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    IMPROVED POWER SUPPLY TRANSIENT PERFORMANCE (POWER INTEGRITY) FOR A PROBE CARD ASSEMBLY IN AN INTEGRATED CIRCUIT TEST ENVIRONMENT
    1.
    发明申请
    IMPROVED POWER SUPPLY TRANSIENT PERFORMANCE (POWER INTEGRITY) FOR A PROBE CARD ASSEMBLY IN AN INTEGRATED CIRCUIT TEST ENVIRONMENT 审中-公开
    用于集成电路测试环境中的探针卡组件的改进的电源瞬态性能（功率一体化）

    公开(公告)号：WO2016195766A1

    公开(公告)日：2016-12-08

    申请号：PCT/US2016/019865

    申请日：2016-02-26

    申请人： R&D CIRCUITS, INC.

    发明人： WARWICK, Thomas, P. ,  RUSSELL, James, V. ,  TURPUSEEMA, Dhananjaya

    IPC分类号： G01R31/28

    CPC分类号： G01R31/2889 ,  G01R1/07378 ,  G01R31/31901 ,  G01R31/31905

    摘要： The present invention describes essentially three different embodiments for the implementation of low impedance (over frequency) power delivery to a die. Such low impedance to a high frequency allows the die to operate at package-level speed, thus reducing yield loss at the packaging level. Each embodiment addresses a slightly different aspect of the overall wafer probe application, lit each embodiment, however, the critical improvement of this disclosure is the location of the passive components used, for supply filtering/ decoupling relative to prior art. All three embodiments, require a method to embed the passive components in close proximity to the pitch translation substrate or physically in the pitch translation substrate.

    摘要翻译： 本发明基本上描述了实现针对芯片的低阻抗（过频）功率传递的三个不同实施例。 这种低阻抗到高频允许管芯以封装级速度工作，从而降低封装级别的产量损失。 每个实施例解决了每个实施例的整个晶片探针应用的略微不同的方面，然而，本公开的关键改进是所使用的无源部件的位置，用于相对于现有技术的电源滤波/去耦。 所有三个实施例都需要一种方法来将无源部件嵌入到靠近螺距平移基板的位置，或物理地嵌入螺距平移基板。

    A STRUCTURE FOR ACCEPTING A COMPONENT FOR AN EMBEDDED COMPONENT PRINTED CIRCUIT BOARD
    3.
    发明申请
    A STRUCTURE FOR ACCEPTING A COMPONENT FOR AN EMBEDDED COMPONENT PRINTED CIRCUIT BOARD 审中-公开
    嵌入式组件印刷电路板组件的结构

    公开(公告)号：WO2015168370A1

    公开(公告)日：2015-11-05

    申请号：PCT/US2015/028453

    申请日：2015-04-30

    申请人： R&D CIRCUITS, INC

    发明人： TURPUSEEMA, Dhanonjaya ,  WARWICK, Thomas, P. ,  SMITH, Thomas ,  RUSSELL, James, V.

    IPC分类号： H05K3/30 ,  H05K3/46 ,  H05K3/40 ,  G06K19/077 ,  H05K1/18

    CPC分类号： H05K1/188 ,  H05K1/144 ,  H05K1/183 ,  H05K1/186 ,  H05K3/0026 ,  H05K3/0094 ,  H05K3/321 ,  H05K3/366 ,  H05K3/4655 ,  H05K3/4679 ,  H05K2201/032 ,  H05K2201/0355 ,  H05K2201/042 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09545 ,  H05K2201/09572 ,  H05K2203/0485 ,  H05K2203/063 ,  H05K2203/11 ,  Y10T29/49128 ,  Y10T29/4914

    摘要： A method and electrical interconnect structure internal to a printed circuit board for the purposes of creating a reliable, high performing connection method between embedded component terminals, signal traces and or power/ground planes which may occupy the same vertical space as the embedded components, such as a capacitor or resistor. Further easing the assembly and reliability through the manufacturing process of said embedded component structures. In one structure castellated drilled, plated vias connect the trace or plane within the printed circuit board to the electrical terminals of the embedded component using a permanent and highly conductive attach material. In another structure, the trace or plane connect by selective side-wall plating, which surrounds the electrical terminal of the component This structure also uses a permanent and highly conductive attach material to electrically connect the component terminal to the plated side-wall and in a final embodiment the terminals are connected through a conductive attach material through a via in the z axis to a conductive pad.

