Abstract:
The invention provides an ink jet printing apparatus (1000) that includes at least one ink jet print head (1002) adapted to dispense flu onto a substrate (S) and at least one delivery aperture (1006a or 1006b) adapted to direct a gas (from a gas supply 1010) toward the substrate. The apparatus may also include at least one recovery aperture (1008a or 1008b) adapted to draw materials away from the substrate and evaporate liquids from the surface of the substrate.
Abstract:
Methods and apparatus for cleaning a nozzle plate of an inkjet print head are provided. A first method includes positioning a cleaning medium proximate the inkjet print head, determining a pressure for a pressure roller to apply against the cleaning medium, contacting the cleaning medium with the pressure roller with the determined pressure, and moving the cleaning medium relative to the inkjet print head so as to clean the inkjet print head. The method also includes purging ink from the inkjet print head prior to the pressure roller contacting the cleaning medium and pre- jetting ink from the inkjet print head after moving the cleaning medium. Numerous other aspects are t provided.
Abstract:
Method of fabricating a thin-film transistor (TFT) in which a gate metal is deposited onto a substrate in order to form the gate of the thin-film transistor. The substrate may be an insulative substrate or a color filter. In a first method, the gate metal is subjected to an H2 plasma. After subjecting the gate metal to an H2 plasma, the gate insulating film is deposited onto the gate. In a second method, first and second layers of gate insulating film are respectively deposited on the gate at a first and second deposition rates. One layer is deposited under H2 or argon dilution conditions and has improved insulating conditions while the other layer serves to lower the overall compressive stress of the dual layer gate insulator. In a third method, an n silicon film is formed on a substrate by maintaining a flow of silane, phosphine and hydrogen gas into a processing chamber at substrate temperatures of about 300 °C or less.
Abstract:
Apparatus and methods for treating a substrate of a flat panel display are provided. An inkjet printing system that includes a chemical compound application assembly that applies chemical compound(s) on a substrate of a flat panel display through a chemical compound applicator is provided. The inkjet printing system may also include a substrate support stage, a stage positioning system, and an inkjet printing module. The chemical compound applicator may have a width that substantially spans the substrate width. A method for treating a glass substrate and a black matrix thereon for a flat panel display prior to delivery of ink to the glass substrate by an inkjet printing system is also provided. The black matrix and glass substrate are exposed to a surface active compound which may modify the surface energy of the black matrix, the surface energy of the glass substrate, or both.
Abstract:
An organic electroluminescent device comprising an anode layer on a substrate, an organic layer on the anode layer, and a cathode layer on the organic layer. In one embodiment, the cathode layer is subjected to H2 plasma prior to deposition of a protective layer over the cathode. In another embodiment, the organic electroluminescent device is encapsulated with an inner encapsulation layer on the cathode layer, and an outer encapsulation layer on the inner encapsulation layer. The inner layer is optimized for adhesion to the cathode layer.
Abstract:
A method for lifting a substrate from a susceptor. A plurality of lift pins is configured so that they support the substrate without contacting a central portion of the substrate. The processed substrate has a first dimension that is at least 500 millimeters and a second dimension that is at least 500 millimeters. Each lift pin in the plurality of lift pins is configured so that it supports the substrate from a point that is at least 120 millimeters from a center of the substrate. The plurality of lift pins is configured so that each side of the susceptor is supported by at least three lift pins. In some embodiments, a support member overlies at least a subset of the plurality of lift pins.
Abstract:
Systems and methods for measuring deposited ink in a substrate are provided. The invention includes a light source adapted to transmit light through a deposited ink on a substrate, and a camera having a CCD sensor array wherein the camera is adapted to measure the amount of light that is transmitted through the deposited ink. Numerous other aspects are provided.
Abstract:
The present invention provides methods and apparatus for controlling the quantity of fluid output (e.g., drop size) by individual nozzles of a print head to a very high precision at a frequency equal to the frequency at which fluid is normally dispensed. This is achieved by mapping fluid quantity control information into the data that represents the image to be printed. Data representative of an image is received and converted into pixel data. In at least one embodiment, the pixel data includes pixels represented by N bits, and the N bits may represent a drop size for the pixel and a union of the N bits may represent a nozzle status. A print head may be controlled based on the pixel data, and the print head may include nozzles that are each adapted to deposit at least one drop size quantity of a fluid on a substrate.
Abstract:
Embodiments of a cluster tool, processing chamber and method for processing a film stack are provided. In one embodiment, a method for in-situ etching of silicon and metal layers of a film stack is provided that includes the steps of etching an upper metal layer of the film stack in a processing chamber to expose a portion of an underlying silicon layer, and etching a trench in the silicon layer without removing the substrate from the processing chamber. The invention is particularly useful for thin film transistor fabrication for flat panel displays.
Abstract:
Provided herein is a method of improving the planarity of a support plate of a susceptor for use during deposition of a film of material onto a substrate comprising the steps of reducing pressure in a hollow core of a shaft to a level below atmospheric pressure; and reducing a pressure in the deposition chamber to a level required for the deposition of the film of material onto the substrate, where the pressure in the hollow core of the shaft acts upon a lower surface of the support plate connected to the shaft and interfacing with the hollow core of the shaft and the pressure in the deposition chamber acts upon a upper surface of the support plate adapted to support the substrate thereby improving planarity. Also provided are a susceptor and a method of depositing a film onto a substrate affixed to the susceptor of the present invention.