公开(公告)号：EP0834901A2

公开(公告)日：1998-04-08

申请号：EP97119904.7

申请日：1994-11-27

申请人： MATSUSHITA ELECTRONICS CORPORATION

发明人： Hayama, Hidekazu ,  Miura, Yasunori ,  Suzuki, Atsushi ,  Ishiai, Keizou

IPC分类号： H01J29/89

CPC分类号： H01J29/868 ,  H01J2229/8915

摘要： A method for manufacturing an anti-reflection film of a display device comprises steps of forming a first layer (2) which is an electrically-conductive thin film having a first refractive index, and which is deposited on an outer surface of a glass face panel (1), forming a second layer (3) which is a thin film having a second refractive index lower than said first refractive index, and which is deposited on an outer surface of said first layer (2), and forming a third layer (4) which is deposited on said second layer (3), and which has a large number of concave regions (6) each surrounded by convex regions (5) on an exposed surface of said display device. According to the invention said first layer (2), said second layer (3) and said third layer (4) form said antireflection film which has a luminous reflectance of 1.5% or less, and a reflectance of 3% or less between the wavelength of 436 nm and 700 nm.

摘要翻译： 一种用于制造显示装置的抗反射膜的方法包括以下步骤：形成第一层（2），该第一层（2）是具有第一折射率的导电薄膜并且沉积在玻璃面板的外表面上 （1）中，形成第二层（3），所述第二层（3）是具有低于所述第一折射率的第二折射率的薄膜并且沉积在所述第一层（2）的外表面上，并且形成第三层 4），其沉积在所述第二层（3）上，并且在所述显示装置的暴露表面上具有多个由凸起区域（5）围绕的凹形区域（6）。 根据本发明，所述第一层（2），所述第二层（3）和所述第三层（4）形成所述抗反射膜，其具有1.5％或更低的光反射率和3％或更低的波长 为436nm和700nm。

公开(公告)号：EP0826236A1

公开(公告)日：1998-03-04

申请号：EP97908748.0

申请日：1997-03-04

申请人： SYMETRIX CORPORATION ,  MATSUSHITA ELECTRONICS CORPORATION

发明人： HAYASHI, Shinichiro ,  MCMILLAN, Larry, D. ,  AZUMA, Masamichi ,  PAZ DE ARAUJO, Carlos, A.

IPC分类号： H01L21

CPC分类号： H01L21/31691

摘要： A liquid primer is misted, flowed into a deposition chamber (2) and deposited on a substrate (5). A liquid precursor (64) is misted, flowed into a deposition chamber (2) and deposited on the substrate (5). The primer and precursor are dried to form a solid thin film, which is then annealed to form a part of an electronic component (1112) in an integrated circuit (1110), such as the dielectric (1130) in a memory cell. The primer is a solvent, and the precursor includes a metal carboxylate, a metal alkoxide, or a metal alkoxycarboxylate in a precursor solvent. Preferably, the primer and the precursor solvent are the same solvent, such as 2-methodyethanol, xylenes, n-butyl acetate or hexymethyl-disilazane.

公开(公告)号：EP0823725A2

公开(公告)日：1998-02-11

申请号：EP97113592.6

申请日：1997-08-06

申请人： MATSUSHITA ELECTRONICS CORPORATION

发明人： Egashira, Kyoko

IPC分类号： H01L21/311 ,  H01L21/306

CPC分类号： H01L21/31116

摘要： The present invention has an object of providing a method for manufacturing a semiconductor device wherein an underlying silicon substrate or polycrystalline silicon film is less subject to etching during ashing. A method for manufacturing a semiconductor device according to the present invention comprises the steps of: covering a predetermined portion of an insulating film (2) on the silicon substrate (1) or the polycrystalline silicon film with a photoresist (3); removing a portion of said insulating film (2) not covered with the photoresist by dry etching using an etching gas containing carbon and fluorine; and removing a fluorocarbon film (6) deposited on the surface of the substrate and said photoresist 3 by ashing using at least an oxygen gas while controlling the temperature at 100°C or lower, wherein the underlying silicon substrate or polycrystalline silicon film is less subject to etching during the ashing.

