摘要:
The invention relates to a curable composition comprising a) at least one polymer having at least one terminal group of the general formula (I)
-A n -R-SiXYZ (I),
wherein A is a divalent or trivalent bonding group containing at least one heteroatom, R is selected from divalent hydrocarbon residues having 1 to 12 carbon atoms, X, Y, Z are, independently of one another, selected from the group consisting of a hydroxyl group and C 1 to C 8 alkyl, C 1 to C 8 alkoxy, C 1 to C 8 acyloxy groups and -CH 2 -N-R' wherein N is oxygen, nitrogen or sulfur, preferably oxygen, and R' is selected from C 1 to C 8 alkyl groups, preferably a methyl group, wherein X, Y, Z are substituents directly bound with the Si atom or the two of the substituents X, Y, Z form a ring together with the Si atom to which they are bound, and at least one of the substituents X, Y, Z is selected from the group consisting of a hydroxyl group, C 1 to C 8 alkoxy or C 1 to C 8 acyloxy groups, and n is 0 or 1; and b) at least one compound of the general formula (II)
wherein R 1 is same or different and is, independently from one another, selected from the group consisting of a hydrogen atom and hydrocarbon residues having 1 to 12 carbon atoms, R 2 is same or different and is, independently from one another, selected from hydrocarbon residues having 1 to 12 carbon atoms, Ar is selected from aryl groups, and n is an integer selected from 3 to 9; and adhesive, sealant, or coating materials comprising the composition and use thereof.
摘要:
The present invention provides an optical semiconductor device in which an optical semiconductor element connected to a silver-plated copper lead frame is sealed with an addition curing silicone resin composition, wherein the addition curing silicone resin composition comprises: (A) organopolysiloxane that contains an aryl group and an alkenyl group and does not contain an epoxy group; (B) organohydrogenpolysiloxane that has at least two hydrosilyl groups (SiH groups) per molecule and also has an aryl group, the organohydrogenpolysiloxane that contains 30 mol% or more of an HR 2 SiO 0.5 unit in a constituent unit having an amount that a molar ratio of the hydrosilyl group in the component (B) with respect to the alkenyl group in the component (A) is 0.70 to 1.00; and (C) a hydrosilylation catalyst having a catalytic amount. There can be provided an optical semiconductor device that suppresses discoloration of a cured product of an addition curing silicone resin component as a sealing resin and has excellent durability of reflection efficiency.
摘要:
A curable silicone composition comprises: (A) an organopolysiloxane represented by a specific average unit formula; (B) an organopolysiloxane represented by a specific average unit formula; (C) an organohydrogenpolysiloxane represented by a specific average composition formula; and (D) a hydrosilylation catalyst; and a curable hot-melt silicone that is obtained by subjecting this composition to a hydrosilylation reaction to a degree that does not form a cured product, that is non-flowable at 25°C, and that has a melt viscosity at 100°C of 5000 Pa·s or less. This curable silicone composition provides a cured product having excellent heat resistance and light resistance after being cured. This curable hot-melt silicone is non-flowable at room temperature, has low surface stickiness, and is readily melted by heating.
摘要:
A curable composition having excellent storage stability and capable of forming a cured product having excellent scratch resistance. The composition comprises a silsesquioxane monomer having a radically polymerizable group in the molecule and a content of a component having a molecular weight measured by gel permeation chromatography (GPC) of not less than 10,000 of less than 9 mass% and a bifunctional polymerizable monomer represented by the following formula (1). (wherein B and B' are each an linear or branched alkylene group having 2 to 15 carbon atoms, "c" is an average value of 1 to 20, when a plurality of B's are existent, B's may be the same or different, and R 5 and R 6 are each a hydrogen atom or methyl group.)
摘要:
The present invention relates to an organic silicone resin composition and a prepreg, a laminate, and an aluminum substrate that use the composition. The organic silicone resin composition comprises in terms of parts by weight: 100 parts of a condensation-type silicone resin, 0.0001-2 parts of a catalyst, and 0.001-10 parts of an additive. The organic silicone resin composition has the advantages of high heat resistance, halogen-free and phosphorus-free flame retardancy, improved peel strength with copper foil, and low coefficient of expansion, and is applicable in manufaturing the pre-preg, the laminate, and the aluminum substrate for used in a high-performance printed circuit.
摘要:
The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.
