公开(公告)号：WO2018091459A4

公开(公告)日：2018-05-24

申请号：PCT/EP2017/079195

申请日：2017-11-14

申请人： X-CELEPRINT LIMITED

发明人： BOWER, Christopher ,  MEITL, Matthew ,  TRINDADE, Antonio Jose Marques ,  COK, Ronald S. ,  RAYMOND, Brook ,  PREVATTE, Carl

IPC分类号： H01L21/683 ,  H01L33/00 ,  H01L23/00

摘要： In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate (10) and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device (22). A patterned release layer (30) and, optionally, a capping layer (60) are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate (50) with a bonding layer (40). The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.

公开(公告)号：WO2016120398A1

公开(公告)日：2016-08-04

申请号：PCT/EP2016/051827

申请日：2016-01-28

申请人： OSRAM OPTO SEMICONDUCTORS GMBH ,  X-CELEPRINT LIMITED

发明人： MEITL, Matthew ,  BOWER, Christopher ,  VARGHESE, Tansen

IPC分类号： H01L33/00 ,  H01L33/38

CPC分类号： H01L33/22 ,  H01L25/0753 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/32 ,  H01L33/382 ,  H01L33/465 ,  H01L2933/0033 ,  H01L2933/0058

摘要： A method for producing a plurality of semiconductor components is provided, wherein a semiconductor layer sequence having a first semiconductor layer, a second semiconductor layer and an active region is applied on a substrate. A contact structure is formed for electrically contacting the first and the second semiconductor layers. An auxiliary substrate is applied on the semiconductor layer sequence, so that the semiconductor layer sequence is arranged between the auxiliary substrate and the substrate. In a subsequent step, the substrate is removed from the semiconductor layer sequence. The semiconductor layer sequence is structured into a plurality of semiconductor bodies by forming at least one trench separating the semiconductor bodies. An anchoring layer is formed to cover the trench and vertical surfaces of the semiconductor bodies. A plurality of tethers is formed by structuring the anchoring layer in regions covering the trench. The auxiliary substrate is locally detached from the semiconductor bodies, wherein the tethers remain attached to the auxiliary substrate. At least one semiconductor body is selectively picked up by separating the tethers from the auxiliary substrate. Moreover, a semiconductor component produced by said method is provided.

摘要翻译： 提供一种用于制造多个半导体部件的方法，其中将具有第一半导体层，第二半导体层和有源区域的半导体层序列施加在基板上。 形成用于电接触第一和第二半导体层的接触结构。 在半导体层序列上施加辅助衬底，使得半导体层序列布置在辅助衬底和衬底之间。 在随后的步骤中，从半导体层序列中去除衬底。 半导体层序列通过形成分离半导体本体的至少一个沟槽而构成多个半导体本体。 形成锚固层以覆盖半导体主体的沟槽和垂直表面。 通过在覆盖沟槽的区域中构造锚定层来形成多个系绳。 辅助基板与半导体本体分离，其中系绳保持附着在辅助基板上。 通过将绳索与辅助基板分开来选择性地拾取至少一个半导体体。 此外，提供了通过所述方法制造的半导体部件。

公开(公告)号：WO2017068114A1

公开(公告)日：2017-04-27

申请号：PCT/EP2016/075358

申请日：2016-10-21

申请人： X-CELEPRINT LIMITED

发明人： BOWER, Christopher ,  MEITL, Matthew

IPC分类号： B81C99/00

CPC分类号： B81C99/008 ,  B81C2201/0194 ,  B81C2203/054

摘要： The disclosed technology relates generally to methods and systems for controlling the release of micro devices. Prior to transferring micro devices to a destination substrate, a native substrate is formed with micro devices thereon. The micro devices can be distributed over the native substrate and spatially separated from each other by an anchor structure. The anchors are physically connected/secured to the native substrate. Tethers physically secure each micro device to one or more anchors, thereby suspending the micro device above the native substrate. In certain embodiments, single tether designs are used to control the relaxation of built-in stress in releasable structures on a substrate, such as Si (1 0 0). Single tether designs offer, among other things, the added benefit of easier break upon retrieval from native substrate in micro assembly processes. In certain embodiments, narrow tether designs are used to avoid pinning of the undercut etch front.

