公开(公告)号：WO2015066624A1

公开(公告)日：2015-05-07

申请号：PCT/US2014/063708

申请日：2014-11-03

Applicant: APPLIED MATERIALS, INC

Inventor： RICE, Michael Robert ,  MEYERS, Michael ,  MAZZOCCO, John J. ,  HRUZEK, Dean C. ,  KUCHAR, Michael ,  KOSHTI, Sushant S. ,  KANKANALA, Penchala N. ,  ENGLHARDT, Eric A.

IPC: H01L21/677 ,  H01L21/02

CPC classification number: H01L21/67196 ,  H01L21/67201 ,  H01L21/67742

Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.

Abstract translation: 描述了配置成在半导体器件制造期间使用的传送室。 传送室包括被配置为耦合到一个或多个衬底传送单元（例如，一个或多个装载锁或一个或多个传送单元）的第一宽度的至少一个第一侧，以及至少一个第二组侧 第二宽度不同于第一宽度，第二组侧面被配置为联接到一个或多个处理室。 传送室的总数为7个以上。 传送室内的传送可由单个机器人使用。 还描述了用于处理衬底的工艺工具和方法以及许多其它方面。

公开(公告)号：WO2013023092A2

公开(公告)日：2013-02-14

申请号：PCT/US2012/050196

申请日：2012-08-09

Applicant: APPLIED MATERIALS, INC ,  ENGLHARDT, Eric A. ,  GILJUM, Richard ,  HUDGENS, Jeffrey C. ,  KOGAN, Igor G. ,  RICE, Michael Robert ,  KOSHTI, Sushant S.

Inventor： ENGLHARDT, Eric A. ,  GILJUM, Richard ,  HUDGENS, Jeffrey C. ,  KOGAN, Igor G. ,  RICE, Michael Robert ,  KOSHTI, Sushant S.

IPC: H01L21/677 ,  B65G49/07 ,  B25J9/04 ,  H01L21/02

CPC classification number: H01L21/67184 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/67167 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/68742

Abstract: Substrate transport systems, apparatus, and methods are described. In one aspect, the systems are disclosed having vertically stacked transfer chamber bodies. In one embodiment, a common robot apparatus services process chambers or load lock chambers coupled to upper and lower transfer chamber bodies. In another embodiment, separate robot apparatus service the process chambers and/or load lock chambers coupled to upper and lower transfer chamber bodies, and an elevator apparatus transfers the substrates between the various elevations. Degassing apparatus are described, as are numerous other aspects.

Abstract translation: 描述了基板传送系统，设备和方法。 在一个方面，公开了具有垂直堆叠的传送室主体的系统。 在一个实施例中，常见的机器人设备服务于耦合到上部和下部传输室主体的处理室或负载锁定室。 在另一个实施例中，分离的机器人设备服务于联接至上部和下部传送室主体的处理室和/或负载锁定室，并且电梯设备在各种高度之间传送基板。 描述了脱气装置，以及许多其他方面。

公开(公告)号：WO2014025918A1

公开(公告)日：2014-02-13

申请号：PCT/US2013/054001

申请日：2013-08-07

Applicant: APPLIED MATERIALS, INC

Inventor： ENGLHARDT, Eric A. ,  SZUDARSKI, Steve ,  CORNELIUS, Andrew S. ,  PURI, Amitabh ,  RICE, Michael R. ,  HUDGENS, Jeffrey C. ,  SANSONI, Steven V. ,  DECOTTIGNIES, Robert Irwin ,  HRUZEK, Dean C. ,  IRWIN, Peter ,  MERRY, Nir

IPC: H01L21/02 ,  H01L21/677

CPC classification number: H01L21/67739 ,  H01L21/67161 ,  H01L21/67184

Abstract: In some embodiments, a linked processing tool system is provided that includes (1) a first processing tool having at least a first transfer chamber configured to couple to a plurality of processing chambers; (2) a second processing tool having at least a second transfer chamber configured to couple to a plurality of processing chambers; (3) a third transfer chamber coupled between the first and second processing tools and configured to transfer substrates between the first and second processing tools; and (4) a single sequencer that controls substrate transfer operations between the first processing tool, the second processing tool and the third transfer chamber of the linked processing tool system. Numerous other aspects are provided.

