中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

131 records (took 0.011 seconds)

    Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
    16.
    发明公开
    Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials 审中-公开
    低成本的热管理装置或散热片由导电负载树脂基材料制成

    公开(公告)号：EP1469513A2

    公开(公告)日：2004-10-20

    申请号：EP04368030.5

    申请日：2004-04-14

    Applicant: Integral Technologies, Inc.

    Inventor： Thomas Aisenbrey

    IPC: H01L23/373 ,  H01L23/427 ,  H01L23/367 ,  H01L23/467 ,  H01L23/473

    CPC classification number: F28D15/04 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  F21V29/677 ,  F21V29/76 ,  F21V29/89 ,  F21Y2115/10 ,  F28F3/048 ,  F28F21/062 ,  F28F21/067 ,  F28F2215/04 ,  G06K19/07749 ,  H01H2203/0085 ,  H01L21/4878 ,  H01L23/3737 ,  H01L23/427 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113 ,  H01L2924/00

    Abstract: Heat sinks, heat pipes, and other thermal management devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conducive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like. The conductive loaded resin-based heat sink, heat pipe, or other thermal management devices can be formed using methods such as injection molding compression molding or extrusion. The conductive loaded resin-based material used to form the heat sinks can also be in the form of a thin flexible woven fabric that can readily be cut to the desired shape.

    Abstract translation: 散热片，热管和其他热管理设备由导电的树脂基导电材料构成。 导电负载树脂基材料包括基础树脂主体中的微米导电粉末，导电纤维或导电粉末与导电纤维的组合。 导电粉末，导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量之比在约0.20和0.40之间。 微米导电粉末由非金属例如碳，石墨（其也可以是金属电镀的等）形成，或者由诸如不锈钢，镍，铜，银的金属形成，所述金属也可以是金属电镀的，或者 类似的，或者来自非金属的组合，电镀或与金属粉末组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。 基于导电的树脂基散热器，热管或其他热管理装置可以使用诸如注射成型压缩模制或挤出的方法来形成。 用于形成散热片的导电负载树脂基材料也可以是可以容易地切成所需形状的薄柔性机织织物的形式。

    Printed wiring board structure with integral metal matrix composite core
    17.
    发明公开
    Printed wiring board structure with integral metal matrix composite core 有权
    Leiterplattenanordnung mit integriertem Verbundkern mit metallischer Matrix

    公开(公告)号：EP1058491A2

    公开(公告)日：2000-12-06

    申请号：EP00304651.3

    申请日：2000-05-31

    Applicant: Northrop Grumman Corporation

    Inventor： Smith, Carl R. ,  Madura, Jeffrey R. ,  Kramer, Jesse J.

    IPC: H05K1/05 ,  H05K1/02

    CPC classification number: H05K1/056 ,  H01L2224/73204 ,  H05K1/0206 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0919 ,  H05K2201/10727 ,  Y10T428/24124 ,  Y10T428/24132

    Abstract: A printed wiring board structure having at least one chip-carrying layer adjacent a core fabricated of a metal matrix having disposed therein continuous pitch based graphite fibers. The chip carrying layers and the core have an interface therebetween and are integrally connected to each other through vias plated with an electrically and thermally conductive material to thereby provide a plurality of connection sites along this interface. The matrix is preferably fabricated of aluminum. Preferred fibers are fabricated of pitch based graphite. A substantial weight savings over a common molybdenum core printed wiring board is realized due to the significant reduction in density of the core material. A typically preferred present printed wiring board structure has several circuit layers and two chip-carrying layers each on opposite sides of the core, with each of the layers and the core having respective interfaces therebetween wherein each layer is integrally connected to the core at a plurality of connection sites, as required by circuit design, along the respective interfaces. Because of the plurality of connection sites along respective interfaces, superior thermal conductivity occurs from the layers to the core since heat travels through these connection sites to effectuate extremely efficient heat transfer and ultimate heat dissipation from the entire printed wiring board structure.

