公开(公告)号：EP3324712A3

公开(公告)日：2018-07-25

申请号：EP17201960.6

申请日：2017-11-15

Applicant: ASUSTeK Computer Inc.

Inventor： LIN, Bing-Min ,  NG, Teng-Liang ,  TAN, Ji-Kuang ,  TSAI, Ming-Fang ,  LIN, Chih-Kuang

IPC: H05K1/14 ,  H05K1/02 ,  G06F1/18 ,  G06F1/20 ,  G06F11/30 ,  G06F11/32

CPC classification number: H05K1/181 ,  G06F1/183 ,  G06F1/20 ,  G06F11/3058 ,  G06F11/325 ,  G08B5/38 ,  H05K1/0274 ,  H05K1/18 ,  H05K7/20172 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09172 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2201/10522

Abstract: A motherboard is provided. The motherboard includes a main body, a notch formed at a side edge of the main body, and a fixing device formed adjacent to the notch to fix an auxiliary device. The function of the motherboard is expanded significantly while artistic of the appearance of the motherboard is improved.

公开(公告)号：EP2937940A1

公开(公告)日：2015-10-28

申请号：EP15163956.4

申请日：2015-04-17

Applicant: Fujitsu Component Limited

Inventor： Kondo, Takahiro ,  Miki, Yasuyuki ,  Sato, Koki ,  Kobayashi, Mitsuru

IPC: H01R12/52 ,  H01R13/03 ,  H01R13/6473 ,  H05K1/05 ,  H05K1/11 ,  H01R13/6585

CPC classification number: H01R12/79 ,  H01R12/52 ,  H01R12/775 ,  H01R13/035 ,  H01R13/6473 ,  H01R13/6585 ,  H05K1/05 ,  H05K1/056 ,  H05K1/117 ,  H05K1/147 ,  H05K2201/09172 ,  H05K2201/09236

Abstract: A connector includes a terminal (120A) including a base (121A), first extension parts (122A) that extend from the base toward a first end of the connector and second extension parts (123A) that extend from the base toward a second end of the connector; an insulating layer (124) formed on the terminal; a signal line (125) that is formed on the insulating layer and extends from an end of one of the first extension parts to an end of one of the second extension parts, the signal line being connected to a signal wire of a board; and a ground line (126) that is formed on the insulating layer, is electrically connected to the terminal, and extends from an end of another one of the first extension parts to an end of another one of the second extension parts, the ground line being connected to a ground wire of the board.

Abstract translation: 连接器包括：端子（120A），包括基座（121A），从基座朝向连接器的第一端延伸的第一延伸部分（122A）和从基座朝向连接器的第二端延伸的第二延伸部分（123A） 连接器 形成在所述端子上的绝缘层（124） 信号线（125），形成在所述绝缘层上并从所述第一延伸部分之一的端部延伸到所述第二延伸部分之一的一端，所述信号线连接到板的信号线; 和形成在所述绝缘层上的接地线（126）电连接到所述端子，并且从所述第一延伸部分中的另一个延伸部分的另一个端部延伸到所述第二延伸部分中的另一个的端部，所述接地线 连接到电路板的接地线。

公开(公告)号：EP2560242A1

公开(公告)日：2013-02-20

申请号：EP11768859.8

申请日：2011-04-12

Applicant: Yazaki Corporation

Inventor： TAKAMURA, Naoki ,  KUROSAWA, Tohru

IPC: H01R12/72 ,  H01L27/14 ,  H01R12/71 ,  H01R12/77 ,  H04N5/225

CPC classification number: H05K5/0026 ,  G03B17/02 ,  H01L27/14618 ,  H01L27/14806 ,  H01L2924/0002 ,  H01R12/51 ,  H01R12/721 ,  H01R13/05 ,  H01R2201/26 ,  H04N5/2253 ,  H04N5/2257 ,  H05K1/117 ,  H05K2201/0311 ,  H05K2201/09172 ,  H01L2924/00

Abstract: Disclosed is an electronic component which maintains good connection between a circuit board and connection terminals connected to the circuit board and provides size reduction. The electronic component (1) comprises a circuit board (4), a pair of connection terminals (7) connected to the circuit board (4), and a housing (5) with the pair of connection terminals (7) mounted thereon. The circuit board (4) is provided with a plurality of terminal sections (43) connected to the connection terminals (7). Each connection terminal in the pair of connection terminals (7) is provided with a spring member (72) formed to be elastically deformable and which sandwich the terminal sections (43) between them. A rib (57) is provided in the housing (5), wherein the rib is provided between through-holes (54) through which each of the pair of connection terminals (7) pass, and whereby the rib (57) is formed in convex shape, towards the circuit board (4) and away from a bottom section (56a) of a substrate housing section (56) in which the circuit board (4) is housed, and the rib (57) penetrates a plurality of terminal sections (43).