摘要:
Adhesive compositions are disclosed. In some embodiments, the adhesive compositions comprise an organosiloxane block copolymer, wherein the blocks of the block copolymer consist of an —Si—O—Si— backbone. The organosiloxane block copolymer comprises at least two blocks that are phase-separated. The organosiloxane block copolymer has at least a first glass transition temperature (Tg1) and a second glass transition temperature (Tg2), the second glass transition temperature being at 25° C. or higher. A 1 mm thick cast film of the adhesive composition has, in some embodiments, a light transmittance of at least 95%. The adhesive composition of the various embodiments of the present invention can be B-staged at about Tg2 or at about 100° C. below Tg2.
摘要:
The invention relates to a method for producing organofunctional silicone resins (i) having a low alkoxy group content and a high level of tolerance to a large number of organofunctional groups, in particular to acid- and base-sensitive organic groups, and to the organofunctional silicone resins (i) obtainable by this method and the use thereof.
摘要:
The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane represented by the average unit formula: (R13SiO1/2)a(R12SiO2/2)b (R2SiO3/2)c (R3SiO3/2)d, wherein, R1 are the same or different alkyl groups having from 1 to 12 carbons, alkenyl groups having from 2 to 12 carbons, aryl groups having from 6 to 20 carbons, or aralkyl groups having from 7 to 20 carbons, provided that at least two R1 in a molecule are the alkenyl groups; R2 is an aryl group having from 6 to 20 carbons or an aralkyl group having from 7 to 20 carbons; R3 is an alkyl group having from 1 to 12 carbons; and a, b, c, and d are respectively numbers satisfying: 0.01≦a≦0.5, 0≦b≦0.7, 0.01≦c
摘要翻译:本发明涉及可固化的有机硅组合物,其包含:(A)由平均单元式:(R 13 SiO 1/2)a(R 12 SiO 2/2)b(R 2 SiO 3/2)c(R 3 SiO 3/2)d表示的有机聚硅氧烷, R1是具有1至12个碳的相同或不同的烷基,具有2至12个碳的烯基,具有6至20个碳的芳基或具有7至20个碳的芳烷基,条件是至少两个R1 一个分子是烯基; R2是具有6至20个碳的芳基或具有7至20个碳的芳烷基; R3是具有1至12个碳的烷基; 和a,b,c和d分别是满足0.01≤a≤0.5,0≤b≤0.7,0.01≤c≤0.7,0.1≤d<0.9和a + b + c + d = 1的数; (B)分子中具有至少两个与硅键合的烯基和至少一个与硅键合的芳基的线性有机聚硅氧烷; (C)分子中具有至少两个与硅键合的氢原子的有机聚硅氧烷; (D)氢化硅烷化反应催化剂。 可固化的有机硅组合物具有优异的处理/可加工性并形成固化时具有高折射率和低气体渗透性的固化产物。
摘要:
A siloxane polymer is made by providing a first compound having the chemical formula SiR1aR24-a where a is from 1 to 3, R1 is a reactive group, and R2 is an alkyl group or an aryl group, and providing a second compound having the chemical formula SiR3bR4cR54-(b+c) where R3 is a cross-linking functional group, R4 is a reactive group, and R5 is an alkyl or aryl group, and where b=1 to 2, and c=1 to (4−b). The first and second compounds are polymerized together to form a siloxane polymer. The siloxane polymer can be then used in a final composition where the siloxane polymer comprises from 5 to 100% by weight, and filler (e.g. microparticles, nanoparticles, nanowires, etc.) comprises from zero to 95% by weight. The siloxane polymer composition is useful in a variety of areas such as an adhesive, e.g. as a die attach adhesive in semiconductor (e.g. LED) packaging applications, encapsulants, optical coatings, protective coatings, and other applications.
摘要翻译:硅氧烷聚合物通过提供具有化学式SiR 1 a R 2 4-a的第一化合物来制备,其中a为1至3,R 1为反应性基团且R 2为烷基或芳基,并且提供第二化合物, 化学式SiR 3 b R 4 c R 5 4-(b + c)其中R 3是交联官能团,R 4是反应性基团,并且R 5是烷基或芳基,并且其中b = 1至2,并且c = 1 到(4-b)。 第一和第二化合物一起聚合形成硅氧烷聚合物。 然后可将硅氧烷聚合物用于最终组合物中,其中硅氧烷聚合物包含5至100重量%,并且填料(例如微粒,纳米粒子,纳米线等)包含0至95重量%。 硅氧烷聚合物组合物可用于各种领域,例如粘合剂,例如粘合剂。 作为半导体(例如LED)封装应用中的管芯附着粘合剂,密封剂,光学涂层,保护涂层和其他应用。