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公开(公告)号：EP1480291A3
公开(公告)日：2007-09-19
申请号：EP04011712.9
申请日：2004-05-18
Applicant: Muck, Siegfried
Inventor： Muck, Siegfried , König, Sibyll , Kleikemper, Vera
IPC: H01R12/04
CPC classification number: H01R12/62 , H01R43/0221 , H01R43/0263 , H05K3/363 , H05K3/4007 , H05K2201/091 , H05K2201/09172 , H05K2203/167
Abstract: Die vorliegende Erfindung betrifft eine elektronische Baugruppe (1) mit einer eine Leiterbahnstruktur (22) aufweisenden Leiterplatte (2) und mit einer eine Leiterbahnstruktur (32) aufweisenden Leiterfolie (3). Erfindungsgemäß ist mindestens eine die Leiterbahnstruktur (22) der Leiterplatte (2) und die Leiterbahnstruktur (32) der Leiterfolie (3) in einem Kontaktierungsbereich (34) kontaktierende, durch Löten eines auf der Leiterbahnstruktur (22) der Leiterplatte (2) angeordneten Kontaktflecks (24) gebildete Kontaktstelle (11) an einer elektronischen Bauteilen (6) der Leiterplatte (2) gegenüberliegenden Oberflächenseite (21) vorgesehen. Dabei sind erfindungsgemäß an der Leiterfolie (3) zu den Kontaktflecken (24) auf der Leiterbahnstruktur (22) der Leiterplatte (2) korrespondierende Ausformungen (37) vorgesehen. Weiterhin betrifft die Erfindung ein Herstellungsverfahren für die etektronische Baugruppe (1) und eine entsprechend ausgestaltete Leiterfolie (3).
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92.发明公开Flexible substrate and a connection method thereof that can achieve reliable connection 有权柔性基板及其连接方法，这确保了可靠的连接
公开(公告)号：EP1494319A3
公开(公告)日：2007-03-14
申请号：EP04253449.5
申请日：2004-06-10
Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
CPC classification number: H01R12/62 , H01R4/02 , H01R43/0263 , H05K3/305 , H05K3/3473 , H05K3/3494 , H05K3/363 , H05K3/403 , H05K2201/09172 , H05K2203/0195 , H05K2203/0415 , Y10T29/49126 , Y10T428/24322
Abstract: A flexible substrate (10) is connectable to electrodes (16) of an external member (12). The flexible substrate (10) includes a base material (13) having flexibility and including an insulative base film (20) and a conductive film (21). Lead parts (15) are arranged on an end of the base material (13). Slits (18) are formed between the lead parts (15).
Abstract translation: 柔性基板（10）是一个外部部件（12）的可连接到电极（16）。 柔性基板（10），包括具有柔性和包括绝缘基膜（20）和导电膜（21）的基体材料（13）。 引线部（15）被布置在所述基体材料（13）的端部。 狭缝（18）的引线部（15）之间形成。
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93.发明公开Flexible substrate and a connection method thereof that can achieve reliable connection 有权柔性基板及其连接方法，这确保了可靠的连接
公开(公告)号：EP1494319A2
公开(公告)日：2005-01-05
申请号：EP04253449.5
申请日：2004-06-10
Applicant: Shinko Electric Industries Co., Ltd.
CPC classification number: H01R12/62 , H01R4/02 , H01R43/0263 , H05K3/305 , H05K3/3473 , H05K3/3494 , H05K3/363 , H05K3/403 , H05K2201/09172 , H05K2203/0195 , H05K2203/0415 , Y10T29/49126 , Y10T428/24322
Abstract: A flexible substrate (10) is connectable to electrodes (16) of an external member (12). The flexible substrate (10) includes a base material (13) having flexibility and including an insulative base film (20) and a conductive film (21). Lead parts (15) are arranged on an end of the base material (13). Slits (18) are formed between the lead parts (15).