摘要翻译： 本发明的目的是提供一种用于制造半导体器件的方法，其中在灰化期间，底层硅衬底或多晶硅膜不易受到蚀刻。 根据本发明的用于制造半导体器件的方法包括以下步骤：用光致抗蚀剂（3）在硅衬底（1）或多晶硅膜上覆盖绝缘膜（2）的预定部分; 使用含有碳和氟的蚀刻气体通过干法蚀刻除去未被所述光致抗蚀剂覆盖的所述绝缘膜（2）的一部分; 和通过使用至少一种氧气在至少100℃或更低的温度下灰化除去沉积在基片表面和所述光致抗蚀剂3上的碳氟化合物膜（6），其中下面的硅基片或多晶硅膜受到的较少 在灰化期间进行蚀刻。

公开(公告)号：EP0822119A2

公开(公告)日：1998-02-04

申请号：EP97305709.4

申请日：1997-07-30

申请人： MATSUSHITA ELECTRONICS CORPORATION

发明人： Shitanaka, Hitokazu ,  Taniuchi, Ryoichi ,  Saitou, Katsuya

IPC分类号： B60Q1/14

CPC分类号： B60Q1/0082 ,  B60Q1/1461 ,  H01H25/008 ,  H01H2019/143 ,  H01H2207/048

摘要： A multifunctional switching apparatus, preferably used as a steering switch (12), comprises a first switching section (13A) selecting a specific combination from a plurality of combinations resulting from any possible combination between operating functions of a second switching section (13B) and operating functions of a third switching section (14A). The second and third switching sections are operable independent of each other in the specific combination selected by the first switching section. One operating key (13) is provided to control a plurality of switching sections (13A, 13B). A display of the operation key (13) is provided to make the judgement of operational function of each switch section easy.

摘要翻译： 优选地用作转向开关（12）的多功能开关装置包括第一开关部（13A），其从由第二开关部（13B）的操作功能和操作之间的任何可能组合产生的多个组合中选择特定组合 第三切换部（14A）的功能。 第二和第三切换部分以由第一切换部分选择的特定组合彼此独立地操作。 提供一个操作键（13）以控制多个切换部分（13A，13B）。 提供操作键（13）的显示，以使每个开关部分的操作功能的判断变得容易。

公开(公告)号：EP0797235A3

公开(公告)日：1998-01-14

申请号：EP97104650.3

申请日：1997-03-19

申请人： MATSUSHITA ELECTRONICS CORPORATION

发明人： Ishii, Akitsugu

IPC分类号： H01J29/64 ,  H01J29/56

CPC分类号： H01J29/701 ,  H01J2229/5687

摘要： A compensating device for raster distortion is provided, which can compensate a raster distortion, preferably including an inner pincushion distortion, by a simple and inexpensive configuration. The compensating device comprises an electromagnet (10) and a pair of permanent magnets (14). The electromagnet (10) is disposed outside of a deflection yoke and at a center portion of a side of a beam-deflection area (31), and generates magnetic poles in the direction along the side. The pair of permanent magnets (14) are disposed beyond the ends of the side, and generate magnetic poles aligned with the magnetic poles of the electromagnet (10).

公开(公告)号：EP0803912A1

公开(公告)日：1997-10-29

申请号：EP96937532.8

申请日：1996-11-07

申请人： MATSUSHITA ELECTRONICS CORPORATION

发明人： TANABE, Mitsuru

IPC分类号： H01L29/812 ,  H01L21/338

CPC分类号： H01L29/66462 ,  H01L21/28587 ,  H01L29/7783

摘要： In a field effect transistor 100 , an InAlAs buffer layer 11 , an InGaAs channel layer 12 , an InAlAs spacer layer 13 , an AlGaAs carrier supplying layer 14 , an InAlAs Schottky layer 15 , and an InGaAs cap layer 16 are provided on an InP substrate 10 in this order. Furthermore, a source electrode 17s , a drain electrode 17d and a gate electrode 18 are formed on the layered structure at prescribed positions. The carrier supplying layer 14 is made of a material that does not cause the silicon, contained therein as a dopant, to be terminated by fluorine. Thus, the field effect transistor 100 having a high transconductance can be formed without causing decrease in a drain current.

