公开(公告)号：WO2005065207A3

公开(公告)日：2006-05-11

申请号：PCT/US2004042415

申请日：2004-12-16

Applicant: TESSERA INC ,  HABA BELGACEM ,  BEROZ MASUD ,  GREEN RONALD ,  MOHAMED ILYAS ,  WILSON STUART E ,  ZOHNI WAEL ,  KUBOTA YOICHI ,  THOMPSON JESSE BURL

Inventor： HABA BELGACEM ,  BEROZ MASUD ,  GREEN RONALD ,  MOHAMED ILYAS ,  WILSON STUART E ,  ZOHNI WAEL ,  KUBOTA YOICHI ,  THOMPSON JESSE BURL

IPC: H01L21/44 ,  H01L21/66 ,  H01L23/58

CPC classification number: H01L23/49811 ,  G01R1/06744 ,  G01R1/0735 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13187 ,  H01L2224/13188 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A microelectronic package includes a microelectronic element (80) having faces and contacts (83) and a flexible substrate (90) spaced from and overlying a first face (84) of the microelectronic element (82). The package (80) also includes a plurality of conductive posts (98) extending from the flexible substrate (90) and projecting away from the first face (84) of the microelectronic element (82), wherein at least some of the conductive posts (98) are electrically interconnected with the microelectronic element (82), and a plurality of support elements (88) supporting the flexible substrate (90) over the microelectronic element (82). The conductive posts (98) are offset from the support elements (82) to facilitate flexure of the substrate (90) and movement of the posts (98) relative to the microelectronic element (82).

Abstract translation: 微电子封装包括具有面和触点（83）的微电子元件（80）和与微电子元件（82）的第一面（84）间隔开并且覆盖其上的柔性基板（90）。 包装（80）还包括从柔性基板（90）延伸并远离微电子元件（82）的第一面（84）突出的多个导电柱（98），其中至少一些导电柱（ 98）与微电子元件（82）电互连，以及支撑微电子元件（82）上的柔性基板（90）的多个支撑元件（88）。 导电柱（98）从支撑元件（82）偏移，以便于衬底（90）的挠曲和柱（98）相对于微电子元件（82）的移动。

公开(公告)号：WO2005065207A2

公开(公告)日：2005-07-21

申请号：PCT/US2004/042415

申请日：2004-12-16

Applicant: TESSERA, INC. ,  HABA, Belgacem ,  BEROZ, Masud ,  GREEN, Ronald ,  MOHAMED, Ilyas ,  WILSON, Stuart, E. ,  ZOHNI, Wael ,  KUBOTA, Yoichi ,  THOMPSON, Jesse, Burl

Inventor： HABA, Belgacem ,  BEROZ, Masud ,  GREEN, Ronald ,  MOHAMED, Ilyas ,  WILSON, Stuart, E. ,  ZOHNI, Wael ,  KUBOTA, Yoichi ,  THOMPSON, Jesse, Burl

IPC: H01L21/44

CPC classification number: H01L23/49811 ,  G01R1/06744 ,  G01R1/0735 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13187 ,  H01L2224/13188 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/17 ,  H01L2224/1703 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A microelectronic package includes a microelectronic element (80) having faces and contacts (83) and a flexible substrate (90) spaced from and overlying a first face (84) of the microelectronic element (82). The package (80) also includes a plurality of conductive posts (98) extending from the flexible substrate (90) and projecting away from the first face (84) of the microelectronic element (82), wherein at least some of the conductive posts (98) are electrically interconnected with the microelectronic element (82), and a plurality of support elements (88) supporting the flexible substrate (90) over the microelectronic element (82). The conductive posts (98) are offset from the support elements (82) to facilitate flexure of the substrate (90) and movement of the posts (98) relative to the microelectronic element (82).

Abstract translation: 微电子封装包括具有面和触点（83）的微电子元件（80）和与微电子元件（82）的第一面（84）间隔开并且覆盖其上的柔性基板（90）。 包装（80）还包括从柔性基板（90）延伸并远离微电子元件（82）的第一面（84）突出的多个导电柱（98），其中至少一些导电柱（ 98）与微电子元件（82）电互连，以及支撑微电子元件（82）上的柔性基板（90）的多个支撑元件（88）。 导电柱（98）从支撑元件（82）偏移，以便于衬底（90）的挠曲和柱（98）相对于微电子元件（82）的移动。