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公开(公告)号：EP1480291A2
公开(公告)日：2004-11-24
申请号：EP04011712.9
申请日：2004-05-18
Applicant: Muck, Siegfried
Inventor： Muck, Siegfried , König, Sibyll , Kleikemper, Vera
IPC: H01R12/04
CPC classification number: H01R12/62 , H01R43/0221 , H01R43/0263 , H05K3/363 , H05K3/4007 , H05K2201/091 , H05K2201/09172 , H05K2203/167
Abstract: Die vorliegende Erfindung betrifft eine elektronische Baugruppe (1) mit einer eine Leiterbahnstruktur (22) aufweisenden Leiterplatte (2) und mit einer eine Leiterbahnstruktur (32) aufweisenden Leiterfolie (3). Erfindungsgemäß ist mindestens eine die Leiterbahnstruktur (22) der Leiterplatte (2) und die Leiterbahnstruktur (32) der Leiterfolie (3) in einem Kontaktierungsbereich (34) kontaktierende, durch Löten eines auf der Leiterbahnstruktur (22) der Leiterplatte (2) angeordneten Kontaktflecks (24) gebildete Kontaktstelle (11) an einer elektronischen Bauteilen (6) der Leiterplatte (2) gegenüberliegenden Oberflächenseite (21) vorgesehen. Dabei sind erfindungsgemäß an der Leiterfolie (3) zu den Kontaktflecken (24) auf der Leiterbahnstruktur (22) der Leiterplatte (2) korrespondierende Ausformungen (37) vorgesehen. Weiterhin betrifft die Erfindung ein Herstellungsverfahren für die etektronische Baugruppe (1) und eine entsprechend ausgestaltete Leiterfolie (3).
Abstract translation: 接触点（CP）（11）接触印刷电路板（PSB）（2）条状导体结构（SCS）（22）和导体箔（CF）（3）SCS（32），并通过焊接触点 （CS）（24）在PSB的SCS上。 CP位于面向PSB的电子部件（6）的表面侧（21）上。 在CF上，有一些模式可以匹配PSB的SCS上的每个CS。 还包括以下独立权利要求：（a）具有载体的导体箔，支撑带状导体结构的电路载体和用于电路载体的覆盖物; （b）以及用于生产用于处理测试信号和/或特定功能/部件的电子控制装置的电子部件组件的方法。
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95.发明授权
公开(公告)号：EP0710432B1
公开(公告)日：2004-01-02
申请号：EP94914305.1
申请日：1994-05-18
Applicant: Dyconex AG
Inventor： SCHMIDT, Walter , MARTINELLI, Marco
CPC classification number: H05K3/403 , H01L21/4857 , H01L23/5387 , H01L2924/0002 , H05K1/0218 , H05K1/0393 , H05K1/118 , H05K3/0041 , H05K3/0052 , H05K3/3442 , H05K3/363 , H05K3/427 , H05K3/428 , H05K3/4652 , H05K2201/09063 , H05K2201/09081 , H05K2201/0909 , H05K2201/09172 , H05K2203/0554 , H05K2203/0557 , Y10T29/49121 , Y10T29/49171 , Y10T428/24917 , H01L2924/00
Abstract: A process is disclosed for manufacturing printed circuit boards, printed circuit foils and semifinished products for printed circuit boards and printed circuit foils from blanks with electroconductive layers (7, 8) that may be structured into conductive patterns and substrates (4) that may be structured for forming connecting means (V), profiles (K) and conductive patterns (L). The connecting means (V), profiles (K) and conductive patterns (L) are structured at the same time or in the same process steps on the blanks. The connecting means (V) and the profiles (K) are part of the structured substrate (4) of the blanks. The electric or mechanical connecting means (V) are placed in a position in which they may be connected and the finished conductive patterns (L) may be detached around the profiles (K).
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Patent Agency Ranking
公开(公告)号：EP0917163B1
公开(公告)日：2003-04-16
申请号：EP98308301.5
申请日：1998-10-13
Applicant: SUN MICROSYSTEMS, INC.