摘要翻译： 在场效应晶体管100中，在InP衬底上设置InAlAs缓冲层11，InGaAs沟道层12，InAlAs间隔层13，AlGaAs载体供给层14，InAlAs肖特基层15和InGaAs覆盖层16 10这个顺序。 此外，在规定位置上的层叠结构上形成有源电极17s，漏电极17d和栅电极18。 载体供给层14由不会引起作为掺杂剂含有的硅而被氟终止的材料构成。 因此，可以形成具有高跨导的场效应晶体管100，而不会引起漏极电流的降低。

公开(公告)号：EP0794572A2

公开(公告)日：1997-09-10

申请号：EP97103756.9

申请日：1997-03-06

申请人： MATSUSHITA ELECTRONICS CORPORATION

发明人： Takata, Hirofumi ,  Tanida, Tadashi

IPC分类号： H01L23/495

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K3/3426 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A lead has a thick part having a thickness of 0. 2 mm and a thin part having a thickness of 0. 1 mm. The thin part is formed having a greater width than the thick part for preventing the lead from slipping from a resin. A semiconductor chip is fixed on the thin part using a conductive adhesive. A lateral surface of the thick part and a lateral surface of the resin are simultaneously formed by a single cut so that the thick part's lateral surface is located at a lower end area of the resin's lateral surface and these surfaces are exposed forming the same plane. A bottom surface of the thick part projects by from 0. 03 mm to 0. 05 mm from the resin bottom surface to meet lead stand-off specifications. Thick parts of other leads electrically connected with electrodes on the semiconductor chip with Au wires, are likewise exposed at the resin lateral surface and project from the resin bottom surface. Such arrangements realize high density mounting of electronic components onto a printed board.

摘要翻译： 引线具有厚度为0.2mm的厚部分和厚度为0.1mm的薄部分。 薄部形成为具有比厚部更宽的宽度，以防止铅从树脂上滑落。 使用导电粘合剂将半导体芯片固定在薄部分上。 厚的部分的侧表面和树脂的侧表面同时由单个切口形成，使得厚部的侧表面位于树脂的侧表面的下端区域，并且这些表面暴露形成同一平面。 较厚部分的底面从树脂底面突出0.03-0.05mm，以符合导线限位规格。 在半导体芯片上与Au线电连接的其它引线的厚部同样在树脂侧表面露出并从树脂底表面突出。 这样的布置实现了电子部件在印刷电路板上的高密度安装。

公开(公告)号：EP0792929A1

公开(公告)日：1997-09-03

申请号：EP96103077.2

申请日：1996-02-29

申请人： MATSUSHITA ELECTRONICS CORPORATION

发明人： Hayashi, Masao ,  Minami, Go ,  Matsunaga, Kuniaki ,  Fujii, Tsuyoshi ,  Hayashi, Takashi

IPC分类号： C10M105/48 ,  B21D22/20

CPC分类号： C10M169/04 ,  B21D22/201 ,  C10M105/48 ,  C10M107/34 ,  C10M129/10 ,  C10M129/14 ,  C10M133/12 ,  C10M2201/02 ,  C10M2207/021 ,  C10M2207/023 ,  C10M2207/024 ,  C10M2207/026 ,  C10M2207/027 ,  C10M2207/121 ,  C10M2207/122 ,  C10M2207/32 ,  C10M2207/325 ,  C10M2209/103 ,  C10M2209/1033 ,  C10M2209/104 ,  C10M2209/1045 ,  C10M2209/105 ,  C10M2209/1055 ,  C10M2209/106 ,  C10M2209/1065 ,  C10M2209/1075 ,  C10M2209/1085 ,  C10M2209/109 ,  C10M2209/1095 ,  C10M2215/06 ,  C10M2215/064 ,  C10M2215/065 ,  C10M2215/066 ,  C10M2215/067 ,  C10M2215/068 ,  C10N2240/00 ,  C10N2240/22 ,  C10N2240/30 ,  C10N2240/402 ,  C10N2240/403 ,  C10N2240/404 ,  C10N2240/405 ,  C10N2240/406 ,  C10N2240/407 ,  C10N2240/408 ,  C10N2240/409 ,  C10N2240/50 ,  C10N2240/52 ,  C10N2240/54 ,  C10N2240/56 ,  C10N2240/58 ,  C10N2240/60 ,  C10N2240/66

