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    MULTIPLE-CHIP PACKAGE WITH MULTIPLE THERMAL INTERFACE MATERIALS
    1.
    发明申请
    MULTIPLE-CHIP PACKAGE WITH MULTIPLE THERMAL INTERFACE MATERIALS 审中-公开
    具有多种热界面材料的多芯片封装

    公开(公告)号：WO2017123188A1

    公开(公告)日：2017-07-20

    申请号：PCT/US2016/012808

    申请日：2016-01-11

    Applicant: INTEL CORPORATION

    Inventor： LIU, Boxi ,  DHAVALESWARAPU, Hemanth K. ,  JAIN, Syadwad ,  MATAYABAS, James C., Jr

    IPC: H01L25/065 ,  H01L23/48 ,  H01L23/34

    CPC classification number: H01L23/34 ,  H01L23/15 ,  H01L23/3677 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/48 ,  H01L23/49811 ,  H01L23/49827 ,  H01L25/065 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/19105

    Abstract: A multiple chip package is described with multiple thermal interface materials. In one example, a package has a substrate, a first semiconductor die coupled to the substrate, a second semiconductor die coupled to the substrate, a heat spreader coupled to the die, wherein the first die has a first distance to the heat spreader and the second die has a second distance to the heat spreader, a first filled thermal interface material (TIM) between the first die and the heat spreader to mechanically and thermally couple the heat spreader to the die, and a second filled TIM between the second die and the heat spreader to mechanically and thermally couple the heat spreader to the second die.

    Abstract translation: 用多种热界面材料描述多芯片封装。 在一个示例中，封装具有衬底，耦合到衬底的第一半导体管芯，耦合到衬底的第二半导体管芯，耦合到管芯的散热器，其中第一管芯具有到散热器的第一距离，并且 第二管芯具有到散热器的第二距离，第一管芯和散热器之间的第一填充热界面材料（TIM），以将散热器机械地和热耦合到管芯，以及第二管芯和第二管芯之间的第二填充TIM 散热器将散热器机械和热耦合到第二个模具。

    THERMAL MANAGEMENT FOR FLEXIBLE INTEGRATED CIRCUIT PACKAGES
    3.
    发明申请
    THERMAL MANAGEMENT FOR FLEXIBLE INTEGRATED CIRCUIT PACKAGES 审中-公开
    柔性集成电路封装的热管理

    公开(公告)号：WO2017052894A1

    公开(公告)日：2017-03-30

    申请号：PCT/US2016/048163

    申请日：2016-08-23

    Applicant: INTEL CORPORATION

    Inventor： KUMAR, Siddarth ,  DHAVALESWARAPU, Hemanth K.

    IPC: H01L23/498 ,  H01L23/495 ,  H01L23/538

    CPC classification number: H01L23/473 ,  H01L21/4882 ,  H01L23/145 ,  H01L23/5384 ,  H01L23/5387 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2225/06548 ,  H01L2225/06589

    Abstract: Disclosed herein are systems and methods for thermal management of a flexible integrated circuit (IC) package. In some embodiments, a flexible IC package may include a flexible substrate material; a component disposed in the flexible substrate material; a channel disposed in the flexible substrate material forming a closed circuit and having a portion proximate to the component; electrodes disposed in the flexible substrate material and positioned at locations proximate to the channel, wherein the electrodes are coupled to an electrode controller to selectively cause one or more of the electrodes to generate an electric field; and an electrolytic fluid disposed in the channel. In some embodiments, a flexible IC package may be coupled to a wearable support structure. Other embodiments may be disclosed and/or claimed.

    Abstract translation: 本文公开了用于柔性集成电路（IC）封装的热管理的系统和方法。 在一些实施例中，柔性IC封装可以包括柔性衬底材料; 设置在柔性基板材料中的部件; 通道，其设置在所述柔性基板材料中，形成闭合电路并且具有靠近所述部件的部分; 电极设置在柔性衬底材料中并且位于靠近通道的位置处，其中电极耦合到电极控制器以选择性地使一个或多个电极产生电场; 以及设置在通道中的电解液。 在一些实施例中，柔性IC封装可以耦合到可穿戴支撑结构。 可以公开和/或要求保护其他实施例。

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