公开(公告)号：EP2950328A1

公开(公告)日：2015-12-02

申请号：EP13858330.7

申请日：2013-11-27

申请人： Nikon Corporation

发明人： ICHINOSE, Go ,  IBE, Taisuke

IPC分类号： H01L21/027 ,  G03F7/20 ,  H01L21/677

CPC分类号： H01L21/6838 ,  B25J11/0095 ,  G03F7/70908 ,  H01L21/68742

摘要： In a carrier system, a chuck unit (153) is used to hold a placed wafer (W) from above, and vertical-motion pins (140) use suction to hold the wafer (W) from below. Then, chuck unit (153) and vertical-motion pins (140) are subsequently lowered until a bottom surface of the wafer comes into contact with a wafer table (WTB). During the lowering, the holding force exerted by chuck unit (153) and the arrangement of chuck members (124) are optimally adjusted such that, as a result of the restraint of wafer (W) by chuck unit (153) and vertical-motion pins (140), localized surplus-restraint is imparted to wafer (W), and warping does not occur.

公开(公告)号：EP2940723A1

公开(公告)日：2015-11-04

申请号：EP13868539.1

申请日：2013-12-25

申请人： Kawasaki Jukogyo Kabushiki Kaisha

发明人： HASHIMOTO, Yasuhiko ,  FUKUSHIMA, Takayuki ,  KANAMARU, Ryosuke ,  MIYAGAWA, Daiki

IPC分类号： H01L21/677

CPC分类号： H01L21/67742 ,  B25J11/0095 ,  H01L21/67766 ,  H01L21/67769 ,  H01L21/67781 ,  H01L21/68707

摘要： The end effector device (1) includes a hand (3) having a storing space, and a plurality of holding portions (4A, 4B) provided to the hand (3) and configured to respectively peripheral portions of each plate member. Each holding portion (4A, 4B) includes a plurality of receiving portions (42) which respectively receive a plurality of plate members keeping vertical pitches among them, and a pitch changing mechanism (7) configured to change intervals by vertically moving the plurality of receiving portions (42) respectively. A plurality of linearly moving portions (41A) configured to respectively move linearly integrally with the plurality of receiving portions (42) are provided to the hand (3) being exposed outside of the hand (3), and a plurality of drive portions configured to drive the plurality of linearly moving portions (41A) of the pitch changing mechanism (7) are stored in the storing space of the hand (3).

摘要翻译： 末端执行器装置（1）包括具有存储空间的手（3）以及设置于手（3）并分别构造成分别围绕每个板构件的周边部分的多个保持部（4A，4B）。 每个保持部分（4A，4B）包括多个接收部分（42）和间距改变机构（7），所述多个接收部分（42）分别接收保持垂直间距的多个板部件，所述间距改变机构通过垂直移动所述多个接收部 部分（42）。 多个线性移动部分（41A）被构造成分别与多个接收部分（42）一体地线性地整体移动，并且手部（3）暴露在手部（3）的外部，以及多个驱动部分， 驱动间距改变机构（7）的多个线性移动部分（41A）被存储在手（3）的存储空间中。

公开(公告)号：EP2919260A1

公开(公告)日：2015-09-16

申请号：EP12887866.7

申请日：2012-11-07

申请人： Fuji Machine Mfg. Co., Ltd.

发明人： YAMASAKI Toshihiko ,  SHIMIZU Toshinori ,  OHASHI Hiroyasu ,  MURAI Masaki

IPC分类号： H01L21/52

CPC分类号： H01L21/68785 ,  B25J11/0095 ,  B25J15/0028 ,  H01L21/67144 ,  H01L21/67346 ,  H01L21/68707 ,  H01L21/68721 ,  H01L21/68728 ,  H01L24/75 ,  H01L2224/7565

摘要： In this specification, a chip supplying apparatus which supplies a chip to a mounting machine which mounts the chip on a substrate is disclosed. The chip supplying apparatus is provided with a wafer table which holds a wafer sheet at a position where an operation head of the mounting machine can receive the chip. In the chip supplying apparatus, the wafer table is provided with a frame, a stopper which is fixed to the center of a front portion of the frame and abuts against a front end of the wafer sheet, and a pair of clamp mechanisms which is supported by the frame and which clamps both side ends of the wafer sheet. In the chip supplying apparatus, a position of the pair of clamp mechanisms in a right-and-left direction with respect to the frame can be changed in multiple steps.

