公开(公告)号：WO2007076099A3

公开(公告)日：2007-07-05

申请号：PCT/US2006/049202

申请日：2006-12-26

Applicant: TESSERA, INC. ,  HABA, Belgacem ,  MOHAMMED, Ilyas ,  MITCHELL, Craig, S. ,  WARNER, Michael ,  THOMPSON, Jesse, Burl

Inventor： HABA, Belgacem ,  MOHAMMED, Ilyas ,  MITCHELL, Craig, S. ,  WARNER, Michael ,  THOMPSON, Jesse, Burl

IPC: H01L21/60

Abstract: A dielectric structure is formed by a molding process, so that a first surface (32, 432) of a dielectric structure is shaped by contact with the mold. The opposite second surface (34, 434) of the dielectric structure is applied onto the front surface of a wafer element (38, 438). The dielectric structure may include protruding bumps (30, 130, 230) and terminals (44, 144, 244) may be formed on the bumps. The bumps may be of a precise height. The terminals lie at a precisely controlled height above the front surface of the wafer element. The terminals may include projecting posts (213, 413) which extend above a surrounding solder mask layer (248, 448) to facilitate engagement with a test fixture. The posts are immersed within solder joints (274) when the structure is bonded to a circuit panel.

公开(公告)号：WO2005065207A3

公开(公告)日：2006-05-11

申请号：PCT/US2004042415

申请日：2004-12-16

Applicant: TESSERA INC ,  HABA BELGACEM ,  BEROZ MASUD ,  GREEN RONALD ,  MOHAMED ILYAS ,  WILSON STUART E ,  ZOHNI WAEL ,  KUBOTA YOICHI ,  THOMPSON JESSE BURL

Inventor： HABA BELGACEM ,  BEROZ MASUD ,  GREEN RONALD ,  MOHAMED ILYAS ,  WILSON STUART E ,  ZOHNI WAEL ,  KUBOTA YOICHI ,  THOMPSON JESSE BURL

IPC: H01L21/44 ,  H01L21/66 ,  H01L23/58

CPC classification number: H01L23/49811 ,  G01R1/06744 ,  G01R1/0735 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13187 ,  H01L2224/13188 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A microelectronic package includes a microelectronic element (80) having faces and contacts (83) and a flexible substrate (90) spaced from and overlying a first face (84) of the microelectronic element (82). The package (80) also includes a plurality of conductive posts (98) extending from the flexible substrate (90) and projecting away from the first face (84) of the microelectronic element (82), wherein at least some of the conductive posts (98) are electrically interconnected with the microelectronic element (82), and a plurality of support elements (88) supporting the flexible substrate (90) over the microelectronic element (82). The conductive posts (98) are offset from the support elements (82) to facilitate flexure of the substrate (90) and movement of the posts (98) relative to the microelectronic element (82).

Abstract translation: 微电子封装包括具有面和触点（83）的微电子元件（80）和与微电子元件（82）的第一面（84）间隔开并且覆盖其上的柔性基板（90）。 包装（80）还包括从柔性基板（90）延伸并远离微电子元件（82）的第一面（84）突出的多个导电柱（98），其中至少一些导电柱（ 98）与微电子元件（82）电互连，以及支撑微电子元件（82）上的柔性基板（90）的多个支撑元件（88）。 导电柱（98）从支撑元件（82）偏移，以便于衬底（90）的挠曲和柱（98）相对于微电子元件（82）的移动。

公开(公告)号：WO2005086532A2

公开(公告)日：2005-09-15

申请号：PCT/US2005/006565

申请日：2005-03-01

Applicant: TESSERA, INC. ,  HUMPSTON, Giles ,  OSBORN, Philip, R. ,  THOMPSON, Jesse, Burl ,  KUBOTA, Yoichi ,  TSENG, Chung-Chuan ,  BURTZLAFF, Robert ,  HABA, Belgacem ,  TUCKERMAN, David, B. ,  WARNER, Michael

Inventor： HUMPSTON, Giles ,  OSBORN, Philip, R. ,  THOMPSON, Jesse, Burl ,  KUBOTA, Yoichi ,  TSENG, Chung-Chuan ,  BURTZLAFF, Robert ,  HABA, Belgacem ,  TUCKERMAN, David, B. ,  WARNER, Michael

IPC: H04R19/00

CPC classification number: B81B7/0077 ,  B81B2201/0257 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10155 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/3025 ,  H04R19/005 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed to one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chop and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of the said device and from said device.

Abstract translation: 本文公开了封装芯片的各种实施例及其制造方法。 本文公开的一种这样的封装芯片包括具有前表面，与正面相对的后表面的芯片和在前表面和后表面之一上的器件，该器件可操作为声能和电磁能中的至少一个的换能器 并且所述芯片包括暴露于所述前表面和后表面中的一个的多个接合焊盘。 封装芯片包括具有介电元件和设置在电介质元件上的金属层的封装元件，封装元件具有面向斩波的内表面和背离芯片的外表面。 金属层包括暴露在内表面和外表面中的至少一个的多个触点，触点导电地连接到接合焊盘。 金属层还包括第一开口，用于沿着所述装置和所述装置中的至少一个的方向通过声能和电磁能中的至少一个。

公开(公告)号：WO2005086532A3

公开(公告)日：2006-01-26

申请号：PCT/US2005006565

申请日：2005-03-01

Applicant: TESSERA INC ,  HUMPSTON GILES ,  OSBORN PHILIP R ,  THOMPSON JESSE BURL ,  KUBOTA YOICHI ,  TSENG CHUNG-CHUAN ,  BURTZLAFF ROBERT ,  HABA BELGACEM ,  TUCKERMAN DAVID B ,  WARNER MICHAEL

Inventor： HUMPSTON GILES ,  OSBORN PHILIP R ,  THOMPSON JESSE BURL ,  KUBOTA YOICHI ,  TSENG CHUNG-CHUAN ,  BURTZLAFF ROBERT ,  HABA BELGACEM ,  TUCKERMAN DAVID B ,  WARNER MICHAEL

IPC: B81B7/00 ,  H01L23/495 ,  H04R19/00 ,  H04R19/04

CPC classification number: B81B7/0077 ,  B81B2201/0257 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10155 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/3025 ,  H04R19/005 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed to one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chop and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of the said device and from said device.