Abstract translation: 在一些实施例中，提供了一种链接的加工工具系统，其包括：（1）具有至少第一传送室的第一处理工具，所述第一传送室被配置为耦合到多个处理室; （2）具有至少第二传送室的第二处理工具，所述第二传送室被配置为耦合到多个处理室; （3）耦合在所述第一和第二处理工具之间并被配置为在所述第一和第二处理工具之间传送衬底的第三传送室; 以及（4）单个定序器，其控制所述连接的处理工具系统的第一处理工具，第二处理工具和第三传送室之间的衬底传送操作。 提供了许多其他方面。

公开(公告)号：WO2009029902A1

公开(公告)日：2009-03-05

申请号：PCT/US2008/074931

申请日：2008-08-29

Applicant: APPLIED MATERIALS, INC. ,  BACHRACH, Robert Z. ,  CHAE, Yong-Kee ,  CHOI, Soo Young ,  DE VRIES, Nicholas G. J. ,  ELGAR, Yacov ,  ENGLHARDT, Eric A. ,  FREI, Michel R. ,  GAY, Charles ,  HAWKINS, Parris ,  HO, Choi ,  HUNTER, James Craig ,  KANKANALA, Penchala N. ,  LI, Liwei ,  LO, Wing Hoo ,  LU, Danny Cam Toan ,  MEI, Fang ,  MURPHY, Stephen P. ,  PATEL, Srujal ,  SAUNDERS, Matthew J. B. ,  SCHLEZINGER, Asaf ,  SHENG, Shuran ,  SU, Tzay-Fa ,  SULLIVAN, Jeffrey S. ,  TANNER, David ,  TROWBRIDGE, Teresa ,  WALKER, Brice ,  WHITE, John M. ,  WON, Tae K.

Inventor： BACHRACH, Robert Z. ,  CHAE, Yong-Kee ,  CHOI, Soo Young ,  DE VRIES, Nicholas G. J. ,  ELGAR, Yacov ,  ENGLHARDT, Eric A. ,  FREI, Michel R. ,  GAY, Charles ,  HAWKINS, Parris ,  HO, Choi ,  HUNTER, James Craig ,  KANKANALA, Penchala N. ,  LI, Liwei ,  LO, Wing Hoo ,  LU, Danny Cam Toan ,  MEI, Fang ,  MURPHY, Stephen P. ,  PATEL, Srujal ,  SAUNDERS, Matthew J. B. ,  SCHLEZINGER, Asaf ,  SHENG, Shuran ,  SU, Tzay-Fa ,  SULLIVAN, Jeffrey S. ,  TANNER, David ,  TROWBRIDGE, Teresa ,  WALKER, Brice ,  WHITE, John M. ,  WON, Tae K.

IPC: G06F7/10 ,  H01L31/06 ,  H01L21/4763

CPC classification number: H01L21/67236 ,  B23K26/364 ,  B26F3/002 ,  B26F3/004 ,  B65G49/064 ,  B65G2249/02 ,  B65G2249/04 ,  C03B33/03 ,  C03B33/033 ,  H01L21/67132 ,  H01L21/67712 ,  H01L21/67715 ,  H01L21/67721 ,  H01L21/67727 ,  H01L21/6776 ,  H01L31/022425 ,  H01L31/03921 ,  H01L31/0504 ,  H01L31/075 ,  H02S50/00 ,  H02S50/10 ,  Y02E10/548 ,  Y02P40/57 ,  Y10T29/49002 ,  Y10T29/49355 ,  Y10T29/5196 ,  Y10T29/53113 ,  Y10T29/5313 ,  Y10T29/5317 ,  Y10T29/53187 ,  Y10T29/53365 ,  Y10T29/53417 ,  Y10T225/10 ,  Y10T225/325 ,  Y10T225/329

Abstract: The present invention relates to a system that can be used to form a photovoltaic device using processing modules that are adapted to perform steps in the solar cell formation process The automated solar cell fab is generally an arrangement of automated processing modules and automation equipment that is used to form solar cell devices. The automated solar fab will thus generally comprise a substrate receiving module that is adapted to receive a substrate, one or more absorbing layer deposition cluster tools having at least one processing chamber that is adapted to deposit a silicon-containing layer on a surface of the substrate, one or more back contact deposition chambers, one or more material removal chambers, a solar cell encapsulation device, an autoclave module, an automated junction box attaching module, and one or more quality assurance modules that are adapted to test and qualify the completely formed solar cell device.

Abstract translation: 本发明涉及一种可用于使用处理模块来形成光伏器件的系统，所述处理模块适于在太阳能电池形成过程中执行步骤。自动化太阳能电池制造厂通常是自动化 处理模块和用于形成太阳能电池器件的自动化设备。 因此，自动化太阳能加工厂通常将包括适于接纳衬底的衬底接收模块，具有至少一个处理室的一个或多个吸收层沉积群集工具，该处理室适于在衬底的表面上沉积含硅层 ，一个或多个背接触沉积室，一个或多个材料去除室，太阳能电池封装装置，高压灭菌器模块，自动化接线盒附接模块，以及一个或多个质量保证模块，其适于测试和限定完全形成 太阳能电池装置。

公开(公告)号：WO2008031031A2

公开(公告)日：2008-03-13

申请号：PCT/US2007/077883

申请日：2007-09-07

Applicant: APPLIED MATERIALS, INC. ,  ENGLHARDT, Eric A. ,  RICE, Michael R. ,  HUDGENS, Jeffrey C. ,  HONGKHAM, Steve ,  PINSON, Jay D. ,  SALEK, Mohsen ,  CARLSON, Charles ,  WEAVER, William T. ,  ARMER, Helen R.

