Abstract:
A pixel unit includes a thin film transistor (100), a first insulating layer (500), a pixel electrode (200), a second insulating layer (600), a meltable conductive component (400), and a common electrode (300). The thin film transistor (100) includes a drain electrode (110). The first insulating layer (500) is arranged over the drain electrode (110). The pixel electrode (200) is arranged over the first insulating layer (500) and electrically coupled to the drain electrode (110). The second insulating layer (600) is arranged over the pixel electrode (200). The meltable conductive component (400) is arranged over the second insulating layer (600). The common electrode (300) is arranged over the meltable conductive component (400) and electrically coupled to the meltable conductive component (400).
Abstract:
A thin film transistor array panel includes a first conductive layer (102) including a gate electrode; a channel layer (104) disposed over the gate; and a second conductive layer (105) disposed over the channel layer (104). The second conductive layer (105) includes a multi-layered portion defining a source electrode (105a) and a drain electrode (105b), which includes a first sub-layer (105-1), a second sub-layer (105-2), and a third sub-layer (105-3) sequentially disposed one over another. Both the third and the first sub-layers (105-3, 105-1) include indium and zinc oxide materials. An indium to zinc content ratio in the first sub-layer (105-1) is greater than that in the third sub-layer (105-3). The content ratio differentiation between the first and the third sub-layers (105-1, 105-3) affects a lateral etch profile associated with a gap (106) generated in the second conductive layer (105) between the source and the drain electrodes (105a, 105b), where the associated gap (106) width in the third sub-layer (105-3) is wider than that in the first sub-layer (105-1).
Abstract:
박막트랜지스터 기판 및 이를 포함하는 디스플레이 장치가 개시된다. 박막트랜지스터 기판은 게이트 전극, 소스 전극, 드레인 전극, 게이트 라인 및 테이터 라인의 기판을 향하는 면과 이의 반대 면 상에 구비되는 광반사 저감층을 포함하며, 광반사 저감층은 하기 [식 1]의 값 이 0.004 이상 0.22 이하를 만족한다. [식 1] (k x t )/ λ ( [식 1]에 있어서, k는 광반사 저감층의 소멸계수를 의미하고, t는 광반사 저감층의 두께를 의미하며, λ는 빛의 파장을 의미한다. )
Abstract:
The process of fabricating a flexible TFT back-panel includes depositing etch stop material on a glass support. A matrix of contact pads, gate electrodes and gate dielectric are deposited overlying the etch stop material. Vias are formed through the dielectric in communication with each pad. A matrix of TFTs is formed by depositing and patterning metal oxide semiconductor material to form an active layer of each TFT overlying the gate electrode. Source/drain metal is deposited on the active layer and in the vias in contact with the pads, the source/drain metal defining source/drain terminals of each TFT. Passivation material is deposited in overlying relationship to the TFTs. A color filter layer is formed on the passivation material and a flexible plastic carrier is affixed to the color filter. The glass support member and the etch stop material are then etched away to expose a surface of each of the pads.