摘要翻译： 在本说明书中，公开了一种将芯片供应到将芯片安装在基板上的安装机的芯片供应装置。 芯片供应装置设置有晶片台，该晶片台将晶片片保持在安装机的操作头能够容纳芯片的位置处。 在该芯片供给装置中，晶片台设置有框架，固定在框架的前部的中央并与晶片的前端抵接的挡块，以及一对被夹持的夹持机构 通过框架并且夹持晶片片材的两个侧端。 在芯片供给装置中，一对夹持机构相对于框架在左右方向上的位置可以分多步进行变更。

公开(公告)号：EP2408004A4

公开(公告)日：2014-08-06

申请号：EP10750632

申请日：2010-01-29

申请人： KAWASAKI HEAVY IND LTD

发明人： HASHIMOTO YASUHIKO ,  YOSHIDA TETSUYA

IPC分类号： H01L21/677 ,  B25J15/08

CPC分类号： B25J15/0014 ,  B25J9/042 ,  B25J9/10 ,  B25J11/0095 ,  B25J15/0052 ,  B25J15/0616 ,  H01L21/67742 ,  H01L21/68707 ,  Y10S414/137 ,  Y10S414/141 ,  Y10T74/20305

公开(公告)号：EP2668008A2

公开(公告)日：2013-12-04

申请号：EP12738731.4

申请日：2012-01-27

申请人： Intouch Technologies, Inc. ,  iRobot Corporation

发明人： WANG, Yulun ,  JORDAN, Charles S. ,  WRIGHT, Tim ,  CHAN, Michael ,  PINTER, Marco ,  HANRAHAN, Kevin ,  SANCHEZ, Daniel ,  BALLANTYNE, James ,  HERZOG, Cody ,  WHITNEY, Blair ,  LAI, Fuji ,  TEMBY, Kelton ,  RAUHUT, Eben Christopher ,  KEARNS, Justin H. ,  WONG, Cheuk Wah ,  FARLOW, Timothy Sturtevant

IPC分类号： B25J5/00 ,  B25J13/08 ,  G05D1/02 ,  G06F9/44

CPC分类号： B25J9/1664 ,  B25J5/00 ,  B25J9/1689 ,  B25J9/1697 ,  B25J11/009 ,  B25J11/0095 ,  G05D1/0038 ,  G05D1/024 ,  G05D1/0274 ,  G05D2201/0206 ,  G06F3/0482 ,  G06F3/04842 ,  G06F3/04847 ,  G06F19/00 ,  G06F19/3418 ,  G06T11/00 ,  G06T11/60 ,  G06T15/10 ,  G06T2200/24 ,  Y10S901/01 ,  Y10S901/47

摘要： A telepresence robot may include a drive system, a control system, an imaging system, and a mapping module. The mapping module may access a plan view map of an area and tags associated with the area. In various embodiments, each tag may include tag coordinates and tag information, which may include a tag annotation. A tag identification system may identify tags within a predetermined range of the current position and the control system may execute an action based on an identified tag whose tag information comprises a telepresence robot action modifier. The telepresence robot may rotate an upper portion independent from a lower portion. A remote terminal may allow an operator to control the telepresence robot using any combination of control methods, including by selecting a destination in a live video feed, by selecting a destination on a plan view map, or by using a joystick or other peripheral device.