Abstract translation: 公开了一种电子部件，其保持电路板和连接到电路板的连接端子之间的良好连接并且减小尺寸。 电子部件（1）包括电路板（4），连接到电路板（4）的一对连接端子（7）以及其上安装有一对连接端子（7）的壳体（5）。 电路板（4）设有连接到连接端子（7）的多个端子部分（43）。 一对连接端子7中的每个连接端子设置有弹性构件72，弹性构件72形成为可弹性变形并且将端子部43夹在它们之间。 在壳体（5）中设置有肋（57），其中肋设置在一对连接端子（7）中的每一个所穿过的通孔（54）之间，并且由此肋（57）形成在 朝向电路板（4）并远离其中容纳电路板（4）的基板壳体部分（56）的底部部分（56a），并且肋（57）穿过多个端子部分 （43）。

公开(公告)号：EP1480291B1

公开(公告)日：2010-02-10

申请号：EP04011712.9

申请日：2004-05-18

Applicant: Muck, Siegfried

Inventor： Muck, Siegfried ,  König, Sibyll ,  Kleikemper, Vera

IPC: H01R12/04

CPC classification number: H01R12/62 ,  H01R43/0221 ,  H01R43/0263 ,  H05K3/363 ,  H05K3/4007 ,  H05K2201/091 ,  H05K2201/09172 ,  H05K2203/167

公开(公告)号：EP1909545A2

公开(公告)日：2008-04-09

申请号：EP07117064.1

申请日：2007-09-24

Applicant: Deere & Company

Inventor： Livdahl, Richard J ,  Hawk, Nathan M ,  Johnston, Travis L ,  Segal, Vincent G ,  Wyland, Amanda R ,  Janssen, Dale A ,  Duppong, Jeffrey S

IPC: H05K3/30 ,  H05K7/14

CPC classification number: H05K3/366 ,  H05K3/301 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/10598 ,  H05K2201/10606

Abstract: A circuit board carrier (20) for mounting a first printed circuit board (12) in relation to a second printed circuit board (16) comprises:
a flat base (36) for abutting said second circuit board (16);
a pair of wings (38) on laterally opposite sides of said base (36), each said wing (38) including a snap-in feature (44) for snap engagement with a corresponding hole (46) in said second circuit board (16); and
at least one slot guide (40) for retaining a lateral edge of said first printed circuit board (12).

Abstract translation: 一种用于相对于第二印刷电路板（16）安装第一印刷电路板（12）的电路板载体（20）包括：用于邻接所述第二电路板（16）的平坦基座（36）; 在所述基座（36）的横向相对侧上的一对翼（38），每个所述翼（38）包括卡扣特征（44），用于与所述第二电路板（16）中的对应孔（46）卡扣接合 ）; 以及用于保持所述第一印刷电路板（12）的侧边缘的至少一个狭槽引导件（40）。

公开(公告)号：EP1056319A2

公开(公告)日：2000-11-29

申请号：EP00109876.3

申请日：2000-05-10

Applicant: SEW-EURODRIVE GMBH & CO.

Inventor： Rusnak, Reinhold

IPC: H05K3/36

CPC classification number: H05K3/366 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2203/0455

Abstract: Tochterplatine zum Einsetzen in eine Mutterplatine, wobei mindestens eine Lötverbindung zwischen Tochterplatine und Mutterplatine besteht, wobei die Tochterplatine mindestens zwei Zungen aufweist, die in Bohrlöcher der Mutterplatine einsetzbar sind.

Abstract translation: 主板（1）具有设置在金属化垫（6）中间的多个钻孔（5）。 子板（具有与孔相同间距的突出凸耳制成，表面有金属轨道（3），插入时，表面焊接在一起。

公开(公告)号：EP0697804B1

公开(公告)日：2000-02-09

申请号：EP95108378.1

申请日：1995-06-01

Applicant: KRONE Aktiengesellschaft

Inventor： Kerndlmaier, Walter, Dr.

