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1.发明公开
公开(公告)号：EP3249024A4
公开(公告)日：2018-06-20
申请号：EP16740212
申请日：2016-01-20
IPC分类号： C09J201/02 , C08G59/50 , C09J4/02 , C09J5/06 , C09J11/06 , C09J163/00 , H01L21/52
CPC分类号： C09D133/14 , C08G59/4215 , C08G59/5033 , C08G59/686 , C08L33/08 , C09D11/101 , C09D11/107 , C09D11/30 , C09D11/52 , C09D133/10 , C09J5/04 , C09J5/06 , C09J9/02 , C09J133/10 , C09J133/14 , C09J163/00 , C09J171/12 , C09J201/02 , C09J2203/326 , C09J2205/114 , C09J2205/31 , C09J2433/00 , C09J2461/00 , C09J2463/00 , H01L21/52 , H01L24/27 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/91 , H01L2224/2741 , H01L2224/2783 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/73265 , H01L2224/83026 , H01L2224/8322 , H01L2224/83359 , H01L2224/83862 , H01L2224/83947 , H01L2924/00014 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399 , C08L33/04
摘要： Provided is an inkjet adhesive which is applied using an inkjet device, wherein the adhesive can suppress generation of voids in the adhesive layer and, after bonding, can enhance adhesiveness, moisture-resistant adhesion reliability, and cooling/heating cycle reliability. An inkjet adhesive according to the present invention comprises a photocurable compound, a photo-radical initiator, a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups, and a compound capable of reacting with the thermosetting compound, and the compound capable of reacting with the thermosetting compound contains aromatic amine.
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2.发明公开SURFACE-TREATED FLUORESCENT BODIES AND PROCESS FOR PRODUCTION OF SURFACE-TREATED FLUORESCENT BODIES 有权表面处理过的荧光体及其制造方法表面处理过的荧光体
公开(公告)号：EP2554628A4
公开(公告)日：2014-03-05
申请号：EP11765354
申请日：2011-03-17
CPC分类号： C09K11/7734 , C09K11/025 , G09F13/04 , H01L27/15 , H01L33/502
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公开(公告)号：EP3214142A4
公开(公告)日：2018-04-18
申请号：EP16749313
申请日：2016-02-12
发明人： TANIKAWA MITSURU , TAKAHASHI RYOSUKE , INOUE TAKANORI , UEDA MICHIHISA , YAMADA TASUKU , FUJITA YOSHITO , WATANABE TAKASHI , FUJITA YUSUKE
IPC分类号： C09D11/30 , B41M5/00 , C07D231/12 , C07D249/04 , C07D249/08 , C09D11/101 , C09D11/36 , C09D11/38 , H05K3/28
CPC分类号： C07C211/51 , C07D231/12 , C07D249/04 , C07D249/08 , C09D11/101 , C09D11/36 , C09D11/38 , H05K3/28
摘要： Provided is a curable composition for inkjet which can have a prolonged pot life even under an environment in an inkjet device that is warmed to 50°C or higher and which can be cured into a cured product having improved heat resistance and insulation reliability, in spite of the fact that a thermally curable compound is used in the curable composition. The curable composition for inkjet according to the present invention contains a photocurable compound, a thermally curable compound, a photopolymerization initiator and a thermal curing agent and does not contain a solvent or contains the solvent, wherein the content of the solvent in 100% by weight of the curable composition is 1% by weight or less when the curable composition for inkjet contains the solvent, the photocurable compound contains a polyfunctional compound having at least two (meth)acryloyl groups, and the thermal curing agent is an aromatic amine having at least one benzene ring and at least two amino groups.