摘要翻译： 所公开的技术总体上涉及用于控制微型器件的释放的方法和系统。 在将微型器件转移到目标衬底之前，在其上形成具有微型器件的本地衬底。 微器件可以分布在自然衬底上并且通过锚结构彼此在空间上分离。 锚固物物理连接/固定在天然基底上。 系绳物理地将每个微型装置固定到一个或多个锚定件，从而将微型装置悬挂在自然基板上方。 在某些实施例中，使用单系链设计来控制衬底上可释放结构（例如Si（100））中的内建应力的松弛。 除了别的以外，单系绳设计提供了在微组装过程中从原始基板取回时更容易断裂的附加益处。 在某些实施例中，使用窄绳索设计来避免底切蚀刻前端的钉扎。

公开(公告)号：WO2016184769A1

公开(公告)日：2016-11-24

申请号：PCT/EP2016/060641

申请日：2016-05-12

申请人： X-CELEPRINT LIMITED

发明人： BOWER, Christopher ,  MEITL, Matthew ,  GOMEZ, David ,  PREVATTE, Carl ,  BONAFEDE, Salvatore

IPC分类号： H01L33/00 ,  H01L33/20 ,  H01L33/40 ,  H01L33/26

CPC分类号： H01L33/0079 ,  H01L21/6835 ,  H01L29/7848 ,  H01L33/007 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/26 ,  H01L33/32 ,  H01L33/36 ,  H01L33/38 ,  H01L33/40 ,  H01L33/44 ,  H01L33/62 ,  H01L2221/68318 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033

摘要： The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro- transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.

摘要翻译： 本发明提供了能够构建可以被微转移印刷在蓝宝石衬底上的微型LED芯片的结构和方法。 这种印刷结构使得低成本，高性能的电连接微型LED阵列可用于例如显示系统。 此外，在一个实施例中，用于印刷的LED的电触点在单组工艺步骤中电互连。 在某些实施例中，可印刷的微器件的形成开始于半导体结构保留在衬底上。 在部分地形成可印刷的微器件之后，将手柄衬底附接到与衬底相对的系统，使得系统固定到手柄衬底。 然后可以去除衬底并完成半导体结构的形成。 完成后，可打印的微型装置可以是微转印印刷到目的基板。

公开(公告)号：WO2015193434A2

公开(公告)日：2015-12-23

申请号：PCT/EP2015/063709

申请日：2015-06-18

申请人： X-CELEPRINT LIMITED

发明人： BOWER, Christopher ,  MEITL, Matthew ,  GOMEZ, David ,  BONAFEDE, Salvatore ,  KNEEBURG, David ,  FECIORU, Alin ,  PREVATTE, Carl

IPC分类号： H01L25/075

CPC分类号： H01L33/385 ,  F21K9/50 ,  F21V9/08 ,  F21Y2101/025 ,  F21Y2105/003 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  G02B26/04 ,  G02F1/167 ,  G09G3/22 ,  G09G3/32 ,  G09G2300/0452 ,  G09G2300/0842 ,  G09G2310/0264 ,  H01L23/4821 ,  H01L23/5381 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/156 ,  H01L33/20 ,  H01L33/36 ,  H01L33/38 ,  H01L33/405 ,  H01L33/48 ,  H01L33/50 ,  H01L33/502 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/73267 ,  H01L2224/92244 ,  H05B33/089 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  H05K1/182 ,  H05K5/0017 ,  H05K2201/0329 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166

摘要： The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

摘要翻译： 所公开的技术提供微组装的微型LED显示器和照明元件，其使用太小的微型LED阵列（例如，宽度或直径为10μm至50μm的微型LED），许多或易碎的组装通过 常规手段。 所公开的技术提供了使用微转印技术组装的微型LED显示器和照明元件。 微型LED可以在天然衬底上制备并印刷到显示衬底（例如，塑料，金属，玻璃或其他材料）上，从而避免在显示衬底上制造微型LED。 在某些实施例中，显示器基板是透明和/或柔性的。

公开(公告)号：WO2017167954A2

公开(公告)日：2017-10-05

申请号：PCT/EP2017/057664

申请日：2017-03-31

申请人： X-CELEPRINT LIMITED

发明人： BOWER, Christopher Andrew ,  COK, Ronald S. ,  MEITL, Matthew ,  PREVATTE, JR., Carl Ray

IPC分类号： H01L21/60

摘要： A printed electrical connection structure includes a substrate having one or more electrical connection pads and a micro-transfer printed component having one or more connection posts. Each connection post is in electrical contact with a connection pad. A resin is disposed between and in contact with the substrate and the component. The resin has a reflow temperature less than a cure temperature. The resin repeatedly flows at the reflow temperature when temperature-cycled between an operating temperature and the reflow temperature but does not flow after the resin is exposed to a cure temperature. A solder can be disposed on the connection post or the connection pad. After printing and reflow, the component can be tested and, if the component fails, another component is micro-transfer printed to the substrate, the resin is reflowed again, the other component is tested and, if it passes the test, the resin is finally cured.

