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    Semiconductor element string structure
    93.
    发明公开
    Semiconductor element string structure 失效
    半导体元素结构

    公开(公告)号：EP0468139A3

    公开(公告)日：1992-03-04

    申请号：EP91105327.0

    申请日：1991-04-04

    Applicant: Mii, Adam

    Inventor： Mii, Adam

    IPC: H01L33/00 ,  G09F9/33 ,  H01L23/495

    CPC classification number: H01L33/62 ,  H01L25/13 ,  H01L2924/0002 ,  H05K1/18 ,  H05K2201/10106 ,  H05K2201/1053 ,  H05K2201/10757 ,  H05K2201/10924 ,  H01L2924/00

    Abstract: A semiconductor element string has a number of semiconductor elements (1), each of which has the first and second leads (14 and 15) mounted on a transverse plate (2). The first leads (14) are cut off from the transverse plate (2), when the semiconductor element string is to be mounted on the printed circuit board (3). The second leads (15) connected to the transverse plate (2) serve as the ground lines for the respective semiconductor elements by bending two distal ends of the transverse plate (2) to be mounted on the printed circuit board (3). A linking piece (13) is provided crossing over the middle portions of the first and second leads (14 and 15) so as to make the whole construction more stable. The second leads (15) are bent into a S-shaped structure. Each second lead (15) and its corresponding first lead (14) are located on a first vertical plane which intersects with a second vertical plane (X-Z) passing through a common longitudinal axis of the semiconductor element string by an angle.

    Electrical assembly
    96.
    发明公开
    Electrical assembly 失效
    电气总成

    公开(公告)号：EP0268953A3

    公开(公告)日：1990-03-14

    申请号：EP87116785.4

    申请日：1987-11-13

    Applicant: International Business Machines Corporation

    Inventor： Simpson, John Patrick

    IPC: H05K3/34 ,  H05K1/18 ,  H05K3/30

    CPC classification number: H05K3/3426 ,  H05K1/0271 ,  H05K2201/09418 ,  H05K2201/10704 ,  H05K2201/10757 ,  Y02P70/613

    Abstract: An electrical assembly having an integrated circuit package (14) which has a plurality of electrical conductors (22) fixed thereto. The electrical conductors form mechanical and electrical connections. Each of the electrical conductors has a root (24) at one end and a tip (32) at the other end. The root of each conductor is attached to the integrated circuit package to form a fixed electrical and mechanical connection. The tip of each conductor is adapted to be connected to a sur­face at a predetermined location. Each of the electrical con­ductors has at least two bends (26, 28) between the root and the tip for providing strain relief when the tip is connected to a surface.

    Package for integrated devices
    97.
    发明公开
    Package for integrated devices 失效
    Gehäusefürintegrierte Schaltungen。

    公开(公告)号：EP0287870A2

    公开(公告)日：1988-10-26

    申请号：EP88105164.3

    申请日：1988-03-30

    Applicant: SGS-THOMSON MICROELECTRONICS S.r.l.

    Inventor： Massironi, Angelo

    IPC: H05K3/30

    CPC classification number: H01L23/49548 ,  H01L2924/0002 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/09709 ,  H05K2201/10696 ,  H05K2201/10757 ,  H05K2201/10871 ,  H01L2924/00

    Abstract: This package for integrated devices, to be fixed on supporting plates, in particular on printed circuits, comprises contact pins (5a,5b) to be inserted in holes (2) of the supporting plates (1) and to be soldered thereto. To prevent overturning of the package, which may lead to short circuits among the components, at least some (5a) of the contact pins are provided with protruding portions (10) defining abutments cooperating with the supporting plate to limit the inclination of the package with respect to the plate.

    Abstract translation: 用于固定在支撑板上，特别是印刷电路上的集成器件的封装包括插入支撑板（1）的孔（2）中并被焊接到其上的接触销（5a，5b）。 为了防止包装翻倒，这可能导致部件之间的短路，接触销的至少一些（5a）设置有限定与支撑板配合的支座的突出部分（10），以限制包装件的倾斜度， 尊重盘子。

    WORKING MACHINE
    98.
    发明公开
    WORKING MACHINE 审中-公开
    工作机器

    公开(公告)号：EP3291658A1

    公开(公告)日：2018-03-07

    申请号：EP15890699.0

    申请日：2015-04-27

    Applicant: Fuji Machine Mfg. Co., Ltd.