    摘要翻译： 印刷电路板内部的方法和电互连结构，用于在嵌入式组件端子，信号迹线和/或电源/接地平面之间建立可靠的，高性能的连接方法，其可能占据与嵌入式组件相同的垂直空间，例如 作为电容器或电阻器。 通过所述嵌入式组件结构的制造过程进一步减轻组装和可靠性。 在一种结构化的钻孔中，电镀通孔使用永久且高度导电的附着材料将印刷电路板中的迹线或平面连接到嵌入式部件的电气端子。 在另一种结构中，轨迹或平面通过选择性侧壁电镀连接，其围绕部件的电端子。该结构还使用永久且高度导电的附着材料将部件端子电连接到电镀侧壁 最终实施例中，端子通过导电附着材料通过z轴中的通孔连接到导电垫。

    EMBEDDED ISOLATION FILTER
    4.
    发明申请
    EMBEDDED ISOLATION FILTER 审中-公开

    公开(公告)号：WO2012047266A3

    公开(公告)日：2012-04-12

    申请号：PCT/US2011/001663

    申请日：2011-09-28

    申请人： R&D CIRCUITS, INC.

    发明人： WARWICK, Thomas, P. ,  RUSSELL, James, V.

    IPC分类号： H01P1/20 ,  H01P1/203 ,  H01P1/205

    摘要： The present disclosure relates to reducing unwanted RF noise in a printed circuit board (PCB) containing an RF device. An isolation filter is embedded in a PCB containing an RDF device. By placing the isolation filter as close as possible to the RF device in order to dramatically reduce unwanted RF noise due to unavoidable coupling between Vias and planes in the PCB structure.

    TRACE ANYWHERE INTERCONNECT
    5.
    发明申请
    TRACE ANYWHERE INTERCONNECT 审中-公开
    跟踪任何互连

    公开(公告)号：WO2017039790A1

    公开(公告)日：2017-03-09

    申请号：PCT/US2016/038687

    申请日：2016-06-22

    申请人： R&D CIRCUITS, INC.

    发明人： WARWICK, Thomas, P. ,  TURPUSEEMA, Dhananjaya ,  RUSSELL, James, V.

    IPC分类号： H01R12/00 ,  B33Y80/00 ,  H01R12/14 ,  H01R13/02 ,  H05K1/14 ,  H05K3/36 ,  H01L23/522 ,  H01L23/535

    CPC分类号： H01R12/52 ,  H01L23/522 ,  H01L23/535 ,  H05K1/185 ,  H05K3/4046 ,  H05K2201/09118 ,  H05K2201/10287

    摘要： The present invention provides for a method and structure for forming three-dimensionally routed dielectric wires between discrete points on the two or more parallel circuit planes. The wires may be freely routed in three-dimensional space as to create the most efficient routing between the two arbitrarily defined points on the two or more parallel circuit planes. Metalizing the outer surfaces of these three dimensional dielectric wires electrically coupling the discrete wires to their respective discrete contact points. Two or more of these wires may be in intimate contact to one another electrically coupling to each other as well as to two or more discrete contact pads. These electrically coupled contact pads may be on opposite sides or on the same side of the structure and the formed metalized wires may originate on one side and terminate on the other or originate and terminate from the same side

    摘要翻译： 本发明提供了用于在两个或更多个并联电路平面上的离散点之间形成三维布线的电介质线的方法和结构。 导线可以在三维空间中自由布线，以在两个或多个并联电路平面上的两个任意定义的点之间创建最有效的路由。 将这些三维电介质线的外表面金属化，将离散导线电耦合到它们各自的离散接触点。 这些线中的两个或更多个可以彼此紧密接触，彼此电耦合以及两个或更多个离散的接触垫。 这些电耦合接触焊盘可以在结构的相对侧或同一侧上，并且所形成的金属化导线可以源于一侧并且终止于另一侧或从相同侧产生并终止

    RESURFACEABLE CONTACT PAD REDISTRIBUTION INTERPOSER FOR SEMICONDUCTOR PROBING
    8.
    发明申请
    RESURFACEABLE CONTACT PAD REDISTRIBUTION INTERPOSER FOR SEMICONDUCTOR PROBING 审中-公开
    用于半导体探头的可重复接触垫重新分配插接器

    公开(公告)号：WO2016209386A1

    公开(公告)日：2016-12-29

    申请号：PCT/US2016/031751

    申请日：2016-05-11

    申请人： R&D CIRCUITS, INC.

    发明人： RUSSELL, James, V.

    IPC分类号： H01L23/50 ,  H01L21/50

    CPC分类号： H01L23/50 ,  G01R1/07378 ,  H01L21/50 ,  H01L23/49827

    摘要： The present invention relates to a method and an apparatus for a resurfaceable contact pad that uses; an epoxy to encapsulate contact pads so that the epoxy and encapsulated contact pads are coplanar on a silicon redistribution interposer. These redistribution interposers electrically connect a wafer semi-conductor to a probe card where it is necessary to convert the course pad arrangement of one with a fine pad arrangement of the other through the use of an interposer board. The present invention relates to an apparatus and a method creates resurfaceable contact pads which may be resurfaced one or multiple times with an abrasive sanding operation to recreate a coplanar surface should any contact pad surfaces become damaged, allowing for a more cost- effective repair.