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4.发明公开SEALING AGENT FOR OPTICAL SEMICONDUCTOR DEVICES, AND OPTICAL SEMICONDUCTOR DEVICE 审中-公开密封剂的光半导体装置及光学半导体部件
公开(公告)号：EP2733178A4
公开(公告)日：2015-03-04
申请号：EP12810683
申请日：2012-07-11
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5.发明公开ENCAPSULANT FOR OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE USING SAME 有权密封剂的光半导体装置及光学半导体部件THAT
公开(公告)号：EP2586832A4
公开(公告)日：2014-02-19
申请号：EP11798176
申请日：2011-06-22
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6.发明公开
公开(公告)号：EP3222692A4
公开(公告)日：2018-07-04
申请号：EP15860929
申请日：2015-09-18
发明人： TANIKAWA MITSURU , WATANABE TAKASHI , FUJITA YUSUKE , FUJITA YOSHITO , UEDA MICHIHISA , INUI OSAMU , TAKAHASHI RYOSUKE , INOUE TAKANORI
IPC分类号： C09J201/00 , C09J4/02 , C09J5/06 , C09J11/06 , H01L21/52 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： C09J133/14 , C09J4/00 , C09J5/06 , C09J11/06 , C09J133/06 , C09J163/00 , C09J201/00 , C09J201/08 , C09J2203/326 , C09J2205/31 , H01L21/52 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/75 , H01L24/83 , H01L25/065 , H01L25/07 , H01L25/18 , H01L2224/27312 , H01L2224/27318 , H01L2224/278 , H01L2224/2919 , H01L2224/2929 , H01L2224/29387 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73215 , H01L2224/73265 , H01L2224/75155 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83856 , H01L2224/83862 , H01L2224/83874 , H01L2224/94 , H01L2924/0002 , H01L2924/00014 , H01L2924/00 , C08F220/18 , H01L2924/00012 , H01L2224/27 , H01L2224/83
摘要： Provided is a photocurable and thermosetting adhesive for inkjet which can increase the thickness accuracy of an adhesive layer formed by curing an adhesive and can further cause the adhesive layer to hardly generate voids. A photocurable and thermosetting adhesive for inkjet according to the present invention contains a photocurable compound, a thermosetting compound, a photopolymerization initiator, and a thermal curing agent, wherein the elastic modulus at 25°C of a B-staged adhesive is at least 5.0 × 10 2 Pa and at most 8.0 0 × 10 4 Pa when the B-staged adhesive is obtained by irradiating the adhesive with light of a cumulative light quantity of 1000 mJ/cm 2 so that illumination at a wavelength of 365 nm is 100 mW/cm 2 .
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7.发明公开
公开(公告)号：EP3249022A4
公开(公告)日：2018-06-20
申请号：EP16740213
申请日：2016-01-20
IPC分类号： C09J4/02 , C09J5/06 , C09J11/06 , C09J163/00 , H01L21/52
CPC分类号： C09D133/14 , C08G59/4215 , C08G59/5033 , C08G59/686 , C08L33/08 , C09D11/101 , C09D11/107 , C09D11/30 , C09D11/52 , C09D133/10 , C09J5/04 , C09J5/06 , C09J9/02 , C09J133/10 , C09J133/14 , C09J163/00 , C09J171/12 , C09J201/02 , C09J2203/326 , C09J2205/114 , C09J2205/31 , C09J2433/00 , C09J2461/00 , C09J2463/00 , H01L21/52 , H01L24/27 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/91 , H01L2224/2741 , H01L2224/2783 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/73265 , H01L2224/83026 , H01L2224/8322 , H01L2224/83359 , H01L2224/83862 , H01L2224/83947 , H01L2924/00014 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399 , C08L33/04
摘要： Provided is an inkjet adhesive which is applied using an inkjet device, wherein the adhesive can suppress generation of voids in the adhesive layer and, after bonding, can enhance adhesiveness, moisture-resistant adhesion reliability, and cooling/heating cycle reliability. An inkjet adhesive according to the present invention comprises a photocurable compound, a photo-radical initiator, a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups, and a compound capable of reacting with the thermosetting compound, and the compound capable of reacting with the thermosetting compound contains aromatic amine.
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8.发明公开METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT 有权VERFAHREN ZUR HERSTELLUNG EINER ELEKTRONISCHEN KOMPONENTE UND ELEKTRONISCHE KOMPONENTE
公开(公告)号：EP3073520A4
公开(公告)日：2017-09-20
申请号：EP14863263
申请日：2014-11-18
发明人： TANIKAWA MITSURU , WATANABE TAKASHI , UEDA MICHIHISA , NAKAMURA SHIGERU , MAENAKA HIROSHI , TAKAHASHI RYOSUKE , INOUE TAKANORI , FUJITA YOSHITO
CPC分类号： H01L21/02288 , C08F220/10 , C09J4/00 , C09J5/00 , C09J2205/31 , H01L21/52 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/83 , H01L2224/27318 , H01L2224/29101 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8385 , H01L2224/83862 , H01L2224/83874 , H01L2224/83885 , H01L2224/8592 , H01L2924/00014 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： Provided is a method for producing an electronic component, which is capable of forming a cured adhesive layer easily with high accuracy. The method for producing a curable film electronic component according to the present invention includes an application step in which an adhesive is applied onto a first electronic component body using an ink jet device to form an adhesive layer, a first light irradiation step in which an adhesive layer is irradiated with light from a first light irradiation part, an attachment step in which a second electronic component body is disposed on the adhesive layer irradiated with light and attached, and a step in which the adhesive layer is cured by heating, thereby giving an electronic component, the ink jet device includes an ink tank to store the adhesive, a discharge part, and a circulation flow path part, and in the application step, the adhesive is applied while being circulated in the ink jet device.