    Abstract translation: 一种印刷线路板结构，其具有至少一个芯片承载层，邻近由金属基体制成的芯，其中设置有连续的基于沥青的石墨纤维。 芯片承载层和芯在它们之间具有界面，并且通过电镀和导热材料的通孔彼此一体地连接，从而沿着该界面提供多个连接位置。 该基质优选由铝制成。 优选的纤维由沥青基石墨制成。 由于芯材密度的显着降低，实现了相对于普通钼芯印刷线路板的显着的重量。 通常优选的当前印刷布线板结构在芯的相对侧上具有几个电路层和两个芯片承载层，其中每个层和芯具有各自的界面，其中每个层以多个整体连接到芯 的连接站点，按照电路设计的要求，沿着相应的接口。 由于沿着各个界面的多个连接位置，因为热量传播通过这些连接部位从而实现了从整个印刷线路板结构的非常有效的热传递和最终的散热，所以从层到核心出现了优异的导热性。

    Printed wiring board structure with integral organic matrix composite core
    18.
    发明公开
    Printed wiring board structure with integral organic matrix composite core 有权
    与有机基质集成复合材料芯的电路板组件

    公开(公告)号：EP1058490A2

    公开(公告)日：2000-12-06

    申请号：EP00304645.5

    申请日：2000-05-31

    Applicant: Northrop Grumman Corporation

    Inventor： Smith, Carl R. ,  Madura, Jeffrey R. ,  Kramer, Jesse J.

    IPC: H05K1/05 ,  H05K1/02

    CPC classification number: H05K1/056 ,  H05K1/0206 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0919 ,  H05K2201/10727 ,  Y10T428/24124 ,  Y10T428/24132

    Abstract: A printed wiring board structure having at least one chip-carrying layer adjacent a core fabricated of an organic matrix having disposed therein continuous pitch based graphite fibers. The chip carrying layers and the core have an interface therebetween and are integrally connected to each other through vias plated with an electrically and thermally conductive material to thereby provide a plurality of connection sites along this interface. An organic matrix is preferably fabricated of a polymer material such as an epoxy resin. Preferred fibers are fabricated of pitch based graphite. A substantial weight savings over a common molybdenum core printed wiring board is realized due to the significant reduction in density of the core material. A typically preferred present printed wiring board structure has several circuit layers and two chip-carrying layers each on opposite sides of the core, with each of the layers and the core having respective interfaces therebetween wherein each layer is integrally connected to the core at a plurality of connection sites, as required by circuit design, along the respective interfaces. Because of the plurality of connection sites along respective interfaces, superior thermal conductivity occurs from the layers to the core since heat travels through these connection sites to effectuate extremely efficient heat transfer and ultimate heat dissipation from the entire printed wiring board structure.

    Woven mesh interconnect
    19.
    发明公开
    Woven mesh interconnect 有权
    编织编织物的连接

    公开(公告)号：EP0901191A3

    公开(公告)日：2000-10-25

    申请号：EP98307198.6

    申请日：1998-09-07

    Applicant: Thomas & Betts International, Inc.

    Inventor： Strange, Andrew H. ,  Millay, Arthur ,  Buchoff, Leonard S. ,  Macinnes, Steven K. ,  Rassier, Daniel W.

    IPC: H01R13/24

    CPC classification number: H01R13/2492 ,  H05K1/038 ,  H05K2201/0281 ,  H05K2201/029 ,  Y10T442/107 ,  Y10T442/109 ,  Y10T442/131

    Abstract: An electrical interconnect (10) is comprised of a woven mesh in which an array of parallel wires (20) is retained in spaced relation by a transverse array of nonconducting strands (30), the mesh being enclosed or encased within a resilient matrix. The conductive wires are on a close pitch to yield greater current carrying capacity and achieve a lower more stable resistance. With this construction a great number of wires are in contact with each contact pad to yield greater current carrying capacity and corresponding lower resistance. The closer pitch wires also provide greater redundancy of contact points. This structure can be custom configured in as many layers or in a variety of shapes as is desirable to achieve a given electrical performance. The woven mesh can be wrapped around a shaped substrate to provide electrical connections in a desired shape. The woven mesh interconnect can be integrated as part of a boot, wherein the boot receives an electrical device therein and the woven mesh interconnect provides electrical connection from the device within the boot to outside the boot. The woven mesh interconnect can be layered and shaped to form an interconnect which not only provides electrical interconnection but also provides a biasing force due to the shape of the device.

Patent Agency Ranking