公开(公告)号：EP4356421A1

公开(公告)日：2024-04-24

申请号：EP22743728.2

申请日：2022-06-15

申请人： Beier, Uwe

发明人： Beier, Uwe

IPC分类号： H01L21/677 ,  B65G49/04 ,  B25J15/00

CPC分类号： H01L21/67742 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/67754 ,  B25J15/0052 ,  B25J11/0095 ,  B25J15/0014 ,  B25J18/002 ,  B65G49/067

公开(公告)号：EP2950329A4

公开(公告)日：2016-10-12

申请号：EP13859307

申请日：2013-11-27

申请人： NIPPON KOGAKU KK

发明人： HARA HIDEAKI

IPC分类号： H01L21/68 ,  B25J11/00 ,  B25J15/06 ,  G03F7/20 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687

CPC分类号： B25J11/0095 ,  B25J15/0616 ,  G03F7/70716 ,  G03F7/7075 ,  G03F7/70783 ,  H01L21/67259 ,  H01L21/67288 ,  H01L21/681 ,  H01L21/6838 ,  H01L21/68778

摘要： A carrier system is provided with a wafer stage (WST) which holds a mounted wafer (W) and is also movable along an XY plane, a chuck unit (153) which holds the wafer from above in a non-contact manner above a predetermined position and is vertically movable, and a plurality of vertical movement pins (140), which can support from below the wafer held by the chuck unit (153) on the wafer stage (WST) when the wafer stage (WST) is positioned at the predetermined position above and can also move vertically. Then, flatness of the wafer (W) is measured by a Z position detection system (146), and based on the measurement results, the chuck unit(153) and the vertical movement pins (140) that hold (support) the wafer (W) are independently driven.

公开(公告)号：EP2940723A4

公开(公告)日：2016-08-10

申请号：EP13868539

申请日：2013-12-25

申请人： KAWASAKI HEAVY IND LTD

发明人： HASHIMOTO YASUHIKO ,  FUKUSHIMA TAKAYUKI ,  KANAMARU RYOSUKE ,  MIYAGAWA DAIKI

IPC分类号： H01L21/677 ,  B25J11/00 ,  H01L21/687

CPC分类号： H01L21/67742 ,  B25J11/0095 ,  H01L21/67766 ,  H01L21/67769 ,  H01L21/67781 ,  H01L21/68707

公开(公告)号：EP2716416B1

公开(公告)日：2016-04-27

申请号：EP13187347.3

申请日：2013-10-04

申请人： Hirata Corporation

发明人： Ando, Hiroaki

IPC分类号： B25J9/04

CPC分类号： B25J18/04 ,  B25J9/043 ,  B25J11/0095

公开(公告)号：EP2891173A4

公开(公告)日：2016-03-30

申请号：EP13832999

申请日：2013-09-02

申请人： SEMICONDUCTOR TECH & INSTR INC

发明人： JIN JIAN PING ,  LEE LENG KHEAM

IPC分类号： H01L21/683 ,  H01L21/687

CPC分类号： H01L21/681 ,  B25J11/0095 ,  B25J15/0616 ,  B25J15/0658 ,  B25J15/0666 ,  G01B11/27 ,  G01N21/9501 ,  G01N2201/025 ,  H01L21/67144 ,  H01L21/67706 ,  H01L21/6838 ,  H01L21/68757 ,  Y10T29/49826

摘要： A wafer table structure providing a single wafer table surface suitable for handling both wafers and film frames includes a base tray having a set of compartments formed therein by way of a set of ridges formed in or on an interior base tray surface; a hardenable fluid permeable compartment material disposed within the set of base tray compartments; and a set of openings formed in the base tray interior surface by which the hardened compartment material is exposable to negative or positive pressures. The base tray includes a first ceramic material (e.g., porcelain), and the hardenable compartment material includes a second ceramic material. The base tray and the compartment material are simultaneously machinable by way of a standard machining process to thereby planarize exposed outer surfaces of the base tray and the hardened compartment material at an essentially identical rate for forming a highly or ultra-planar wafer table surface.