap and hermetic bonding material or by applying a hermetic coating. The sensor may be filled with a gas at an elevated pressure. The sensor may alternatively or additionally be filled with a special gas, such as a gas having a density-to-viscosity ratio above approximately 0.2.

Abstract translation: 传感器元件通过在传感器元件上接合或以其他方式形成盖而被盖住。 传感器可以通过使用密封盖和密封接合材料或通过施加气密涂层而气密密封。 传感器可以在升高的压力下填充气体。 传感器可以替代地或另外填充特殊气体，例如密度 - 粘度比高于约0.2的气体。

公开(公告)号：WO2010030460A2

公开(公告)日：2010-03-18

申请号：PCT/US2009/053360

申请日：2009-08-11

Applicant: ANALOG DEVICES, INC. ,  MARTIN, John, R. ,  FREY, Timothy, J. ,  TSAU, Christine, H.

Inventor： MARTIN, John, R. ,  FREY, Timothy, J. ,  TSAU, Christine, H.

IPC: B81C1/00

CPC classification number: H01L23/10 ,  B81C1/00269 ,  B81C2203/0118 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

Abstract: A method of forming an inertial sensor provides 1) a device wafer with a two-dimensional array of inertial sensors and 2) a second wafer, and deposits an alloy of aluminum/ germanium onto one or both of the wafers. The alloy is deposited and patterned to form a plurality of closed loops. The method then aligns the device wafer and the second wafer, and then positions the alloy between the wafers. Next, the method melts the alloy, and then solidifies the alloy to form a plurality of conductive hermetic seal rings about the plurality of the inertial sensors. The seal rings bond the device wafer to the second wafer. Finally, the method dices the wafers to form a plurality of individual, hermetically sealed inertial sensors.

Abstract translation: 一种形成惯性传感器的方法提供1）具有惯性传感器的二维阵列的器件晶片和2）第二晶片，并且将铝/锗的合金沉积到一个或两个 晶圆。 该合金被沉积并被图案化以形成多个闭环。 然后该方法对齐器件晶片和第二晶片，然后将合金放置在晶片之间。 接下来，该方法熔化合金，然后固化合金以围绕多个惯性传感器形成多个导电气密密封环。 密封环将器件晶片结合到第二晶片。 最后，该方法将晶圆切成多个单独的密封惯性传感器。

公开(公告)号：WO2007081504A1

公开(公告)日：2007-07-19

申请号：PCT/US2006/048420

申请日：2006-12-19

Applicant: ANALOG DEVICES, INC. ,  WEIGOLD, Jason, W. ,  MARTIN, John, R. ,  BROSNIHAN, Timothy, J.

Inventor： WEIGOLD, Jason, W. ,  MARTIN, John, R. ,  BROSNIHAN, Timothy, J.

IPC: H04R19/00

CPC classification number: H04R19/005 ,  B81B2201/0257 ,  B81C1/00246 ,  B81C2203/0728 ,  H04R1/04 ,  H04R19/04 ,  H04R31/006

Abstract: A method of forming a microphone having a variable capacitance first deposits high temperature deposition material on a die. The high temperature material ultimately forms structure that contributes to the variable capacitance. The method then forms circuitry on the die after depositing the deposition material. The circuitry is configured to detect the variable capacitance.

Abstract translation: 形成具有可变电容的麦克风的方法首先将高温沉积材料沉积在模具上。 高温材料最终形成有助于可变电容的结构。 该方法然后在沉积沉积材料之后在管芯上形成电路。 电路被配置为检测可变电容。

公开(公告)号：WO2007022249A3

公开(公告)日：2007-05-18

申请号：PCT/US2006031958

申请日：2006-08-16

Applicant: ANALOG DEVICES INC ,  HARNEY KIERAN P ,  MARTIN JOHN R ,  FELTON LAWRENCE E

Inventor： HARNEY KIERAN P ,  MARTIN JOHN R ,  FELTON LAWRENCE E

IPC: B81B7/00

CPC classification number: B81B7/0064 ,  B81B2201/0257 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An apparatus has a leadframe based package base having a leadframe and a lid coupled with the package base. The lid and package base form a chamber for at least partially containing a microphone. The lid is electrically coupled with a given portion of the leadframe in the package base.