    Inventor： OTSUBO, Satoru ,  DEGURA, Kazuya

    IPC: H05K3/34 ,  H05K13/04

    CPC classification number: H05K13/043 ,  H05K3/306 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/3468 ,  H05K13/0069 ,  H05K13/04 ,  H05K2201/1059 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2203/0195 ,  H05K2203/044

    Abstract: With the work machine of the present invention, flow device 100 for flowing molten solder from under a circuit board, and backup pin 124 for supporting the circuit board from below while a lead of a leaded component is being inserted into a through-hole, are moved separately under the circuit board. Thus, when the circuit board needs to be supported, the backup pin can be moved to any position, and when solder needs to be applied, the backup pin can be moved to a position that does not obstruct operation of the flow device. Accordingly, as well as guaranteeing operation of the flow device, it is possible to support the circuit board with the backup pin as required, thus improving practicality of the work machine.

    Abstract translation: 在本发明的作业机械中，在引线部件的引线插入到通孔中的同时，用于从电路板下方流动熔融焊料的流动装置100和用于从下方支撑电路板的支撑销124是 在电路板下单独移动。 因此，当需要支撑电路板时，支撑销可以移动到任何位置，并且当需要施加焊料时，支撑销可以移动到不妨碍流动装置的操作的位置。 因此，除了保证流量装置的操作以外，还可以根据需要用支撑销支撑电路板，从而提高作业机械的实用性。

    CONICAL INDUCTOR, PRINTED CIRCUIT BOARD AND OPTICAL MODULE
    100.
    发明公开
    CONICAL INDUCTOR, PRINTED CIRCUIT BOARD AND OPTICAL MODULE 审中-公开
    KONISCHE INDUKTIONSSPULE，LEITERPLATTE UND OPTISCHES MODUL

    公开(公告)号：EP3113197A1

    公开(公告)日：2017-01-04

    申请号：EP14885422.7

    申请日：2014-10-28

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： CHEN, Tewei ,  FU, Huili ,  ZHAO, Nan

    IPC: H01F19/00 ,  H01F27/29 ,  H05K1/18

    CPC classification number: H05K1/181 ,  H01F5/00 ,  H01F19/00 ,  H01F27/292 ,  H01F2005/006 ,  H05K3/3426 ,  H05K2201/1003 ,  H05K2201/10121 ,  H05K2201/10757 ,  Y02P70/613

    Abstract: Embodiments of the present invention provide a conical inductor, a printed circuit board, and an optical module, and relate to the field of communications technologies. By changing a pin of the conical inductor, accuracy of alignment between the pin of the conical inductor and a pad of the printed circuit board is improved, and pseudo soldering of the conical inductor is also reduced. The conical inductor provided in the embodiments of the present invention includes: a housing, a conical coil located inside the housing, and two pins respectively connected to two ends of the conical coil, where one end of the first pin is connected to one end of the conical coil, the other end of the first pin is connected to a hole in the first side wall in a fastened manner, one end of the second pin is connected to the other end of the conical inductor, and the other end of the second pin is connected to a hole in the second side wall in a fastened manner; and each of the first pin and the second pin includes one segment of waveform segment fluctuating in a direction perpendicular to the top wall, where each trough of the waveform segment is connected to the printed circuit board in a fastened manner.

    Abstract translation: 本发明的实施例提供了一种锥形电感器，印刷电路板和光学模块，并且涉及通信技术领域。 通过改变锥形电感器的引脚，锥形电感器的引脚与印刷电路板的焊盘之间的对准精度得到改善，锥形电感器的伪焊接也减少了。 在本发明的实施例中提供的锥形电感器包括：外壳，位于壳体内的锥形线圈，以及分别连接到锥形线圈的两端的两个销，其中第一销的一端连接到 锥形线圈，第一销的另一端以紧固方式连接到第一侧壁中的孔，第二销的一端连接到锥形电感器的另一端，第二销的另一端 销以紧固的方式连接到第二侧壁中的孔; 并且第一销和第二销中的每一个包括在垂直于顶壁的方向上波动的一段波形段，其中波形段的每个槽以紧固的方式连接到印刷电路板。

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