Inventor： ENGLHARDT, Eric A. ,  RICE, Michael R. ,  HUDGENS, Jeffrey C. ,  HONGKHAM, Steve ,  PINSON, Jay D. ,  SALEK, Mohsen ,  CARLSON, Charles ,  WEAVER, William T. ,  ARMER, Helen R.

IPC: B65H1/00 ,  C23F1/00 ,  H01L21/306 ,  C23C16/00

CPC classification number: G03F7/70991 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/67742 ,  H01L21/67745

Abstract: The present invention generally provides an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that is easily configurable, has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, and then certain portions of the photosensitive material are removed in a developing process completed in the cluster tool.

Abstract translation: 本发明总体上提供了一种用于使用容易配置的多室处理系统（例如，集群工具）处理衬底的装置和方法，具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片 处理历史（或晶圆历史），减少占地面积。 在一个实施例中，簇工具适于执行其中衬底被感光材料涂覆的轨道光刻工艺，然后转移到步进/扫描器，其将感光材料暴露于某种形式的辐射以形成图案 感光材料，然后在簇组工具中完成的显影过程中去除感光材料的某些部分。

公开(公告)号：WO2014200647A1

公开(公告)日：2014-12-18

申请号：PCT/US2014/037869

申请日：2014-05-13

Applicant: APPLIED MATERIALS, INC.

Inventor： LEE, Jared Ahmad ,  LUBOMIRSKY, Dmitry ,  SALINAS, Martin Jeff ,  NGUYEN, Andrew ,  CHO, Tom K. ,  ENGLHARDT, Eric A. ,  SILVEIRA, Fernando

IPC: H01L21/02 ,  H01L21/67

CPC classification number: B08B9/0325 ,  F16K3/02 ,  F16K51/02 ,  H01L21/67017 ,  H01L21/67253 ,  Y10T137/0419 ,  Y10T137/4259

Abstract: Methods and apparatus for particle reduction in throttle gate valves used in substrate process chambers are provided herein. In some embodiments, a gate valve for use in a process chamber includes a body having an opening disposed therethrough from a first surface to an opposing second surface of the body; a pocket extending into the body from a sidewall of the opening; a gate movably disposed within the pocket between a closed position that seals the opening and an open position that reveals the opening and disposes the gate completely within the pocket; and a plurality of gas ports disposed in the gate valve configured to direct a gas flow into a portion of the gate valve fluidly coupled to the opening.

Abstract translation: 本文提供了在基板处理室中使用的节流闸阀中减小颗粒的方法和装置。 在一些实施例中，用于处理室的闸阀包括具有从主体的第一表面到相对的第二表面穿过的开口的主体; 从开口的侧壁延伸到主体中的口袋; 可移动地设置在袋内的封闭位置之间的门，该关闭位置密封开口和露出开口的打开位置，并将门完全置于口袋内; 以及设置在所述闸阀中的多个气体端口，其构造成将气流引导到与所述开口流体连接的所述闸阀的一部分。

公开(公告)号：WO2014150234A1

公开(公告)日：2014-09-25

申请号：PCT/US2014/022656

申请日：2014-03-10

Applicant: APPLIED MATERIALS, INC

Inventor： HONGKHAM, Steve S. ,  REUTER, Paul B. ,  ENGLHARDT, Eric A. ,  BALASUBRAMANIAN, Ganesh ,  CHEN, Xinglong ,  ROCHA-ALVAREZ, JuanCarlos

IPC: H01L21/02

CPC classification number: H01L21/67184 ,  Y10T137/0318 ,  Y10T137/86187

Abstract: A via pass-through apparatus is disclosed. The via pass-through apparatus includes a pass-through chamber adapted to couple between a first mainframe section and a second mainframe section of a substrate processing system, the pass-through chamber including an entry and an exit each having a slit valve, and a via process chamber located at a different level than the pass-through chamber wherein the via process chamber is adapted to carry out a process on a substrate at the via location. Systems and methods of operating the system are provided, as are numerous other aspects.

Abstract translation: 公开了一种通孔传送装置。 通孔穿通装置包括适于耦合在基板处理系统的第一主机部分和第二主机部分之间的通过室，所述通过室包括每个具有狭缝阀的入口和出口，以及 通过处理室位于与通过室不同的水平，其中通孔处理室适于在通孔位置处在基板上执行处理。 提供了操作系统的系统和方法，以及许多其它方面。