Abstract:
A capacitive element for an implantable medical device feedthrough element includes a bore, to receive a feedthrough member, or pin of the filtered feedthrough element, an external surface extending laterally outward from a first opening of the bore, and a recessed area formed in the external surface and extending about an outer perimeter thereof. The recessed area may provide a location on which to apply a conductive material to form a joint that electrically couples the capacitive element to a ferrule of the filtered feedthrough element.
Abstract:
A capacitor may include a first capacitor plate having a first length. The capacitor may also include an inorganic capacitor dielectric layer on sidewalls and a surface of the first capacitor plate and a second capacitor plate on the inorganic capacitor dielectric layer. The second capacitor plate may have a second length less than the first length of the first capacitor plate. The capacitor may also include a conductive contact landing directly on the first capacitor plate. The conductive contact may land directly on the first capacitor plate by extending through the inorganic capacitor dielectric layer and an organic interlayer dielectric supported by the inorganic capacitor dielectric layer.
Abstract:
A coupled winding cancels parasitic inductance of first and second capacitors. In an EMI filter having common mode capacitors and a differential capacitors, first and second windings cancel parasitic inductance of the common mode and differential capacitors.
Abstract:
An electrical filter assembly including a housing; at least one electrical wire extending into the housing; and a filter subassembly on the housing, the filter subassembly comprising a lead frame and a filter circuit connected to the lead frame. The filter circuit has a plurality of capacitors attached to the lead frame as a modular block. The lead frame comprises at least one insulation displacement contact section which makes electrical connection with the at least one electrical wire.
Abstract:
Semiconductor chip laminates and inductive, capacitive, and electromagnetic shielding laminate structures that can be integrated together to form electronic circuits for use in systems and devices such as smartphones, tablet computers, notebook computers, wearable electronic devices, portable medical devices, servers, networking equipment, industrial equipment, etc. Fabrications of such integrated laminate structures can be modularized into four (4) types of laminates, namely, inductive laminates, capacitive laminates, electromagnetic shielding laminates, and semiconductor chip laminates, which can be vertically laminated together and/or integrated side-by-side with high density to produce the desired electronic circuits, systems, and devices.
Abstract:
An improved, in-line, bulkhead mounted, electromagnetic interference filter specifically for low frequency, high current applications such as filtering EMI from 400 Hertz aircraft power, consisting in particular of capacitive elements employing a discoidal, non-ferroelectric ceramic dielectric such as NPO/COG, configured in any of the traditional L and C filter arrangements and packaged in a center feed through, ground plane metal jacket suitable for bulkhead or through-hole mounting, offering improved performance over the full specified temperature range, greater reliability and longer useful life than, for example, similar filters employing X7R dielectric.
Abstract:
An improved, in-line, bulkhead mounted, electromagnetic interference filter specifically for low frequency, high current applications such as filtering EMI from 400 Hertz aircraft power, consisting in particular of capacitive elements employing a discoidal, non-ferroelectric ceramic dielectric such as NPO/COG, configured in any of the traditional L and C filter arrangements and packaged in a center feed through, ground plane metal jacket suitable for bulkhead or through-hole mounting, offering improved performance over the full specified temperature range, greater reliability and longer useful life than, for example, similar filters employing X7R dielectric.