摘要翻译： 印刷电连接结构包括具有一个或多个电连接垫的基板和具有一个或多个连接柱的微转印印刷部件。 每个连接柱都与连接垫电接触。 树脂设置在基底和部件之间并与基底和部件接触。 树脂的回流温度低于固化温度。 在工作温度和回流温度之间进行温度循环时，树脂在回流温度下重复流动，但在树脂暴露于固化温度后不流动。 焊料可以设置在连接柱或连接垫上。 在印刷和回流之后，可以对组件进行测试，并且如果组件失效，则将另一组件微转印到衬底上，再次回流树脂，测试另一组件，并且如果通过测试，树脂是 终于治好了。

公开(公告)号：WO2016120400A1

公开(公告)日：2016-08-04

申请号：PCT/EP2016/051830

申请日：2016-01-28

申请人： OSRAM OPTO SEMICONDUCTORS GMBH ,  X-CELEPRINT LIMITED

发明人： MEITL, Matthew ,  BOWER, Christopher ,  VARGHESE, Tansen

IPC分类号： H01L33/00 ,  H01L21/78 ,  H01L33/50 ,  H01L33/56

CPC分类号： H01L25/0753 ,  H01L21/7806 ,  H01L33/0066 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/22 ,  H01L33/382 ,  H01L33/44 ,  H01L33/502 ,  H01L33/505 ,  H01L33/507 ,  H01L33/508 ,  H01L33/56 ,  H01L33/60 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/005 ,  H01L2933/0091

摘要： A method for producing a plurality of semiconductor components is provided, wherein a semiconductor layer sequence having a first semiconductor layer, a second semiconductor layer and an active region is applied on a substrate. A contact structure is formed for electrically contacting the first semiconductor layer and the second semiconductor layer. The semiconductor layer sequence is structured into a plurality of semiconductor bodies by forming at least one trench separating the semiconductor bodies. An insulating layer is formed to cover the trench and vertical surfaces of the semiconductor bodies. A plurality of tethers is formed by structuring the insulating layer in regions covering the trench. The substrate is locally detached from the semiconductor bodies, wherein the tethers remain attached to the substrate. At least one semiconductor body is selectively picked up by separating the tethers from the substrate. Moreover, a semiconductor component produced by said method is provided.

摘要翻译： 提供一种用于制造多个半导体部件的方法，其中将具有第一半导体层，第二半导体层和有源区域的半导体层序列施加在基板上。 形成用于电接触第一半导体层和第二半导体层的接触结构。 通过形成分离半导体本体的至少一个沟槽，将半导体层序列构造成多个半导体本体。 形成绝缘层以覆盖半导体主体的沟槽和垂直表面。 通过在覆盖沟槽的区域中构造绝缘层来形成多个系绳。 衬底与半导体本体分离，其中系链保持附着于衬底。 通过从衬底分离系绳来选择性地拾取至少一个半导体体。 此外，提供了通过所述方法制造的半导体部件。

公开(公告)号：WO2016030422A1

公开(公告)日：2016-03-03

申请号：PCT/EP2015/069553

申请日：2015-08-26

申请人： X-CELEPRINT LIMITED

发明人： BOWER, Christopher ,  MEITL, Matthew ,  CARTER, Julian ,  COK, Ronald S.

IPC分类号： H01L27/28 ,  H01L27/32 ,  H01L25/16

CPC分类号： H01L25/167 ,  H01L25/0753 ,  H01L27/3216 ,  H01L27/3225 ,  H01L27/3244 ,  H01L2924/0002 ,  H05B33/0845 ,  H05B33/0896 ,  H01L2924/00

摘要： The disclosed technology relates generally hybrid displays with pixels that include both inorganic light emitting diodes (ILEDs) and organic light emitting diodes (OLEDs). The disclosed technology provides a hybrid display that uses a mixture of ILEDs and OLEDs in each pixel. In certain embodiments, each pixel in the hybrid display includes a red ILED, a blue ILED, and a green OLED. In this instance, the OLED process would not require a high resolution shadow mask, thereby enhancing the manufacturability of OLEDs for larger format displays. Additionally, the OLED process in this example would not require any fine lithography. The OLED subpixel (e.g., green subpixel) can be larger and the ILEDs can be small (e.g., micro-red and micro-blue ILEDs). The use of small ILEDs allows for other functions to be added to the pixel, such as micro sensors and micro integrated circuits.