Abstract translation: 一种装置具有基于引线框架的封装基座，其具有引线框架和与封装基座耦合的盖子。 盖子和包装底座形成用于至少部分地容纳麦克风的腔室。 盖子与封装基座中的引线框架的给定部分电耦合。

公开(公告)号：WO2007022179A3

公开(公告)日：2007-05-18

申请号：PCT/US2006031825

申请日：2006-08-16

Applicant: ANALOG DEVICES INC ,  HARNEY KIERAN P ,  MARTIN JOHN R ,  FELTON LAWRENCE E

Inventor： HARNEY KIERAN P ,  MARTIN JOHN R ,  FELTON LAWRENCE E

IPC: B81B7/00

CPC classification number: B81B7/007 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A package for a micro-electromechanical (MEMS) device is described. A premolded leadframe base has opposing top and bottom surfaces. Each surface is defined by a topology having at least one electrically conductive portion and at least one electrically non-conductive portion, and the topology of the top surface differs from the topology of the bottom surface.

Abstract translation: 描述了用于微机电（MEMS）装置的封装。 预制的引线框架底座具有相对的顶部和底部表面。 每个表面由具有至少一个导电部分和至少一个非导电部分的拓扑结构限定，并且顶表面的拓扑与底表面的拓扑不同。

公开(公告)号：WO2006116017A2

公开(公告)日：2006-11-02

申请号：PCT/US2006014982

申请日：2006-04-21

Applicant: ANALOG DEVICES INC ,  MARTIN JOHN R ,  BROSNIHAN TIMOTHY J ,  CORE CRAIG ,  NUNAN THOMAS ,  WEIGOLD JASON ,  ZHANG XIN

Inventor： MARTIN JOHN R ,  BROSNIHAN TIMOTHY J ,  CORE CRAIG ,  NUNAN THOMAS ,  WEIGOLD JASON ,  ZHANG XIN

IPC: H04R19/00

CPC classification number: H04R3/00 ,  B81B2201/0235 ,  B81B2201/0257 ,  B81C1/00182 ,  H01L2224/48137 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/15151 ,  H04R19/005 ,  H04R2499/11

Abstract: A micromachined microphone is formed from a silicon or silicon-on- insulator (SOI) wafer. A fixed sensing electrode for the microphone is formed from a top silicon layer of the wafer. Various polysilicon microphone structures are formed above a front side of the top silicon layer by depositing at least one oxide layer, forming the structures, and then removing a portion of the oxide underlying the structures from a back side of the top silicon layer through trenches formed through the top silicon layer. The trenches allow sound waves to reach the diaphragm from the back side of the top silicon layer. In an SOI wafer, a cavity is formed through a bottom silicon layer and an intermediate oxide layer to expose the trenches for both removing the oxide and allowing the sound waves to reach the diaphragm. An inertial sensor may be formed on the same wafer, with various inertial sensor structures formed at substantially the same time and using substantially the same processes as corresponding microphone structures.

Abstract translation: 微机械麦克风由硅或绝缘硅绝缘体（SOI）晶片形成。 用于麦克风的固定感测电极由晶片的顶部硅层形成。 通过沉积形成结构的至少一个氧化物层，然后通过形成的沟槽从顶部硅层的背面去除结构物下面的氧化物的一部分，形成在顶部硅层前侧上的各种多晶硅麦克风结构 通过顶层硅层。 沟槽允许声波从顶部硅层的背面到达隔膜。 在SOI晶片中，通过底部硅层和中间氧化物层形成空腔，以露出沟槽，以去除氧化物并允许声波到达隔膜。 惯性传感器可以形成在相同的晶片上，其中各种惯性传感器结构基本上在同一时间形成并且使用与对应的麦克风结构基本上相同的过程。

公开(公告)号：WO2006081500A1

公开(公告)日：2006-08-03

申请号：PCT/US2006/003095

申请日：2006-01-27

Applicant: THE LUBRIZOL CORPORATION ,  GEORGE, Herman, F. ,  BURRINGTON, James, D. ,  PUDELSKI, John, K. ,  ROSKI, James, P. ,  MARTIN, John, R. ,  INEMAN, Jennifer, M. ,  GARVIN, Gary, A. ,  VAN LIER, Frank, M. ,  MCCAUGHEY, David, A.

