公开(公告)号：EP3376526A1

公开(公告)日：2018-09-19

申请号：EP16864171.0

申请日：2016-11-07

Applicant: Furukawa Electric Co., Ltd.

Inventor： YOKOI, Hirotoki ,  UCHIYAMA, Tomoaki ,  OKA, Yoshifumi

IPC: H01L21/301 ,  B23K26/351 ,  C09J7/02 ,  C09J201/00 ,  H01L21/304 ,  H01L21/52

CPC classification number: B23K26/351 ,  B23K26/362 ,  C09J7/20 ,  C09J201/00 ,  H01L21/304 ,  H01L21/3081 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: A method of producing a semiconductor chip, including the following steps (a) to (d):
(a) a step of, in the state of having laminated a mask-integrated surface protective tape on the side of a patterned surface of a semiconductor wafer, grinding the backing-face of the semiconductor wafer; laminating a wafer fixing tape on the backing-face side of the ground semiconductor wafer; and supporting and fixing the wafer to a ring flame;
(b) a step of, after peeling the surface protective tape thereby to expose the mask material layer on top, forming an opening of a street of the semiconductor wafer;
(c) a plasma dicing step of segmentalizing the semiconductor wafer by a plasma irradiation to singulate it into semiconductor chips; and
(d) an ashing step of removing the mask material layer by the plasma irradiation.

公开(公告)号：EP3375835A1

公开(公告)日：2018-09-19

申请号：EP15908240.3

申请日：2015-11-12

Applicant: Nakashima Rubber Industry Co., Ltd.

Inventor： NAKASHIMA, Mikio ,  TAKATA, Yoshikuni ,  YOSHIZUMI, Takemi ,  EGUCHI, Rikito

IPC: C09J7/04 ,  C09J201/00

CPC classification number: C09J201/00 ,  C09J7/21

Abstract: The adhesive sheet for bonding an unvulcanized rubber to a metal, including a base cloth layer impregnated with a solvent dispersed type vulcanization adhesive having reactivity with the unvulcanized rubber; and an adhesive layer having reactivity with the metal.

公开(公告)号：EP3363871A1

公开(公告)日：2018-08-22

申请号：EP16855441.8

申请日：2016-10-12

Applicant: Lintec Corporation ,  Sumitomo Seika Chemicals Co., Ltd.

Inventor： KOMA Yosuke ,  NANASHIMA Yutaka ,  ONO Yoshitomo ,  NISHIOKA Kiyoshi ,  HACHIKEN Shizuka

IPC: C09J7/00 ,  C09J7/02 ,  C09J11/06 ,  C09J133/00 ,  C09J169/00 ,  C09J201/00

CPC classification number: C09J7/38 ,  C09J7/00 ,  C09J7/20 ,  C09J11/06 ,  C09J133/00 ,  C09J133/08 ,  C09J133/10 ,  C09J169/00 ,  C09J201/00

Abstract: A pressure sensitive adhesive sheet is provided which comprises a pressure sensitive adhesive layer formed of a pressure sensitive adhesive composition. The pressure sensitive adhesive composition contains an aliphatic polycarbonate and a pressure sensitive adhesive resin other than the aliphatic polycarbonate. The pressure sensitive adhesive sheet can be reduced in the adhesive strength at desired timing by a novel mechanism of action so that the release of an adherend becomes easy. The above pressure sensitive adhesive composition preferably contains an acid/base generator that generates an acid or a base by applying energy.

公开(公告)号：EP3358606A1

公开(公告)日：2018-08-08

申请号：EP16851304.2

申请日：2016-09-21

Applicant: Nitto Denko Corporation

Inventor： SUGO, Yuki ,  KAMAKURA, Nao

IPC: H01L21/52 ,  C09J7/02 ,  C09J11/04 ,  C09J201/00 ,  H01L21/301

CPC classification number: H01L24/29 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/0074 ,  B22F7/00 ,  B22F2301/255 ,  B32B5/16 ,  B32B7/12 ,  B32B2264/105 ,  B32B2405/00 ,  B32B2457/14 ,  C09J7/20 ,  C09J7/35 ,  C09J11/04 ,  C09J201/00 ,  C09J2203/326 ,  C09J2400/12 ,  C09J2400/16 ,  H01L21/52 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/05 ,  H01L24/27 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2224/04026 ,  H01L2224/05073 ,  H01L2224/05166 ,  H01L2224/05639 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27436 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29499 ,  H01L2224/29739 ,  H01L2224/29747 ,  H01L2224/29787 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83203 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/8346 ,  H01L2224/8384 ,  H01L2224/85203 ,  H01L2224/85207 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/0541 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/27 ,  H01L2221/68381 ,  H01L2224/83 ,  H01L2924/01028

