公开(公告)号：WO2019066992A1

公开(公告)日：2019-04-04

申请号：PCT/US2017/054676

申请日：2017-09-30

Applicant: INTEL CORPORATION ,  EID, Feras ,  SWAN, Johanna M. ,  CHAN ARGUEDAS, Sergio ,  BEATTY, John J.

Inventor： EID, Feras ,  SWAN, Johanna M. ,  CHAN ARGUEDAS, Sergio ,  BEATTY, John J.

IPC: H01L23/367 ,  H01L23/40

Abstract: A device package and a method of forming a device package are described. The device package has dies disposed on a substrate, and one or more layers with a high thermal conductivity, referred to as the highly-conductive (HC) intermediate layers, disposed on the dies on the substrate. The device package further includes a lid with legs on an outer periphery of the lid, a top surface, and a bottom surface. The legs of the lid are attached to the substrate with a sealant. The bottom surface of the lid is disposed over the one or more HC intermediate layers and the one or more dies on the substrate. The device package may also include thermal interface materials (TIMs) disposed on the HC intermediate layers. The TIMs may be disposed between the bottom surface of the lid and one or more top surfaces of the HC intermediate layers.

公开(公告)号：WO2019005154A1

公开(公告)日：2019-01-03

申请号：PCT/US2017/040490

申请日：2017-06-30

Applicant: INTEL CORPORATION

Inventor： THANU, Dinesh Padmanabhan Ramalekshmi ,  DHAVALESWARAPU, Hemanth K. ,  GUTHIKONDA, Venkata Suresh ,  BEATTY, John J. ,  AN, Yonghao ,  AYALA, Marco Aurelio Cartas ,  GARNER, Luke J. ,  PENG, Li

IPC: H01L23/40 ,  H01L23/36 ,  H01L23/482 ,  H01L25/065

CPC classification number: H01L23/16 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/482 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Semiconductor packages having a sealant bridge between an integrated heat spreader and a package substrate are described. In an embodiment, a semiconductor package includes a sealant bridge anchoring the integrated heat spreader to the package substrate at locations within an overhang gap laterally between a semiconductor die and a sidewall of the integrated heat spreader. The sealant bridge extends between a top wall of the integrated heat spreader and a die side component, such as a functional electronic component or a non-functional component, or a satellite chip on the package substrate. The sealant bridge modulates warpage or stress in thermal interface material joints to reduce thermal degradation of the semiconductor package.

公开(公告)号：WO2017172228A1

公开(公告)日：2017-10-05

申请号：PCT/US2017/020286

申请日：2017-03-01

Applicant: INTEL CORPORATION

Inventor： ELSHERBINI, Adel A. ,  EID, Feras ,  BEATTY, John J.

IPC: H01H37/00 ,  H01H37/52 ,  H01H37/48 ,  H01H1/00

CPC classification number: H01H37/46 ,  H01H37/00 ,  H01H37/04 ,  H01H37/48 ,  H01H37/52 ,  H01H37/64 ,  H01H37/72 ,  H01H2001/0078 ,  H01H2001/0084 ,  H01H2037/008

Abstract: Thermal switch technology is disclosed. In one example, a thermally activated switch can include an electronic substrate base, and first and second electrical contacts coupled to the electronic substrate base. The first and second electrical contacts can be movable relative to one another due to thermal expansion or contraction of a material to facilitate contact or separation of the first and second electrical contacts.

Abstract translation: 公开了热敏开关技术。 在一个示例中，热激活开关可以包括电子基板底座，以及耦合到电子基板底座的第一和第二电触点。 由于材料的热膨胀或收缩，第一和第二电触头可以相对于彼此移动，以便于第一和第二电触头的接触或分离。