Inventor： GEORGE, Herman, F. ,  BURRINGTON, James, D. ,  PUDELSKI, John, K. ,  ROSKI, James, P. ,  MARTIN, John, R. ,  INEMAN, Jennifer, M. ,  GARVIN, Gary, A. ,  VAN LIER, Frank, M. ,  MCCAUGHEY, David, A.

IPC: C10M163/00 ,  C10M169/00 ,  C10M177/00 ,  C10M175/00

CPC classification number: C10M175/0091 ,  C10M163/00 ,  C10M165/00 ,  C10M177/00 ,  C10M2207/026 ,  C10M2207/34 ,  C10M2215/064 ,  C10M2215/28 ,  C10M2215/285 ,  C10M2219/046 ,  C10M2219/0463 ,  C10M2219/068 ,  C10M2229/02 ,  C10N2210/02 ,  C10N2210/06 ,  C10N2240/10 ,  C10N2250/10

Abstract: In accordance with the present invention, it has been discovered that additive gels can provide additives to a functional fluid over time. In accordance with the present invention it has been discovered that an additive gel comprising i.) at least two additives selected from the group comprising detergents, dispersants, acids, bases, over based detergent, succinated polyolefins or mixtures thereof wherein the selected additives when combined form a gel; ii.) optionally at least one additive comprising viscosity modifier(s), friction modifier(s), detergent(s), cloud point depressant(s), pour point depressant(s), demulsifier(s), flow improver(s), anti static agent(s), dispersant(s), antioxidant(s), antifoam(s), corrosion/rust inhibitor(s), extreme pressure/antiwear agent(s), seal swell agent(s), lubricity aid(s), antimisting agent(s), and mixtures thereof; resulting in a controlled release gel that over time releases at least one desired additive into a functional fluid when the gel is contacted with the functional fluid.

Abstract translation: 根据本发明，已经发现添加剂凝胶可随时间向功能流体提供添加剂。 根据本发明，已经发现添加剂凝胶包含i）至少两种选自包括洗涤剂，分散剂，酸，碱，过基洗涤剂，琥珀酰化聚烯烃或其混合物的添加剂的添加剂，其中组合时所选择的添加剂 形成凝胶; ii。）任选的至少一种添加剂，其包含粘度调节剂，摩擦改进剂，去污剂，浊点抑制剂，倾点下降剂，破乳剂，流动改进剂， ，抗静电剂，分散剂，抗氧化剂，消泡剂，腐蚀/防锈剂，极压/抗磨剂，密封溶胀剂，润滑助剂（一种或多种） s），防雾剂及其混合物; 导致控制释放凝胶，当凝胶与功能流体接触时，随着时间的推移将至少一种所需的添加剂释放到功能流体中。

公开(公告)号：WO2005019785A2

公开(公告)日：2005-03-03

申请号：PCT/US2004025825

申请日：2004-08-10

Applicant: ANALOG DEVICES INC ,  O'DOWD JOHN ,  MCCARTNEY DAMIEN JOSEPH ,  HUNT WILLIAM ,  HYNES EAMON ,  WYNNE JOHN M ,  CROWLEY PATRICK ,  MARTIN JOHN R

Inventor： O'DOWD JOHN ,  MCCARTNEY DAMIEN JOSEPH ,  HUNT WILLIAM ,  HYNES EAMON ,  WYNNE JOHN M ,  CROWLEY PATRICK ,  MARTIN JOHN R

IPC: G01L20060101 ,  G01L9/00 ,  G01L9/12 ,  G01L13/02 ,  G01L

CPC classification number: G01L9/0072 ,  G01L9/0073 ,  G01L9/0075 ,  G01L13/025 ,  G01L19/0076 ,  H01L2224/48091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A capacitive sensor including a housing having a hermetically sealed cavity, a plate in the cavity, a diaphragm forming a part of the cavity and spaced from the plate, a conductive layer on the first diaphragm, and a second conductive layer on the plate, the first and second conductive layers being the electrodes of a capacitor whose capacitance varies with the position of the diaphragm relative to the plate.

Abstract translation: 一种电容式传感器，包括具有密封空腔的壳体，腔体中的板，形成腔的一部分并与板隔开的膜片，第一膜片上的导电层和板上的第二导电层， 第一和第二导电层是电容器的电极，其电容随着隔膜相对于板的位置而变化。