摘要翻译： 本发明提供一种电子部件的制造方法，其能够以高精度容易地形成固化粘合剂层。 本发明的固化性膜电子部件的制造方法包括：使用喷墨装置在第一电子部件主体上涂布粘接剂而形成粘接层的涂敷工序;第一光照射工序，在该第一光照射工序中， 使用来自第一光照射部的光照射层，在照射光的粘接层上配置第二电子部件主体并进行贴附的贴装工序和通过加热使粘接层固化的工序，从而得到 所述喷墨装置包括用于存储所述粘合剂的墨罐，排出部和循环流路部，并且在所述涂布步骤中，所述粘合剂在所述喷墨装置中循环的同时施加。
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9.发明公开METHOD FOR MANUFACTURING CURED FILM, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT 审中-公开VERFAHREN ZUR HERSTELLUNG EINESGEHÄRTETENFILMS，VERFAHREN ZUR HERSTELLUNG EINES ELEKTRONISCHEN BAUTEILS UND ELEKTRONISCHES BAUTEIL
公开(公告)号：EP3067124A4
公开(公告)日：2017-05-31
申请号：EP14859434
申请日：2014-11-05
发明人： TANIKAWA MITSURU , WATANABE TAKASHI , UEDA MICHIHISA , NAKAMURA SHIGERU , MAENAKA HIROSHI , TAKAHASHI RYOSUKE , INOUE TAKANORI , FUJITA YOSHITO , INUI OSAMU
CPC分类号： C09D4/00 , B41J3/407 , B41J11/002 , C09D11/101 , C09D11/30 , C09D11/52 , H05K3/287 , H05K2203/013 , H05K2203/0577
摘要： Provided is a method for producing a cured product film, which is capable of increasing the formation accuracy of a fine cured product film and also increasing the adhesion of the cured product film. The method for producing a curable film according to the present invention includes an application step in which a curable composition that is photocurable and thermocurable and also is in liquid form is applied using an ink jet device, a first light irradiation step in which the curable composition is irradiated with light from a first light irradiation part, and a heating step in which a precured product film irradiated with light is heated, the ink jet device has an ink tank to store the curable composition, a discharge part, and a circulation flow path part, and in the application step, the curable composition is applied while being circulated in the ink jet device.
摘要翻译： 本发明提供一种固化物膜的制造方法，其能够提高微细的固化物膜的形成精度，并且提高固化物膜的密合性。 本发明的固化性膜的制造方法包括：涂布工序，使用喷墨装置涂布光固化性且热固化性且液态的固化性组合物;第一光照射工序，在该第一光照射工序中， 被来自第一光照射部的光照射的加热工序和对被光照射的预固化物膜进行加热的加热工序，所述喷墨装置具有储存所述固化性组合物的墨罐，排出部以及循环流路 部分，在涂布工序中，一边在喷墨装置内循环一边涂布固化性组合物。
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10.发明公开
公开(公告)号：EP2631275A4
公开(公告)日：2014-09-03
申请号：EP11834143
申请日：2011-09-15
发明人： TANIKAWA MITSURU , WATANABE TAKASHI , INUI OSAMU , KUNIHIRO YOSHITAKA , YAMAZAKI RYOSUKE , KOBAYASHI YUSUKE
IPC分类号： C08L83/07 , C08K5/057 , C08K5/5435 , C08L83/05 , C09K3/10 , H01L23/29 , H01L23/31 , H01L33/56
CPC分类号： C08K5/04 , C08G77/12 , C08G77/20 , C08G77/80 , C08K5/0091 , C08K5/057 , C08K5/5419 , C08K5/5425 , C08K5/5435 , C08K5/56 , C08L83/00 , C08L83/04 , C09K3/1018 , H01L23/296 , H01L33/501 , H01L33/52 , H01L33/56 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： Provided is an encapsulant for optical semiconductor devices, which is capable of enhancing the adhesion between a housing and the encapsulant when an optical semiconductor device is encapsulated in the housing, and which is also capable of enhancing the bonding reliability with respect to humidity. The encapsulant for optical semiconductor devices includes: a first organopolysiloxane having an alkenyl group bonded to a silicon atom and an aryl group bonded to a silicon atom, but not having a hydrogen atom bonded to a silicon atom; a second organopolysiloxane having a hydrogen atom bonded to a silicon atom and an aryl group bonded to a silicon atom; a catalyst for hydrosilylation reaction; and an organic compound having a titanium atom.
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