摘要： In pressing and molding a shadow mask or the like, press-molding oil containing alkyl carbonate shown in the following Chemical Formula as an active ingredient is coated on a press mold. After pressing and molding a metallic material with the press mold, the press-molding oil is washed and removed with warm water. Alternatively, the oil is thermally decomposed. As a result, less than about 10µ g/cm 2 oil is left as residue on the product.
where a and b are an integer from one to six; x and y are an integer from 0 to 30; R 1 and R 2 are an alkyl group, cycloalkyl group, alkylphenyl group, benzyl group or alkylbenzyl group having from one to thirty carbon atoms and straight or branched alkyl chains.

摘要翻译： 在挤压和成型的荫罩或以下化学式作为活性成分的示出的相同，模压油含碳酸烷基酯涂覆在压制模具。 加压成型用压模的金属材料之后，将加压成型油洗涤并用热水除去。 可替代地，所述油被热分解。 其结果是，小于约10微米克/厘米<2>油被留下作为在产品上的残留物。 其中a和b是在从一个到六个整数; x和y是从0至30的整数; [R <1>和R <2>是关烷基，环烷基，烷基苯基，苄基或具有1到30个碳原子和直链或支链烷基链烷基苄基。

公开(公告)号：EP0790652A1

公开(公告)日：1997-08-20

申请号：EP96925131.3

申请日：1996-07-30

申请人： MATSUSHITA ELECTRONICS CORPORATION

发明人： SANO, Yoshikazu 3-30-702, Yuhigaoka-cho ,  TERAKAWA, Sumio ,  TSUJII, Eiichi ,  ASAUMI, Masaji 1017 go, Manhaimugojo ,  CHATANI, Yoshikazu

IPC分类号： H01L27/148

CPC分类号： H01L31/02002 ,  H01L27/14618 ,  H01L27/148 ,  H01L31/0203 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00

摘要： A lead frame 24 comprising an inner lead 22 and outer lead 23 is sealingly filled from a through-hole into a package 21. A CCD chip 27 is inserted from an inlet 26 into the package 21. An electrode pad 28 is connected to the inner lead 22 via a bump 29 to complete an optical positioning and an electrical connection, then the positions of these components are fixed by glue. As a result, a solid-state image sensing apparatus can be manufactured at a low cost, and an accurate positioning can be realized. Thus, the solid-state image sensing apparatus can be employed to a video camera of high quality picture to reproduce vivid colors and fine pictures.

公开(公告)号：EP0790632A1

公开(公告)日：1997-08-20

申请号：EP97106574.3

申请日：1995-08-29

申请人： MATSUSHITA ELECTRONICS CORPORATION

发明人： Honda, Masanobu ,  Shimada, Koji

IPC分类号： H01J29/76

CPC分类号： H01J29/762 ,  H01J2229/7032

摘要： A deflection yoke which is capable of sufficiently reducing a high order raster distortion (gullwing) at the upper and lower edges of the screen without damaging coil wires of the screen side flange portion at the time of winding the horizontal deflection coil. A deflection yoke is formed with a saddle shaped horizontal deflection coil (30), a saddle shaped vertical deflection coil (31) located outside the horizontal deflection coil, and a ferrite core (32) located outside the vertical deflection coil.
The center portion of the screen side flange portion of one selected from the group consisting of the saddle (24) shaped horizontal deflection coil and the saddle shaped vertical deflection coil forms a projection towards the screen side.