摘要翻译： 所公开的技术通常涉及具有包括无机发光二极管（ILED）和有机发光二极管（OLED））的像素的混合显示器。 所公开的技术提供了在每个像素中使用ILED和OLED的混合物的混合显示器。 在某些实施例中，混合显示器中的每个像素包括红色ILED，蓝色ILED和绿色OLED。 在这种情况下，OLED工艺将不需要高分辨率荫罩，从而增强用于较大格式显示器的OLED的可制造性。 此外，在该示例中的OLED工艺不需要任何精细光刻。 OLED子像素（例如，绿色子像素）可以更大并且ILED可以较小（例如，微红色和微蓝色ILED）。 使用小型ILED可以将其他功能添加到像素中，如微型传感器和微型集成电路。

公开(公告)号：WO2017105581A3

公开(公告)日：2017-06-22

申请号：PCT/US2016/054735

申请日：2016-09-30

申请人： X-CELEPRINT LIMITED

发明人： BURROUGHS, Scott ,  MEITL, Matthew ,  FISHER, Brent ,  SAMARSKIY, Miroslav

IPC分类号： H01L31/0232 ,  H01L31/054

摘要： A concentrator-type photovoltaic module includes a plurality of photovoltaic cells having respective surface areas of less than about 4 square millimeters (mm) electrically interconnected in series and/or parallel on a backplane surface, and an array of concentrating optical elements having respective aperture dimensions of less than about 30 mm and respective focal lengths of less than about 50 mm. The array of concentrating optical elements is positioned over the photovoltaic cells based on the respective focal lengths to concentrate incident light on the photovoltaic cells, and is integrated on the backplane surface by at least one spacer structure on the backplane surface. Related devices, operations, and fabrication methods are also discussed.

公开(公告)号：WO2016046283A3

公开(公告)日：2016-03-31

申请号：PCT/EP2015/071909

申请日：2015-09-23

申请人： X-CELEPRINT LIMITED

发明人： BOWER, Christopher ,  MEITL, Matthew

IPC分类号： H01Q3/26 ,  G02F1/13 ,  H01L21/48 ,  H01L21/66 ,  H01L23/538 ,  H01L25/075 ,  G02F1/1345 ,  G02F1/136 ,  G09G3/32 ,  G09G3/00 ,  H01Q1/22 ,  H01Q21/00

摘要： The disclosed technology relates generally to designs and methods of assembling functional devices utilizing compound micro-assembly. This method involve the the formation of functional device elements on native substrates (302). The functional device elements are thereafter assembled on an intermediate substrate and electrically interconnected so as to form an array of individual micro-systems (304). The micro-systems are consequently transferred (one or more at a time) to a destination or device substrat, where they are electrically interconnected so as to form a macro-system (308). Example of a macro-systems is a display device wherein, each micro-system may be an individual pixel containing red, blue, and green micro LEDs and a silicon drive circuit as functional device elements. An array of pixels may be formed by micro-transfer printing functional device elements onto the intermediate substrate and electrically connecting them via fine lithography, then the individual pixels may be micro-transfer printed onto the destination substrate.

摘要翻译： 所公开的技术总体上涉及利用复合微组装的组装功能装置的设计和方法。 该方法涉及在自然基底上形成功能性器件元件（302）。 此后将功能器件元件组装在中间衬底上并电互连以形成单个微系统阵列（304）。 因此，微系统（一次一个或多个）被传送到目的地或设备基底，在那里它们被电互连以形成宏观系统（308）。 宏观系统的示例是显示设备，其中，每个微系统可以是包含红色，蓝色和绿色微型LED的单个像素以及作为功能设备元件的硅驱动电路。 可以通过将功能器件元件微印到中间衬底上并通过精细光刻将它们电连接，形成像素阵列，然后可以将各个像素微转印到目的衬底上。