公开(公告)号：EP0407951A3

公开(公告)日：1992-03-04

申请号：EP90113111.0

申请日：1990-07-10

Applicant: SHIPLEY COMPANY INC.

Inventor： D'Ottavio, Eugene D. ,  Hawkins, Robert E. ,  Rodriguez, Stephen S. ,  Rychwalski, James

IPC: G03F7/16

CPC classification number: H05K3/108 ,  G03F7/164 ,  H05K1/0284 ,  H05K3/062 ,  H05K3/064 ,  H05K2201/0347 ,  H05K2201/09118 ,  H05K2203/135

Abstract: A process for manufacturing a 3-dimensional circuit board by electrophoretic deposition whereby a) providing the board with a conductive surface and b) applying a photoresist by electrophoretic deposition.

Abstract translation: 一种通过电泳沉积制造三维电路板的方法，其中a）为所述板提供导电表面，以及b）通过电泳沉积来施加光致抗蚀剂。

公开(公告)号：EP0440027A3

公开(公告)日：1991-11-06

申请号：EP91100240.0

申请日：1991-01-09

Applicant: SHIPLEY COMPANY INC.

Inventor： Bernards, Roger F. ,  Fisher, Gordon ,  Sonnenberg, Wade ,  Cerwonka, Edward J. ,  Fisher, Stewart

IPC: C25D3/38

CPC classification number: H05K3/42 ,  C25D3/38 ,  H05K3/423 ,  H05K2203/162

Abstract: The invention discloses the use of an additive for acid copper plating bath which is chosen based on criteria of creating a shift in the charge transfer overpotential of the bath; or alternatively, creating a differential overpotential between the surface of a high aspect ratio circuit board and the recesses of such boards. The additive may be a single or multi-component additive.

公开(公告)号：EP0427923A3

公开(公告)日：1991-11-06

申请号：EP90115155.5

申请日：1990-08-07

Applicant: SHIPLEY COMPANY INC.

Inventor： Ho, Ivan ,  Harris, Martin J. ,  Harrison, Richard ,  Miller, Phillip J. Jr

IPC: G03F7/16

CPC classification number: G03F7/164 ,  H05K3/0079 ,  H05K3/0091 ,  H05K2203/0292 ,  H05K2203/135 ,  H05K2203/1518

Abstract: A process for applying a pinhole free organic coating on a conductive substrate during an electrodeposition process. The elimination of pinhole defects is accomplished by use of a vibrating device interfaced with the equipment which dislodges gas bubbles adhering to the surface of the substrate during the electrodeposition process.

公开(公告)号：EP0449022A2

公开(公告)日：1991-10-02

申请号：EP91103687.9

申请日：1991-03-11

Applicant: SHIPLEY COMPANY INC.

Inventor： Hawkins, Robert E. ,  Rodriguez, Stephen S.

IPC: G03F7/16

CPC classification number: G03F7/164 ,  H05K1/0266 ,  H05K3/0076 ,  H05K3/064 ,  H05K2203/122 ,  H05K2203/135

Abstract: It has been discovered that both water soluble or partially water soluble and water insoluble agents lower the operating temperature of electrodepositable photoresist compositions and substantially increase both lifetime stability and temperature stability of the bath.
These additives, because of their low volatility and their partition coefficients, essentially remain in the emulsion system and are removed upon codeposition with the photoresist where they act to improve film quality and control thickness.

Abstract translation: 已经发现没有这两个水溶性或部分水溶性和不溶于水的药物降低电沉积光致抗蚀剂能够组合物的工作温度和大幅提高使用寿命都稳定性和浴的温度稳定性。 这些添加剂，因为它们的挥发性低，它们的分配系数的，本质上保持在乳液体系并且在与光致抗蚀剂在那里它们起作用以提高膜质量和厚度的控制码位置被除去。

公开(公告)号：EP0352739A3

公开(公告)日：1991-09-11

申请号：EP89113699.6

申请日：1989-07-25

Applicant: SHIPLEY COMPANY INC.

Inventor： Thackeray, James W. ,  Fine, Stephen A.

