公开(公告)号：EP1301446A1

公开(公告)日：2003-04-16

申请号：EP01960360.4

申请日：2001-06-22

申请人： Bayer Aktiengesellschaft

发明人： MAGER, Michael ,  WUSSOW, Klaus ,  GUNTERMANN, Udo

IPC分类号： C03C17/34 ,  C03C17/42 ,  C04B41/52 ,  C08J7/04 ,  H01B1/12 ,  C09D4/00 ,  C09D181/02 ,  C09D181/06

CPC分类号： C03C17/3405 ,  C03C17/42 ,  Y10T428/31663

摘要： The invention relates to coatings on moulded bodies, said coatings being conductive and highly resistant to abrasion, comprising at least one conductive layer and at least one layer which is highly resistant to abrasion. The invention also relates to a method for the production and use thereof.

公开(公告)号：EP1153001B1

公开(公告)日：2003-01-02

申请号：EP00901176.8

申请日：2000-01-25

申请人： RHODIA CHIMIE

发明人： CHAUFFRIAT, Henri ,  ROCHER, Laurent

IPC分类号： C04B41/52 ,  C03C17/42 ,  B01J35/00 ,  B05D7/00

CPC分类号： B01J35/00 ,  B05D5/08 ,  B05D7/00 ,  B08B17/00 ,  C03C17/42 ,  C04B41/50 ,  C04B41/52 ,  C09D5/16 ,  C09D183/06 ,  C09D183/16

公开(公告)号：EP0996603B1

公开(公告)日：2002-06-26

申请号：EP98928336.1

申请日：1998-05-29

申请人： dmc2 Degussa Metals Catalysts Cerdec AG ,  British Ceramic Research Limited

发明人： SCHRIENER, Andreas ,  TRIPTRAP, Herbert ,  JACKSON, Philip, Robert ,  WITHINGTON, Steven, Charles ,  SHINGLER, David

IPC分类号： C04B41/52 ,  C04B41/45 ,  C03C8/22

CPC分类号： C04B41/009 ,  C03C8/16 ,  C03C8/22 ,  C04B41/4568 ,  C04B41/81 ,  C04B41/4578 ,  C04B41/5022 ,  C04B41/52 ,  C04B33/00

摘要： Hitherto, glazing defects have arisen during glazing of ceramic substrates with an electrostatically applicable coating powder. This problem is solved by the inventive coating powder CPAB and the coating method. The electrostatically applicable coating powder CPAB contains 1 to 50 wt. % of a glass-forming composition A which begins softening at 400 to 750 °C and 99 to 50 wt. % of a glass-forming composition B which begins to soften above 750-1,100 °C. Preferably, the coating powder consists of 2.5 to 25 wt. % A, 75 to 97.5 wt. % B and 0 to 20 wt. %, specially 2 to 10 wt. % of thermally or chemically activatable adhesive agents. The coating powder CPAB is electrostatically applied as a single powder. Alternately, coating can be applied in two layers, wherein the CPU powder contains at least 5 wt. % of glass-forming composition A as a lower layer and the powder CPO contains at least 50 wt. % of glass-forming composition B as an upper layer.

公开(公告)号：EP1044946A3

公开(公告)日：2001-11-14

申请号：EP00108342.7

申请日：2000-04-14

申请人： UNITED TECHNOLOGIES CORPORATION ,  GENERAL ELECTRIC COMPANY ,  The United States of America, represented by the Administrator of the National Aeronautics and Space Administration (NASA)

发明人： Eaton, Harry E., Jr. ,  Allen, William P. ,  Miller, Robert A. ,  Jacobson, Nathan S. ,  Smialek, James L. ,  Opila, Elizabeth J. ,  Lee, Kang N. ,  Nagaraj, Bangalore A. ,  Wang, Hongyu ,  Meschter, Peter J. ,  Luthra, Krishan L.

IPC分类号： C04B41/87 ,  C04B41/89 ,  C23C4/10 ,  C04B41/52

CPC分类号： C04B41/009 ,  C04B41/5024 ,  C04B41/52 ,  C04B41/85 ,  C04B41/89 ,  C23C4/02 ,  C23C4/11 ,  C23C4/18 ,  C23C28/04 ,  C23C28/044 ,  C23C28/30 ,  C23C28/32 ,  C23C28/34 ,  C23C28/345 ,  F01D5/284 ,  F01D5/288 ,  F05D2230/90 ,  F05D2300/222 ,  F05D2300/611 ,  C04B41/0072 ,  C04B41/4523 ,  C04B41/53 ,  C04B41/5037 ,  C04B41/5096 ,  C04B41/522 ,  C04B41/5035 ,  C04B35/565 ,  C04B35/584 ,  C04B35/806 ,  C04B35/597

摘要： A barrier layer for a silicon containing substrate which inhibits the formation of gaseous species of silicon when exposed to a high temperature aqueous environment comprises a calcium alumina silicate.

