Abstract:
A motor having a rotor, the rotor including a first metal plate having a first size and a second metal plate having a second size arranged on a first surface associated with the rotor. The first metal plate and the second metal plate are arranged adjacent to each other at a predetermined distance from an axis of rotation of the rotor. The first surface rotates perpendicularly about the axis in response to the rotor being rotated about the axis. A stator includes a third metal plate arranged on a second surface associated with the stator. The third metal plate is arranged on the second surface at the predetermined distance from the axis. The second surface is parallel to the first surface and faces the first surface.
Abstract:
A multi-stage Class AB amplifier system comprises a first Class AB amplifier circuit (20) that receives an input signal. A bias circuit (24) receives an output of the first Class AB amplifier circuit (20). A second Class AB amplifier circuit (28) communicates with the bias circuit (24) and generates an output signal. A common-mode feedback circuit (30) generates a feedback signal based on the output signal.
Abstract:
A processor includes a cache memory that has an array, word lines, and bit lines. A control module accesses cells of the array during access cycles to access instructions stored in the cache memory. The control module performs one of a first discrete read and a first sequential read to access instructions in a first set of cells of the array that are connected to a first word line and selectively performs one of a second discrete read and a second sequential read based on a branch instruction to access instructions in a second set of cells of the array that are connected to a second word line. The second word line is different than the first word line.
Abstract:
A system-on-chip (SOC) includes N physical layer (PHY) devices and a first host controller. The N PHY devices communicate with N peripheral devices, respectively, where N is an integer greater than 1. The host controller communicates with a host and is integrated with the N PHY devices in an integrated circuit (IC). The host controller is directly coupled to the N PHY devices and is configured to control the N peripheral devices. The host controller includes a selector that selectively connects one of the N PHY devices to the host controller. The N PHY devices and the N peripheral devices implement a Serial Advanced Technology Attachment (SATA) interface.
Abstract translation:片上系统(SOC)包括N个物理层(PHY)设备和第一主机控制器。 N PHY设备分别与N个外围设备进行通信,其中N是大于1的整数。主机控制器与主机通信并且与集成电路(IC)中的N个PHY设备集成。 主机控制器直接耦合到N个PHY设备,并被配置为控制N个外围设备。 主机控制器包括选择器,其将N个PHY设备之一选择性地连接到主机控制器。 N PHY设备和N个外围设备实现了串行高级技术附件(SATA)接口。
Abstract:
An integrated circuit comprises N plane-like metal layers, where N is an integer greater than one. A first plane-like metal layer includes M contact portions that communicate with the N plane-like metal layers, respectively, where M is an integer greater than one. The first plane-like metal layer and the N plane-like metal layers are located in separate planes. At least two of a first source, a first drain and a second source communicate with at least two of the N plane-like metal layers. A first gate is arranged between the first source and the first drain. A second gate is arranged between the first drain and the second source. The first and second gates define alternating first and second regions in the first drain, and wherein the first and second gates are arranged farther apart in the first regions than in the second regions.
Abstract:
A Metal Oxide Semiconductor (MOS) device formed on a substrate and a method for forming the MOS device. The MOS device includes a drain region, a gate region surrounding the drain region, source regions arranged around the gate region and across from the drain region, and bulk regions arranged around the gate region and separating the source regions. The gate region is formed in a loop around the drain region. In this manner, the on-resistance (Ron) of a MOS device is decreased without also increasing the area of the MOS device.
Abstract:
A testing system comprises a configurable integrated circuit that selectively communicates with one or more of N external impedances, that has M predetermined configurations that are selected based on an electrical characteristic of the one or more of the N external impedances, where N and M are integers greater than one. The configurable integrated circuit generates a selected one of M discrete values of an output characteristic of the configurable integrated circuit based on the selected one of the M predetermined configurations. An integrated circuit is tested in accordance with an output of the configurable integrated circuit.
Abstract:
Systems and methods are provided for using and manufacturing a semiconductor device. A semiconductor device comprises an array of transistors, wherein each respective transistor in at least some of the transistors in the array of transistors (i) is positioned adjacent to a respective first neighboring transistor and a respective second neighboring transistor in the array of transistors, (ii) has a source region that shares a first contact with a source region of the respective first neighboring transistor, and (iii) has a drain region that shares a second contact with a drain region of the respective second neighboring transistor.
Abstract:
An amplifier circuit (1000) amplifies a signal for wireless transmission. A feedback circuit (208), including a capacitor, is coupled to the amplifier circuit. Components of the feedback circuit (208) are selected based on a feedback factor such that an input impedance (Z input) to the amplifier circuit (1000) has a same impedance characteristic as a feedback circuit impedance of the feedback circuit (208).
Abstract:
A system including a plurality of amplifiers configured to generate a clock signal having a frequency. The clock signal is input to a processor. The amplifiers are connected in series. An output of a last one of the amplifiers is fed back to an input of a first one of the amplifiers. Each of the amplifiers has a transconductance. A frequency adjustment module is configured to adjust, based on an activity level of the processor, the frequency of the clock signal by adjusting the transconductance of the amplifiers.