Abstract: Provided is a thermal bonding sheet capable of preventing bonding irregularity by uniform thickness, and imparting the bonding reliability at high temperatures, and a thermal bonding sheet with dicing tape having the thermal bonding sheet. A thermal bonding sheet includes a precursor layer that is to become a sintered layer by heating, and the precursor layer has an average thickness of 5 µm to 200 µm, and a maximum thickness and a minimum thickness falling within a range of ±20% of the average thickness. A thermal bonding sheet includes a precursor layer that is to become a sintered layer by heating, and the precursor layer has an average thickness of 5 µm to 200 µm, and a surface roughness Sa measured in a field of view of 200 µm × 200 µm by a confocal microscope of 2 µm or less.

公开(公告)号：EP3345962A1

公开(公告)日：2018-07-11

申请号：EP16841231.0

申请日：2016-06-13

Applicant: The Yokohama Rubber Co., Ltd.

Inventor： MORITA, Tomohiro

IPC: C08L21/00 ,  C08K3/04 ,  C08K5/01 ,  C08K5/03 ,  C08K5/13 ,  C08L7/00 ,  C09J201/00

CPC classification number: C08L9/00 ,  C08K3/04 ,  C08K5/01 ,  C08K5/03 ,  C08K5/13 ,  C08L61/00 ,  C08L65/00 ,  C08L91/00 ,  C08L93/00 ,  C09J201/00

Abstract: To provide: a rubber composition that can provide cement having high adhesion and having excellent solubility in a solvent and excellent tackiness; a cement composition; and a hose for liquid transportation. A rubber composition of the present invention contains 100 parts by mass of a diene rubber, from 5 parts by mass to 70 parts by mass of a carbon black, and from 3 parts by mass to 50 parts by mass of a tackifying resin having a softening point of lower than 130°C.

公开(公告)号：EP3222692A4

公开(公告)日：2018-07-04

申请号：EP15860929

申请日：2015-09-18

Applicant: SEKISUI CHEMICAL CO LTD

Inventor： TANIKAWA MITSURU ,  WATANABE TAKASHI ,  FUJITA YUSUKE ,  FUJITA YOSHITO ,  UEDA MICHIHISA ,  INUI OSAMU ,  TAKAHASHI RYOSUKE ,  INOUE TAKANORI

IPC: C09J201/00 ,  C09J4/02 ,  C09J5/06 ,  C09J11/06 ,  H01L21/52 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

CPC classification number: C09J133/14 ,  C09J4/00 ,  C09J5/06 ,  C09J11/06 ,  C09J133/06 ,  C09J163/00 ,  C09J201/00 ,  C09J201/08 ,  C09J2203/326 ,  C09J2205/31 ,  H01L21/52 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/75 ,  H01L24/83 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L2224/27312 ,  H01L2224/27318 ,  H01L2224/278 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/75155 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/00014 ,  H01L2924/00 ,  C08F220/18 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L2224/83

Abstract: Provided is a photocurable and thermosetting adhesive for inkjet which can increase the thickness accuracy of an adhesive layer formed by curing an adhesive and can further cause the adhesive layer to hardly generate voids. A photocurable and thermosetting adhesive for inkjet according to the present invention contains a photocurable compound, a thermosetting compound, a photopolymerization initiator, and a thermal curing agent, wherein the elastic modulus at 25°C of a B-staged adhesive is at least 5.0 × 10 2 Pa and at most 8.0 0 × 10 4 Pa when the B-staged adhesive is obtained by irradiating the adhesive with light of a cumulative light quantity of 1000 mJ/cm 2 so that illumination at a wavelength of 365 nm is 100 mW/cm 2 .

