公开(公告)号：WO2017040482A1

公开(公告)日：2017-03-09

申请号：PCT/US2016/049413

申请日：2016-08-30

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： FOO, Siang Sin ,  KOSUGI, Hiromitsu ,  NARAG, Alejandro Aldrin II A. ,  PALANISWAMY, Ravi

IPC: H05K1/02 ,  H05K1/18 ,  H01L23/00 ,  H01L33/48 ,  H05K3/32 ,  H05K3/34 ,  H05K1/11

CPC classification number: H05K1/0269 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L33/62 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/10175 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/26175 ,  H01L2224/2919 ,  H01L2224/81132 ,  H01L2224/81385 ,  H01L2224/83132 ,  H01L2224/83385 ,  H01L2224/85132 ,  H01L2224/85385 ,  H01L2924/00014 ,  H01L2924/12041 ,  H05K1/111 ,  H05K1/189 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/09745 ,  H05K2201/09918 ,  H05K2201/10106 ,  H01L2224/45099 ,  H01L2924/014

Abstract: A flexible multilayer construction (100) for mounting a light emitting semiconductor device (200) (LESD), includes a flexible dielectric substrate (110) having an LESD mounting region (120), first and second electrically conductive pads (130, 140) disposed in the LESD mounting region for electrically connecting to corresponding first and second electrically conductive terminals of an LESD (200) received in the LESD mounting region, and a first fiducial alignment mark (150) for an accurate placement of an LESD in the LESD mounting region. The first fiducial alignment mark is disposed within the LESD mounting region.

Abstract translation: 一种用于安装发光半导体器件（200）（LESD）的柔性多层结构（100），包括具有LESD安装区域（120）的柔性电介质基片（110），第一和第二导电焊盘（130,140） 在LESD安装区域中，用于电连接到接收在LESD安装区域中的LESD（200）的对应的第一和第二导电端子，以及用于在LESD安装区域中精确放置LESD的第一基准对准标记（150） 。 第一基准对准标记设置在LESD安装区域内。

公开(公告)号：WO2015191273A1

公开(公告)日：2015-12-17

申请号：PCT/US2015/032363

申请日：2015-05-26

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： PALANISWAMY, Ravi ,  NARAG, Alejandro Aldrin II Agcaoili ,  FOO, Siang Sin ,  KOSUGI, Hiromitsu

IPC: H05K1/03 ,  B32B15/08 ,  H05K1/18 ,  H05K3/28

CPC classification number: H01L33/62 ,  B32B7/12 ,  B32B15/08 ,  B32B27/281 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2307/202 ,  B32B2457/202 ,  H01L33/486 ,  H01L33/58 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066 ,  H05K1/0306 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/189 ,  H05K3/28 ,  H05K2201/0154 ,  H05K2201/017 ,  H05K2201/0179 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2201/10106

Abstract: Flexible LED assemblies (300) are described. More particularly, flexible LED (320) assemblies having flexible substrates (302) with conductive features (304, 306) positioned on or in the substrate, and layers of ceramic (310) positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

Abstract translation: 描述了柔性LED组件（300）。 更具体地，具有位于衬底上或衬底中的具有导电特征（304,306）的柔性衬底（302）的柔性LED（320）组件和位于衬底的暴露部分上以防止UV降解的陶瓷层（310） 以及制作这种组装的方法。