公开(公告)号：EP1143020A1

公开(公告)日：2001-10-10

申请号：EP01111313.1

申请日：1997-11-21

申请人： THE DOW CHEMICAL COMPANY

发明人： Fox, Richard T. ,  Han, Chan ,  Pyzik, Aleksander J. ,  Nilsson, Robert T.

IPC分类号： C22C1/10 ,  C04B41/52 ,  G11B5/64 ,  G11B5/84

CPC分类号： G11B5/7315 ,  C04B41/5155 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C22C1/1036 ,  C22C2001/1021 ,  C22C2001/1057 ,  G11B5/8404

摘要： A non-wetting and non-reactive layer of a non-wettable powder formed on part, but not all, of the surface of a shaped ceramic body limits infiltration of metal to the region(s) where there is no layer of the non-wettable powder and thereby limits the formation of undesirable regions of excess metal on the surface of, and undesirable phases near the surface within, the resultant ceramic-metal composite article .

摘要翻译： 在成形陶瓷体的部分但不是全部的表面上形成的不可湿润且不可反应的非可反应的粉末层限制了金属渗透到没有非成膜陶瓷层的区域， 从而限制所得陶瓷 - 金属复合材料制品表面上不希望的过量金属区域和接近表面内的不希望的相的形成。

公开(公告)号：EP0677499B1

公开(公告)日：1998-06-17

申请号：EP95103796.9

申请日：1995-03-16

申请人： THE B.F. GOODRICH COMPANY

发明人： Stover, Edward Roy

IPC分类号： C04B41/50 ,  C04B41/52 ,  C04B41/85 ,  C04B41/89 ,  F16D69/00

CPC分类号： F16D65/126 ,  C04B41/5015 ,  C04B41/52 ,  C04B41/85 ,  C04B41/89 ,  F16D65/127 ,  F16D69/023 ,  F16D2200/0047 ,  Y10T428/12708 ,  Y10T428/292 ,  Y10T428/30

公开(公告)号：EP0535041B1

公开(公告)日：1998-03-04

申请号：EP91910956.1

申请日：1991-06-19

申请人： URYLON PLASTICS INC.

发明人： MAINE, Frank ,  CALDER, Peter N. ,  ARCHIBALD, James

IPC分类号： C04B41/48 ,  C04B41/52 ,  E21D11/38

CPC分类号： C04B41/009 ,  C04B41/4884 ,  C04B41/52 ,  C04B41/63 ,  C04B41/70 ,  C04B2103/63 ,  E21D11/38 ,  Y10T428/31551 ,  Y10T428/31598 ,  C04B41/5024 ,  C04B41/4535 ,  C04B28/02

摘要： A method and composition for providing gas-impermeable, adherent, flexible, and fire retardant coatings to rock and the like surfaces whereby the rock is supported by the caisson effect and mechanical strength properties of the coatings. The method comprises spraying a two-component polymer such as polyurethane onto a rock surface and spraying a layer of inorganic particulate material such as unexfoliated vermiculite onto the said coating of polymer with or without concurrent application of further layers of said polymer before completion of curing of the coating whereby the patrticulate material adheres to the polymer. An aqueous dispersion of inorganic particulate material such as vermiculite which may be in the exfoliated form can be applied onto the coating.

公开(公告)号：EP0739996A3

公开(公告)日：1997-12-29

申请号：EP96302993

申请日：1996-04-29

申请人： MITSUBOSHI BELTING LTD

发明人： OGINO MASAYUKI ,  HAYASHI SHIGEHIKO ,  KAWAHARA MASAHITO ,  GOTO KAZUO ,  NOGUCHI TORU ,  YAMAGUCHI YOSHIO

IPC分类号： C03C17/00 ,  C03C17/06 ,  C03C17/36 ,  C04B41/45 ,  C04B41/51 ,  C04B41/52 ,  C04B41/81 ,  C04B41/88 ,  C04B41/89 ,  C23C24/08 ,  C23C28/00