IPC: H05K1/02 ,  H01R24/00

CPC classification number: H05K1/0228 ,  H01R4/2429 ,  H01R12/721 ,  H01R13/6466 ,  H01R13/6469 ,  H01R2201/16 ,  H04Q1/142 ,  H05K1/117 ,  H05K1/162 ,  H05K2201/09172 ,  H05K2201/09245 ,  H05K2201/09672 ,  H05K2201/10189

公开(公告)号：EP0651598B1

公开(公告)日：1999-06-30

申请号：EP94203095.8

申请日：1994-10-25

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Frisch, Wilhelm ,  Kaiser, Werner, Dipl.-Ing. (TU) ,  Ott, Gerhard, Dipl.-Ing. (FH) ,  Kettschau, Hans-Jürgen, Dipl.-Ing. ,  Ludwig, Uwe, Dipl.-Ing. (FH) ,  Ziegler, Bernhard, Dipl.-Ing. (FH)

IPC: H05K1/14 ,  H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0278 ,  H05K1/05 ,  H05K1/141 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/366 ,  H05K2201/046 ,  H05K2201/066 ,  H05K2201/09036 ,  H05K2201/09172 ,  H05K2203/1572 ,  H05K2203/302

公开(公告)号：EP0710432A1

公开(公告)日：1996-05-08

申请号：EP94914305.0

申请日：1994-05-18

Applicant: DYCONEX PATENTE AG

Inventor： SCHMIDT, Walter ,  MARTINELLI, Marco

IPC: H01L21 ,  H01L23 ,  H05K3 ,  H05K1

CPC classification number: H05K3/403 ,  H01L21/4857 ,  H01L23/5387 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/0041 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/363 ,  H05K3/427 ,  H05K3/428 ,  H05K3/4652 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/0909 ,  H05K2201/09172 ,  H05K2203/0554 ,  H05K2203/0557 ,  Y10T29/49121 ,  Y10T29/49171 ,  Y10T428/24917 ,  H01L2924/00

Abstract: A process is disclosed for manufacturing printed circuit boards, printed circuit foils and semifinished products for printed circuit boards and printed circuit foils from blanks with electroconductive layers (7, 8) that may be structured into conductive patterns and substrates (4) that may be structured for forming connecting means (V), profiles (K) and conductive patterns (L). The connecting means (V), profiles (K) and conductive patterns (L) are structured at the same time or in the same process steps on the blanks. The connecting means (V) and the profiles (K) are part of the structured substrate (4) of the blanks. The electric or mechanical connecting means (V) are placed in a position in which they may be connected and the finished conductive patterns (L) may be detached around the profiles (K).

公开(公告)号：EP0651598A1

公开(公告)日：1995-05-03

申请号：EP94203095.8

申请日：1994-10-25

Applicant: Philips Patentverwaltung GmbH ,  PHILIPS ELECTRONICS N.V.

Inventor： Frisch, Wilhelm ,  Kaiser, Werner, Dipl.-Ing. (TU) ,  Ott, Gerhard, Dipl.-Ing. (FH) ,  Kettschau, Hans-Jürgen, Dipl.-Ing. ,  Ludwig, Uwe, Dipl.-Ing. (FH) ,  Ziegler, Bernhard, Dipl.-Ing. (FH)

IPC: H05K1/14 ,  H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0278 ,  H05K1/05 ,  H05K1/141 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/366 ,  H05K2201/046 ,  H05K2201/066 ,  H05K2201/09036 ,  H05K2201/09172 ,  H05K2203/1572 ,  H05K2203/302

Abstract: Die Erfindung bezieht sich auf ein elektronisches Schaltungsmodul mit einer Leiterplatte (1) mit einer elektrisch isolierende Schicht (2), die eine erste Metallschicht zur Bildung von Leiterbahnen und zum Tragen von oberflächenmontierbaren Bauelementen aufweist.
Um den Platzbedarf des elektronischen Schaltungsmoduls zu verringern wird vorgeschlagen, daß die Leiterplatte (1) mindestens eine Biegekante aufweist, an der die elektrisch isolierende Schicht eine Vertiefung aufweist und um die ein Abschnitt der Leiterplatte umgebogen ist.

Abstract translation: 本发明涉及具有电绝缘层（2）的印刷电路板（1）的电子电路模块，其具有第一金属层以形成导体轨道，并且为了支撑表面安装的部件（表面安装 设备，SMD）。 为了减少电子电路模块的空间要求，提出了印刷电路板（1）具有至少一个弯曲边缘，电绝缘层在其上具有凹陷，并且印刷电路板的一部分 弯曲。