Inventor： Rowley, Anna K. , Murton, Robert G. , Walker, Donald E.
CPC classification number: H05K1/165 , H01F17/0013 , H05K3/4611 , H05K2201/086 , H05K2201/09063 , H05K2201/09172
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公开(公告)号：EP1183916A1
公开(公告)日：2002-03-06
申请号：EP00938710.1
申请日：2000-05-30
Applicant: TYCO Electronics Logistics AG
Inventor： FRISCH, Michael , WINKENS, Bernd
CPC classification number: H05K3/366 , H01L25/162 , H01L2924/0002 , H05K1/144 , H05K2201/048 , H05K2201/09172 , H05K2201/09645 , H01L2924/00
Abstract: According to the invention, the power substrate is used as a base plate in a housing (1) which, together, form a standardized power part from whose top surface (11) connection pins (5) project. Said projection pins are soldered inside interfacial connection via holes of the control printed circuit board (4). The printed circuit board (4) comprises contact pads (7) which are located in an open strip area (6) and which serve as control terminals and power terminals by means of which the module can be soldered directly into the slotted opening of a system printed circuit board (8).
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公开(公告)号：EP0917163A2
公开(公告)日：1999-05-19
申请号：EP98308301.5
申请日：1998-10-13
Applicant: SUN MICROSYSTEMS, INC.
Inventor： Rowley, Anna K. , Murton, Robert G. , Walker, Donald E.
IPC: H01F27/28
CPC classification number: H05K1/165 , H01F17/0013 , H05K3/4611 , H05K2201/086 , H05K2201/09063 , H05K2201/09172
Abstract: A magnetic component assembly includes a circuit board having at least one layer. A first winding is provided on at least one surface of a layer of the circuit board and a further winding is provided on the same or a different surface of the circuit board. A first magnetic core is associated with the first winding to define a first magnetic component and a further magnetic core is associated with the further winding to define a further magnetic component. There is thereby provided an assembly of two or more magnetic components integrated in a single circuit board providing an efficient space saving configuration. A particular application relates to the provision of integrated magnetic components for power supplies.
Abstract translation: 磁性部件组件包括具有至少一个层的电路板。 第一绕组设置在电路板的一层的至少一个表面上，另一绕组设置在电路板的相同或不同的表面上。 第一磁芯与第一绕组相关联以限定第一磁性部件，并且另一磁芯与另一绕组相关联以限定另外的磁性部件。 由此提供集成在单个电路板中的两个或更多个磁性部件的组件，提供有效的节省空间的配置。 具体应用涉及为电源提供集成磁性部件。
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公开(公告)号：EP0714591B1
公开(公告)日：1997-03-19
申请号：EP94923470.2
申请日：1994-07-14
Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY
Inventor： BIERNATH, Rolf, W.
CPC classification number: H01R12/721 , H05K1/117 , H05K3/326 , H05K2201/0133 , H05K2201/09163 , H05K2201/09172
Abstract: A printed circuit board (10) capable of resilient deformation having two major surfaces and a contact edge (18). Electrically conductive traces (14, 24) are provided on each major surface of the board which lead to electrically conductive contact pads (16, 26) at the contact edge of the board. A gap (22) is provided between the two major surfaces of the board along the contact edge. The gap permits resilient deformation of the board so that a force is created upon deformation which will bias the major surfaces toward their undeformed position. An elastomeric biasing member (28) may be provided in the gap.
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公开(公告)号：EP0461702B1
公开(公告)日：1995-08-30
申请号：EP91201354.7
申请日：1991-06-04
Applicant: FRAMATOME CONNECTORS BELGIUM N.V.
Inventor： Schoss, Udo Hermann , Morlion, Danny Louis Cornelis
CPC classification number: H05K1/118 , H01R12/721 , H01R12/737 , H01R13/03 , H05K1/05 , H05K3/0058 , H05K3/3447 , H05K3/365 , H05K2201/0311 , H05K2201/044 , H05K2201/09172 , H05K2203/302
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