公开(公告)号：EP3216602A4

公开(公告)日：2018-06-20

申请号：EP15856871

申请日：2015-11-05

Applicant: DAINIPPON PRINTING CO LTD

Inventor： FUKUDA SHUNJI ,  TAMUKI JUNICHI ,  KOYAMA KEISUKE

IPC: C09J7/50 ,  B29C41/00 ,  B29C45/16 ,  B32B7/12 ,  B32B27/40 ,  B32B33/00 ,  C09J7/24 ,  C09J201/00

CPC classification number: C09J7/0257 ,  B29C41/00 ,  B29C45/1679 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/308 ,  B32B27/40 ,  B32B33/00 ,  B32B2307/4026 ,  B32B2307/536 ,  C09J7/0242 ,  C09J7/0246 ,  C09J7/24 ,  C09J7/50 ,  C09J157/06 ,  C09J201/00 ,  C09J2201/606 ,  C09J2205/114 ,  C09J2433/00 ,  C09J2433/003 ,  C09J2433/006 ,  C09J2467/006 ,  C09J2475/003

Abstract: The purpose of the present invention is to provide a transfer sheet capable of providing hard coat properties and excellent weather resistance to a resin molded article such as organic glass. The transfer sheet has, in order, a base material film for mold release, a hard coat layer, a primer layer, and an adhesive layer. The weather resistance and adhesiveness of the hard coat layer and the primer layer are improved and hard coat properties and excellent weather resistance can be provided to a resin molded article being the transfer object, as a result of: the hard coat layer being formed from a cured product of a resin composition including a curable resin; and the primer layer being formed from a binder resin including a polyurethane having a mass-average molecular weight of 40,000-100,000 and including 1-30% by mass of an acrylic component.

公开(公告)号：EP3316280A1

公开(公告)日：2018-05-02

申请号：EP16817719.4

申请日：2016-06-14

Applicant: Mitsui Chemicals Tohcello, Inc.

Inventor： HAYASHISHITA Eiji

IPC: H01L21/301 ,  C09J7/02 ,  C09J201/00

CPC classification number: C09J7/255 ,  C09J7/20 ,  C09J7/25 ,  C09J7/30 ,  C09J133/08 ,  C09J133/12 ,  C09J201/00 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2433/00 ,  C09J2467/006 ,  C09J2477/006 ,  H01L21/6836 ,  H01L21/78

Abstract: The present invention provides a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. That is, a film 1 for manufacturing a semiconductor part includes a base layer 11, and an adhesive layer 12 disposed on one surface side of the base layer 11, wherein the ratio R E (= E'(160)/E'(-40)) of the elastic modulus of E'(160) of the base layer 11 at 160°C to the elastic modulus of E'(-40) of the base layer 11 at -40°C is such that R E ≥ 0.01, and the elastic modulus E'(-40) is 10 MPa or more and less than 1000 MPa. The present method includes a step of bonding the adhesive layer 12 to a back surface of the semiconductor wafer having circuits formed thereon, a step of separating the semiconductor wafer into segments to obtain semiconductor parts, and a pickup step of separating the semiconductor parts from the adhesive layer 12, and includes a step of evaluating the semiconductor wafer or the semiconductor parts prior to the pickup step.

Abstract translation: 本发明提供一种用于制造半导体部件的膜，其中可以共同执行伴随着温度变化的评估步骤，分段步骤和拾取步骤，用于制造半导体部件的方法，半导体部件以及评估 方法。 即，用于制造半导体部件的膜1包括基底层11和设置在基底层11的一个表面侧上的粘合剂层12，其中比率RE（= E'（160）/ E'（ - 40 ））为160℃时的基材层11的E'（160）的弹性模量与-40℃下的基材层11的E'（ - 40）的弹性模量的关系，RE≥0.01， 弹性模量E'（ - 40）为10MPa以上且小于1000MPa。 本方法包括以下步骤：将粘合剂层12粘合到其上形成有电路的半导体晶片的背面;将半导体晶片分割成段以获得半导体部件的步骤;以及拾取步骤，将半导体部件从 并且包括在拾取步骤之前评估半导体晶片或半导体部件的步骤。