    摘要翻译： 本发明涉及一种使用的可再现接触焊盘的方法和装置; 环氧树脂以封装接触焊盘，使得环氧树脂和封装的接触焊盘在硅再分布插入件上共面。 这些再分布插入器将晶片半导电体电连接到探针卡，其中需要通过使用插入板来将另一个的导线板布置与另一个的精细焊盘布置相结合。 本发明涉及一种设备和方法，其产生可重新接触的接触垫，其可以通过磨料砂磨操作重新浮雕一次或多次，以在任何接触垫表面损坏时重建共面，从而允许更具成本效益的修复。

    A METHOD AND AN ELECTRICAL INTERCONNECT MECHANISM
    9.
    发明申请
    A METHOD AND AN ELECTRICAL INTERCONNECT MECHANISM 审中-公开
    一种方法和电气互连机制

    公开(公告)号：WO2013158162A1

    公开(公告)日：2013-10-24

    申请号：PCT/US2013/000096

    申请日：2013-03-28

    申请人： R&D CIRCUITS, INC.

    发明人： WARWICK, Thomas, P. ,  RUSSELL, James, V. ,  MCMULLIN, Dermick ,  QUICK, William

    IPC分类号： H01R12/00

    CPC分类号： H01R13/03 ,  H01R12/52 ,  H01R13/2414 ,  H01R43/26 ,  Y10T29/49208 ,  Y10T29/4921

    摘要： A method and an electrical interconnect mechanism in which elastomeric pins are printed onto metal retainer tabs having at least one protrusion or tab extending laterally therefrom to engage a catch or recess of the laminated housing so as to locate each of the elastomeric pins and secure them within the housing. In one embodiment a champher may be employed with a catch or recess to engagely secure a second protrusion or tab extending laterally from another side of said elastomeric pin. In another embodiment the elastomeric pin may have a solid metal ring or a slide collar around the center of the pin wherein the ring has one or two tabs for engaging the recess in the housing and if preferred also the recess of a champfer.

    摘要翻译： 一种方法和电互连机构，其中弹性销被印刷到具有至少一个从其横向延伸的突起或突片的金属保持器突片上，以接合层叠壳体的卡扣或凹部，以便定位每个弹性销并将其固定在 住房。 在一个实施例中，可以使用带有卡扣或凹槽的凸轮来接合地固定从所述弹性销的另一侧横向延伸的第二突起或突出部。 在另一个实施例中，弹性体销可以具有围绕销的中心的实心金属环或滑动环，其中环具有用于接合壳体中的凹部的一个或两个突出部以及冠状器的凹部。

    AN ELECTRICAL CONNECTOR FOR CONNECTING AN ADAPTOR BOARD OR ELECTRICAL COMPONENT TO A MAIN PRINTED CIRCUIT BOARD
    10.
    发明申请
    AN ELECTRICAL CONNECTOR FOR CONNECTING AN ADAPTOR BOARD OR ELECTRICAL COMPONENT TO A MAIN PRINTED CIRCUIT BOARD 审中-公开
    一种用于将适配器板或电子元件连接到主印刷电路板的电连接器

    公开(公告)号：WO2011115662A2

    公开(公告)日：2011-09-22

    申请号：PCT/US2011/000454

    申请日：2011-03-11

    申请人： R&D CIRCUITS INC.

    发明人： RUSSELL, James, V.

    IPC分类号： H01R12/51 ,  H05K1/11

    CPC分类号： H01R12/7082 ,  H01R12/57

    摘要： An electrical connector electrically connects either an adaptor board or an electrical component to a main circuit board through the use of a thin printed circuit having an array of pads one each side where on one side the pads are connected to a main circuit board by solder balls, solder columns conductive epoxy or any other way practiced in the art and on the other side of the thin circuit the pads are connected to an adaptor board by a conductive compliant elastomeric material. The sides of the thin printed circuit are electrically connected to one another in ways practiced in the art.

    摘要翻译： 电连接器通过使用具有焊盘阵列的薄印刷电路将适配器板或电气部件电连接到主电路板，其中在每一侧焊盘连接在一侧上 通过焊球，导电环氧树脂或本领域中实践的任何其他方式通过焊球，在薄电路的另一侧上通过导电顺应性弹性体材料将焊盘连接至适配器板。 薄印刷电路的侧面以本领域实践的方式相互电连接。