CPC分类号： C03C17/3607 ,  C03C17/007 ,  C03C17/008 ,  C03C17/36 ,  C03C17/3644 ,  C03C2217/45 ,  C03C2217/479 ,  C04B41/009 ,  C04B41/4507 ,  C04B41/51 ,  C04B41/52 ,  C04B41/81 ,  C04B41/88 ,  C04B41/89 ,  C04B2111/00491 ,  C23C24/085 ,  Y10T428/12028 ,  Y10T428/12049 ,  Y10T428/12104 ,  C04B41/463 ,  C04B41/48 ,  C04B35/00

公开(公告)号：EP0750337A3

公开(公告)日：1997-05-14

申请号：EP96304296.5

申请日：1996-06-07

申请人： DOW CORNING CORPORATION

发明人： Haluska, Loren Andrew ,  Michael, Keith Winton

IPC分类号： H01L21/316 ,  C04B41/52 ,  H01L23/29

CPC分类号： C04B41/009 ,  C04B41/5035 ,  C04B41/87 ,  C04B2111/00844 ,  H01L21/312 ,  H01L21/316 ,  H01L23/291 ,  H01L23/295 ,  H01L2924/0002 ,  C04B41/4535 ,  C04B41/4554 ,  C04B41/50 ,  C04B35/10 ,  H01L2924/00

摘要： The present invention provides a method of forming coatings on electronic substrates and claims the substrates coated thereby. Our method comprises applying a coating comprising hydrogen silsesquioxane resin and a polysilazane on a substrate and then heating the coated substrate at a temperature sufficient to convert the resins to ceramics.

公开(公告)号：EP0753842A2

公开(公告)日：1997-01-15

申请号：EP96305196.6

申请日：1996-07-15

申请人： SEAGATE TECHNOLOGY, INC.

发明人： Cohen, Uri ,  Bonnie, Gene P.

IPC分类号： G11B5/31 ,  H01F41/00 ,  H01F41/14 ,  H01L21/311 ,  H01L21/60 ,  H01L21/603 ,  H01L21/64 ,  H01L21/70 ,  H01L21/77 ,  H01L21/78 ,  H01L21/782 ,  H01L21/786 ,  H01L27/01 ,  C04B41/50 ,  C04B41/52 ,  C04B41/53 ,  C04B41/91 ,  C23C14/00

CPC分类号： C04B41/009 ,  C04B41/5353 ,  C04B41/91 ,  C04B2111/00422 ,  G11B5/3103 ,  G11B5/3106 ,  G11B5/313 ,  G11B5/3133 ,  G11B5/3143 ,  G11B5/3163 ,  G11B5/40 ,  G11B19/04 ,  H01L21/00 ,  H01L2924/0002 ,  Y10T29/49046 ,  H01L2924/00

摘要： A method for pattern-etching thick alumina layers in the manufacture of thin film heads (TFH) by using compatible metallic mask layers (42, 44, 46) and a wet chemical etchant. The deep alumina etching facilitates a studless TFH device where the coil and bonding pads (38) are deposited and patterned simultaneously, and vias are later etched through the alumina overcoat layer (40) to expose the bonding pads (38). The method also enables the etching of scribe-line grooves (13) of street and alleys across the wafer for sawing and machining of sliders. These grooves (13) eliminate most alumina chipping due to stress and damage introduced by the sawing and machining operations. Similarly, pattern-etching of the alumina undercoat (12) facilitates the formation of precise craters for recessed structures. These can improve planarity and alleviate problems related to adverse topography and elevated features of TFH devices.

摘要翻译： 通过使用兼容的金属掩膜层（42，44，46）和湿化学蚀刻剂对的薄膜磁头（TFH）制造图案蚀刻厚的氧化铝层的方法。 深蚀刻氧化铝便于其中线圈和接合焊盘（38）被沉积和图案化的同时的无钉防滑TFH设备，和通孔穿过氧化铝覆层（40），以暴露的接合焊盘（38）后进行蚀刻。 因此，该方法允许街道的刻划线的槽（13）和小巷的整个晶片上蚀刻用于锯切和滑块的加工。 这些凹槽（13）消除大部分的氧化铝碎裂由于应力和由切割和加工操作中引入的损害。 类似地，氧化铝底涂层（12）的图案蚀刻便于为凹陷结构精确环形山的形成。 这些可以改善平面性和减轻有关不良地形和TFH设备的升高的特征的问题。