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    Systems and methods for a three-layer chip-scale MEMS device
    21.
    发明公开
    Systems and methods for a three-layer chip-scale MEMS device 有权
    Chipgröße的System-und Verfahrenfürdreilagige MEMS-Vorrichtung

    公开(公告)号：EP2455331A2

    公开(公告)日：2012-05-23

    申请号：EP11190203.7

    申请日：2011-11-22

    Applicant: Honeywell International, Inc.

    Inventor： Horning, Robert D. ,  Supino, Ryan

    IPC: B81B7/02 ,  B81B7/00

    CPC classification number: H01L29/84 ,  B81B7/0032 ,  B81B7/0038 ,  B81B7/0074 ,  B81B7/0077 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81C2201/019 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: Systems and methods for a micro-electromechanical system (MEMS) device are provided. In one embodiment, a system comprises a first outer layer and a first device layer comprising a first set of MEMS devices, wherein the first device layer is bonded to the first outer layer. The system also comprises a second outer layer and a second device layer comprising a second set of MEMS devices, wherein the second device layer is bonded to the second outer layer. Further, the system comprises a central layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer.

    Abstract translation: 提供了用于微机电系统（MEMS）装置的系统和方法。 在一个实施例中，系统包括第一外层和包括第一组MEMS器件的第一器件层，其中第一器件层结合到第一外层。 该系统还包括第二外层和包括第二组MEMS器件的第二器件层，其中第二器件层结合到第二外层。 此外，该系统包括具有第一侧和与第一侧相反的第二侧的中心层，其中第一侧接合到第一器件层，第二侧接合到第二器件层。

    VERBUND AUS MINDESTENS ZWEI HALBLEITERSUBSTRATEN SOWIE HERSTELLUNGSVERFAHREN
    26.
    发明授权
    VERBUND AUS MINDESTENS ZWEI HALBLEITERSUBSTRATEN SOWIE HERSTELLUNGSVERFAHREN 有权
    COMPOSITE至少两个半导体基板和制作工艺

    公开(公告)号：EP2197781B1

    公开(公告)日：2011-04-06

    申请号：EP08803521.7

    申请日：2008-09-02

    Applicant: Robert Bosch GmbH

    Inventor： FRANKE, Axel ,  TRAUTMANN, Achim ,  FEYH, Ando ,  KNIES, Sonja

    IPC: B81C1/00

    CPC classification number: B81C1/00238 ,  B81C2201/019 ,  B81C2203/036

    Abstract: The invention relates to a composite (1) comprising a first semiconductor substrate (4) having at least one MEMS-component (2) and at least one second semiconductor substrate (4), wherein at least one layer (6) comprising germanium is bonded eutectically with at least one layer (3) comprising aluminum. According to the invention, the layer (3) comprising aluminum is provided on the first semiconductor substrate (1) and the layer (6) comprising germanium on the second semiconductor substrate (4). The invention further relates to a production method for a composite (1).

    MICROCHIP AND METHOD FOR MANUFACTURING MICROCHIP
    28.
    发明公开
    MICROCHIP AND METHOD FOR MANUFACTURING MICROCHIP 审中-公开
    MIKROCHIP UND VERFAHREN ZUR HERSTELLUNG EINES MIKROCHIPS

    公开(公告)号：EP2264466A1

    公开(公告)日：2010-12-22

    申请号：EP09730220.2

    申请日：2009-04-07

    Applicant: Konica Minolta Opto, Inc.

    Inventor： HIRAYAMA, Hiroshi

    IPC: G01N35/08 ,  B01J19/00 ,  B81B1/00 ,  B81C3/00 ,  G01N37/00

    CPC classification number: B81C1/00119 ,  B81B2201/058 ,  B81C3/001 ,  B81C2201/019 ,  B81C2203/032 ,  G01N2035/00158 ,  Y10T156/10

    Abstract: A microchip has a resin substrate, which is provided with a first surface whereupon a channel groove is formed and a second surface on the opposite side to the first surface, and the microchip also has a resin film bonded on the first surface. A projection area is larger than the area of the first surface of the resin substrate when the resin substrate is viewed from a direction orthogonally intersecting with the first surface. Thus, warpage of the microchip can be suppressed at the time of thermally bonding the resin substrate and the resin film by a roller.

    Abstract translation: 微芯片具有树脂基板，其具有形成沟槽的第一表面和与第一表面相对的第二表面，并且微芯片还具有粘结在第一表面上的树脂膜。 当从与第一表面正交的方向观察树脂基板时，投影面积大于树脂基板的第一表面的面积。 因此，通过辊子热粘合树脂基板和树脂膜时，可以抑制微芯片的翘曲。

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