IPC: G03F7/004 ,  G03F7/022 ,  G03F7/09 ,  G03F7/38 ,  G03F7/075

CPC classification number: G03F7/022 ,  G03F7/0041 ,  G03F7/0755 ,  G03F7/09 ,  G03F7/265

Abstract: The present invention is directed to a method for the formation and dry development of photoresists treated only in a thin layer ( i.e. , approx. 2000 Angstroms thick) so as to be treated with an organometallic material. Treatment of this thin layer of the resist formulation in the process of the present invention is preferably accomplished by the vapor phase exposure of the resist formulation to an organometallic material such as a silylating compound capable of reacting with the resist formulation. The resist formulation also contains a photoacid generator, capable of releasing an acid which either causes the hydrolysis of the exposed portions of the resist that were created with organometallic vapor, or prevents the reaction of the organometallic vapor with the exposed portion of the resist.

公开(公告)号：EP0371217A3

公开(公告)日：1991-06-12

申请号：EP89117107.6

申请日：1989-09-15

Applicant: SHIPLEY COMPANY INC.

Inventor： Sands, Philip William

IPC: F16L41/14 ,  F16L41/00

CPC classification number: F16L41/00 ,  Y10S285/901

Abstract: A fitting (10) for connecting a drum (12) containing a fluid product to a pipeline (14) leading to a place of use without introducing contaminant.

公开(公告)号：EP0285025A3

公开(公告)日：1989-01-18

申请号：EP88104834.2

申请日：1988-03-25

Applicant: SHIPLEY COMPANY INC.

Inventor： Cunningham, Wells Crassous

IPC: G03F7/10

CPC classification number: G03F7/0758

Abstract: Both positive and negative acting photoresist compositions are provided which contain one or more silylated poly(vinyl)phenol polymers and at least one sensitizer which forms an acid upon irradiation. The anion of such acids has an affinity for silicon.

Abstract translation: 提供了含有一种或多种甲硅烷基化聚（乙烯基）酚聚合物和至少一种在照射时形成酸的敏化剂的正性和负性光刻胶组合物。 这种酸的阴离子对硅具有亲和力。

公开(公告)号：EP0187962A2

公开(公告)日：1986-07-23

申请号：EP85115825.3

申请日：1985-12-12

Applicant: SHIPLEY COMPANY INC.

Inventor： Gulla, Michael, Dr. ,  Dutkewych, Oleh B. ,  Bladon, John J.

IPC: C23C18/28

CPC classification number: C23C18/30 ,  C23C18/28

Abstract: A catalytic adsorbate suspended in an aqueous solution comprising reduced catalytic metal on an organic suspending agent where the reduced catalytic metal has a maximum dimension not exceeding 500 angstroms and the organic suspending agent is one capable of complexing with ions of the catalytic metal. The catalytic adsorbate is useful for the electroless metal deposition of substrates that are non-catalytic to electroless metal deposition.

Abstract translation: 一种悬浮在水溶液中的催化吸附物，其包含还原催化金属在有机悬浮剂上，其中还原的催化金属的最大尺寸不超过500埃，有机悬浮剂是能够与催化金属的离子络合的催化剂。 催化吸附物可用于无电金属沉积非化学金属沉积的基底的无电金属沉积。

公开(公告)号：EP0043893B1

公开(公告)日：1985-12-11

申请号：EP81102879.4

申请日：1981-04-15

Applicant: SHIPLEY COMPANY INC.

Inventor： Castner, Christian B.

IPC: C25D21/12 ,  G01N21/00

CPC classification number: C25D21/14 ,  G01N21/8507

公开(公告)号：EP0043893A1

公开(公告)日：1982-01-20

申请号：EP81102879.4

申请日：1981-04-15

Applicant: SHIPLEY COMPANY INC.

Inventor： Castner, Christian B.

IPC: C25D21/12 ,  G01N21/00

CPC classification number: C25D21/14 ,  G01N21/8507

Abstract: Apparatus for regulating the concentration of plating solution (20) components in a plating bath comprising a sensing device (22) suspended in the bath responsive to the concentration of one or more plating components of the plating solution and capable of generating a signal and a pump for supplying replenisher solution to the bath, maintaining the concentration of components of the plating solution substantially constant during use of the plating bath.