公开(公告)号：EP3300911A1

公开(公告)日：2018-04-04

申请号：EP17191192.8

申请日：2017-09-14

Applicant: BROTHER KOGYO KABUSHIKI KAISHA

Inventor： SUITO, Yoshikatsu ,  NAKASHIMA, Chie

IPC: B41J15/04 ,  C09J7/30 ,  G09F3/10

CPC classification number: B41J15/044 ,  B41J2/325 ,  B41J3/4075 ,  C08K3/013 ,  C08K2201/005 ,  C09J7/02 ,  C09J201/00 ,  C09J2201/134 ,  C09J2205/102

Abstract: An adhesive tape cartridge (11) comprises an adhesive tape roll (14) that winds an adhesive tape (150; 150N) around a predetermined axis in a housing (11A), the adhesive tape (150; 150N) comprising a base layer (151), and a particle-comprising adhesive layer (163; 161) that is disposed on one side of the base layer (151) in a thickness direction and comprises an adhesive comprising large diameter particles whose average particle diameter is 30 µm to 200 µm and small diameter particles whose average particle diameter is 0.2 µm to 20 µm.

Abstract translation: 胶带盒（11）包括将胶带（150; 150N）围绕预定轴线卷绕在壳体（11A）中的胶带卷（14），所述胶带（150; 150N）包括基层 ）和在厚度方向上设置在基层（151）的一侧上并且包括含有平均粒径为30μm至200μm的大直径颗粒的粘合剂的含颗粒粘合剂层（163; 161），以及 小径粒子的平均粒径为0.2μm〜20μm。

公开(公告)号：EP3296326A1

公开(公告)日：2018-03-21

申请号：EP16792602.1

申请日：2016-05-02

Applicant: Nisshinbo Holdings Inc.

Inventor： HAYAKAWA Kazutoshi ,  HASHIBA Toshifumi ,  MATSUZAKA Erina

IPC: C08F2/04 ,  A61K8/81 ,  C09D201/00 ,  C09J11/08 ,  C09J201/00

CPC classification number: C08F20/14 ,  A61K8/0245 ,  A61K8/8152 ,  A61K2800/28 ,  A61K2800/41 ,  A61K2800/412 ,  A61K2800/60 ,  A61Q1/00 ,  A61Q1/02 ,  A61Q19/00 ,  A61Q19/10 ,  C08F12/08 ,  C08F120/14 ,  C08F212/08 ,  C08F220/14 ,  C08F2500/24 ,  C09D7/65 ,  C09D7/69 ,  C09D7/70 ,  C09D11/107 ,  C09D11/108 ,  C09D125/14 ,  C09D133/12 ,  C09D201/00 ,  C09J11/08 ,  C09J125/14 ,  C09J133/12 ,  C09J201/00 ,  G02B5/0242 ,  C08F2/30 ,  C08F2/20 ,  C08F2/26 ,  C08F2222/1013 ,  C08F2220/325 ,  C08F2/22 ,  C08F2220/281

Abstract: These flat elliptical polymer particles have a front view, a planar view, and a side view in a projection diagram based on third-angle projection which are all elliptical. The flat elliptical polymer particles satisfy (1)-(4): (1) the average length (L AV ) of flat portions satisfies 0.13 ≤ (L AV ) ≤ 500 µm; (2) the average breadth (D AV ) of the flat portions satisfies 0.1 ≤ (D AV ) ≤ 250 µm; (3) the average (P1 AV ) aspect ratio (L/D) calculated from the length (L) and the breadth (D) satisfies 1.3 AV ≤ 50; and (4) the average (P2 AV ) aspect ratio (D/T) calculated from the breadth (D) and the thickness (T) of the side surface satisfies 1.2 AV ≤ 100.

Abstract translation: 这些扁平椭圆形聚合物颗粒在基于第三角投影的投影图中具有全部为椭圆形的正视图，平面图和侧视图。 （1）〜（4）：（1）平坦部的平均长度（LAV）满足0.13≤（LAV）≤500μm， （2）平坦部分的平均宽度（DAV）满足0.1≤（DAV）≤250μm; （3）由长度（L）和宽度（D）计算的平均（P1AV）纵横比（L / D）满足1.3