公开(公告)号：WO2019125593A1

公开(公告)日：2019-06-27

申请号：PCT/US2018/056892

申请日：2018-10-22

Applicant: AGILENT TECHNOLOGIES, INC.

Inventor： BAI, Qing ,  GEOVANOS, Ares ,  YIN, Hongfeng ,  WILBANKS, Thor, Miller

IPC: B01D29/39 ,  B01D15/26

CPC classification number: G01N30/603 ,  B01D15/22 ,  B01D29/01 ,  B01D29/56 ,  G01N2030/027

Abstract: A filter includes an inlet side, an outlet side, and a body. The body includes a first substrate that includes an array of inlet holes passing through the first substrate, and a second substrate that includes an array of outlet holes passing through the second substrate. The body further includes an intermediate region that includes a plurality of channels extending along a plane that is transverse or at an angle to a main axis of the filter. Each channel communicates directly or indirectly with at least one of the inlet holes and at least one of the outlet holes. The filter provides a plurality of fluid flow paths through the body from the inlet side to the outlet side.

公开(公告)号：WO2023009879A1

公开(公告)日：2023-02-02

申请号：PCT/US2022/038974

申请日：2022-07-30

Applicant: AGILENT TECHNOLOGIES, INC.

Inventor： DAVIES, John ,  COBB, Thomas ,  GEOVANOS, Ares ,  WILBANKS, Thor ,  BAI, Qing

IPC: C08J9/228 ,  C08L71/12 ,  C08G65/40 ,  B29C43/00 ,  G01N30/60 ,  G01N30/02

Abstract: The invention provides methods for making porous devices from substantially monodisperse populations of substantially spherical particles of polyarylketone polymers or of thio-analogues of such polymers, of selected sizes. The porous devices allow greater control of porosity than previously available porous devices. In some embodiments, the porous devices are frits, filters, membranes or monoliths.

公开(公告)号：WO2006049751A1

公开(公告)日：2006-05-11

申请号：PCT/US2005/034624

申请日：2005-09-28

Applicant: AGILENT TECHNOLOGIES, INC.

Inventor： NISHIMURA, Ken ,  BAI, Qing ,  VERHOEVEN, Tracy, Bell

IPC: H05K3/00 ,  H05K3/20 ,  H01L21/44 ,  H01L21/48 ,  H01L23/02 ,  H01L23/48 ,  H01L29/40

CPC classification number: H01L25/18 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: Apparatus, packaging, and methods of manufacture of an integrated circuit are provided. The integrated circuit includes a component of a first type fabricated on a first substrate containing a first material, and a component of a second type fabricated on a second substrate containing a second material. The first material has better compatibility than the second material with fabrication and/or performance of the component of the first type, while the second material has better compatibility than the first material with fabrication and/or performance of the component of the second type. Also described, is a method of making the above-mentioned integrated circuit, the method including, among other steps, the step of disposing the first and second substrates opposite one another, and the step of establishing an electrical connection between the components.

Abstract translation: 提供了集成电路的装置，封装和制造方法。 集成电路包括在包含第一材料的第一基板上制造的第一类型的部件和在包含第二材料的第二基板上制造的第二类型的部件。 第一种材料具有比具有第一类型的部件的制造和/或性能的第二材料更好的兼容性，而第二种材料具有比具有第二类型的部件的制造和/或执行的第一材料更好的兼容性。 还描述了制造上述集成电路的方法，该方法还包括将第一和第二基板相对设置的步骤以及在各部件之间建立电连接的步骤。

公开(公告)号：WO2006016958A1

公开(公告)日：2006-02-16

申请号：PCT/US2005/020793

申请日：2005-06-13

Applicant: AGILENT TECHNOLOGIES, INC.

Inventor： LARSON, John, D. III ,  BAI, Qing ,  MATTA, Farid ,  VERHOEVEN, Tracy

IPC: H01L29/82

CPC classification number: H03H9/105 ,  H03B5/326 ,  H03H3/02 ,  H03H9/0547 ,  H03H9/706

Abstract: A microfabricated device (15) has a first substrate (21), a second substrate, a film bulk acoustic resonator (FBAR) device (50), and a circuit (52). The second substrate is bonded to the first substrate to define a chamber (44). The FBAR device is located on a surface of the first substrate and inside the chamber. The circuit is located on a surface of the second substrate and inside the chamber. An electrical connection (27, 56, 59) connects the circuit and the FBAR device.

Abstract translation: 微加工装置（15）具有第一基板（21），第二基板，薄膜体声波谐振器（FBAR）装置（50）和电路（52）。 第二基板结合到第一基板以限定室（44）。 FBAR装置位于第一基板的表面和室内。 电路位于第二基板的表面和室内。 电气连接（27,56,59）连接电路和FBAR装置。

公开(公告)号：WO2005055311A2

公开(公告)日：2005-06-16

申请号：PCT/US2004/037562

申请日：2004-11-10

Applicant: AGILENT TECHNOLOGIES, INC. ,  BAI, Qing

Inventor： BAI, Qing

IPC: H01L21/50

CPC classification number: H01L24/81 ,  H01L21/50 ,  H01L23/10 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014

Abstract: A device comprises a first substrate (21), a second substrate (24) and a compliant element (27, 42). The compliant element is composed of a first, compliant material between the first substrate and the second substrate and has a side surface coated at least in part with a layer (33, 47) of a second material. The compliant element exhibits deformation consistent with the first substrate and a second side having been pressed together. In some embodiments, the second material is electrically conductive such that the compliant element provides a reliable electrical connection between the substrates. In other embodiments, the second material increases the hermeticity of the compliant element such that the compliant element provides a better hermetic seal between the substrates.

Abstract translation: 装置包括第一基板（21），第二基板（24）和顺应元件（27,42）。 柔性元件由第一基底和第二基底之间的第一柔顺材料构成，并且具有至少部分地涂覆有第二材料的层（33,47）的侧表面。 柔顺元件表现出与第一基板一致的变形，并且第二侧被压在一起。 在一些实施例中，第二材料是导电的，使得柔性元件在基板之间提供可靠的电连接。 在其它实施例中，第二材料增加柔顺元件的气密性，使得柔性元件在基底之间提供更好的气密密封。