Abstract translation: 本文公开了封装芯片的各种实施例及其制造方法。 本文公开的一种这样的封装芯片包括具有前表面，与正面相对的后表面的芯片和在前表面和后表面中的一个处的器件，该器件可操作为声能和电磁能中的至少一个的换能器 并且所述芯片包括暴露于所述前表面和后表面中的一个的多个接合焊盘。 封装芯片包括具有介电元件和设置在电介质元件上的金属层的封装元件，封装元件具有面向斩波的内表面和背离芯片的外表面。 金属层包括暴露在内表面和外表面中的至少一个的多个触点，触点导电地连接到接合焊盘。 金属层还包括第一开口，用于沿着所述装置和所述装置中的至少一个的方向通过声能和电磁能中的至少一个。

公开(公告)号：WO2005065207A2

公开(公告)日：2005-07-21

申请号：PCT/US2004/042415

申请日：2004-12-16

Applicant: TESSERA, INC. ,  HABA, Belgacem ,  BEROZ, Masud ,  GREEN, Ronald ,  MOHAMED, Ilyas ,  WILSON, Stuart, E. ,  ZOHNI, Wael ,  KUBOTA, Yoichi ,  THOMPSON, Jesse, Burl

Inventor： HABA, Belgacem ,  BEROZ, Masud ,  GREEN, Ronald ,  MOHAMED, Ilyas ,  WILSON, Stuart, E. ,  ZOHNI, Wael ,  KUBOTA, Yoichi ,  THOMPSON, Jesse, Burl

IPC: H01L21/44

CPC classification number: H01L23/49811 ,  G01R1/06744 ,  G01R1/0735 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13187 ,  H01L2224/13188 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/17 ,  H01L2224/1703 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A microelectronic package includes a microelectronic element (80) having faces and contacts (83) and a flexible substrate (90) spaced from and overlying a first face (84) of the microelectronic element (82). The package (80) also includes a plurality of conductive posts (98) extending from the flexible substrate (90) and projecting away from the first face (84) of the microelectronic element (82), wherein at least some of the conductive posts (98) are electrically interconnected with the microelectronic element (82), and a plurality of support elements (88) supporting the flexible substrate (90) over the microelectronic element (82). The conductive posts (98) are offset from the support elements (82) to facilitate flexure of the substrate (90) and movement of the posts (98) relative to the microelectronic element (82).

Abstract translation: 微电子封装包括具有面和触点（83）的微电子元件（80）和与微电子元件（82）的第一面（84）间隔开并且覆盖其上的柔性基板（90）。 包装（80）还包括从柔性基板（90）延伸并远离微电子元件（82）的第一面（84）突出的多个导电柱（98），其中至少一些导电柱（ 98）与微电子元件（82）电互连，以及支撑微电子元件（82）上的柔性基板（90）的多个支撑元件（88）。 导电柱（98）从支撑元件（82）偏移，以便于衬底（90）的挠曲和柱（98）相对于微电子元件（82）的移动。

公开(公告)号：WO2007076099A2

公开(公告)日：2007-07-05

申请号：PCT/US2006049202

申请日：2006-12-26

Applicant: TESSERA INC ,  HABA BELGACEM ,  MOHAMMED ILYAS ,  MITCHELL CRAIG S ,  WARNER MICHAEL ,  THOMPSON JESSE BURL

Inventor： HABA BELGACEM ,  MOHAMMED ILYAS ,  MITCHELL CRAIG S ,  WARNER MICHAEL ,  THOMPSON JESSE BURL

CPC classification number: H01L21/6835 ,  H01L22/34 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/1601 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05099

Abstract: A dielectric structure is formed by a molding process, so that a first surface (32, 432) of a dielectric structure is shaped by contact with the mold. The opposite second surface (34, 434) of the dielectric structure is applied onto the front surface of a wafer element (38, 438). The dielectric structure may include protruding bumps (30, 130, 230) and terminals (44, 144, 244) may be formed on the bumps. The bumps may be of a precise height. The terminals lie at a precisely controlled height above the front surface of the wafer element. The terminals may include projecting posts (213, 413) which extend above a surrounding solder mask layer (248, 448) to facilitate engagement with a test fixture. The posts are immersed within solder joints (274) when the structure is bonded to a circuit panel.

Abstract translation: 介电结构通过模制工艺形成，使得介电结构的第一表面（32,432）通过与模具接触而成形。 介电结构的相对的第二表面（34,434）被施加到晶片元件（38,438）的前表面上。 电介质结构可以包括突起凸块（30,130,230），并且端子（44,144,244）可以形成在凸块上。 颠簸可能具有精确的高度。 端子位于晶片元件的前表面上方的精确控制高度处。 端子可以包括在周围的阻焊层（248,448）之上延伸的突出柱（213,413），以便于与测试夹具接合。 当结构粘合到电路板时，柱被浸入焊点（274）内。