公开(公告)号：EP0851885B1

公开(公告)日：2000-01-05

申请号：EP96930255.3

申请日：1996-09-12

Applicant: International Business Machines Corporation

Inventor： AFZALI-ARDAKANI, Ali ,  GELORME, Jeffrey, Donald ,  KOSBAR, Laura, Louise

IPC: C08H5/02 ,  H05K1/03

CPC classification number: C08H6/00 ,  C08L97/005 ,  H05K1/0313 ,  H05K1/0366 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/178

Abstract: Biobased cross-linked compositions, methods of fabrication and structures, in particular biobased printed wiring boards using the compositions and methods of making the structures are described. Biobased materials such as lignin, crop oils, wood resins, tannins, and polysaccharides and combinations thereof are cross-linked, preferably using heat, a cross-linking agent, and an initiator. The materials fabricated have suitable properties for printed wiring boards which are made by impregnating a fibreglass or biobased cloth with an admixture of the biobased material, cross-linking agent and initiator which is processed by conventional methods to produce a printed wiring board.

公开(公告)号：EP0768334A2

公开(公告)日：1997-04-16

申请号：EP96116329.2

申请日：1996-10-11

Applicant: SUMITOMO CHEMICAL COMPANY LIMITED

Inventor： Takahashi, Tsutomu ,  Tsujimoto, Yoshifumi ,  Kumada, Hiroaki ,  Sato, Hiroyuki

IPC: C08J5/24 ,  C08J5/04 ,  H05K1/03

CPC classification number: B32B15/14 ,  B32B5/022 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/026 ,  B32B2457/08 ,  C08J5/04 ,  C08J5/24 ,  H05K1/0366 ,  H05K2201/0116 ,  H05K2201/0129 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/068 ,  Y10S428/901 ,  Y10S428/902 ,  Y10S428/91 ,  Y10T428/24917 ,  Y10T428/24993 ,  Y10T428/24994 ,  Y10T428/249944 ,  Y10T428/249953 ,  Y10T428/249955 ,  Y10T428/2907 ,  Y10T428/2938 ,  Y10T428/2969 ,  Y10T428/2971 ,  Y10T428/30 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31725 ,  Y10T442/2008 ,  Y10T442/2893 ,  Y10T442/2902

Abstract: The present invention provides a lightweight prepreg having uniform formation, low linear thermal expansion coefficient and good mechanical strength, comprising a porous para-oriented aromatic polyamide film and a thermoplastic resin and/or a thermosetting resin, the porous para-oriented aromatic polyamide film being impregnated with the thermoplastic resin and/or the thermosetting resin, a process for producing the same, and a printed circuit substrate/board using the same.
A process for producing for producing a prepreg comprising a porous para-oriented aromatic polyamide film and a thermoplastic resin and/or a thermosetting resin, the porous para-oriented aromatic polyamide film being impregnated with the thermoplastic resin and/or thermosetting resin, which comprises the following steps (a) to (d):

step (a) of forming a film-like material from a solution containing 1 to 10% by weight of a para-oriented aromatic polyamide having an inherent viscosity of 1.0 to 2.8 dl/g and 1 to 10% by weight of a chloride of an alkaline metal or an alkaline earth metal in a polar amide solvent or a polar urea solvent;
step (b) of maintaining the film-like material at a temperature of not less than 20°C or not more than -5°C to deposit the para-oriented aromatic polyamide from the film-like material;
step (c) of immersing the film-like material obtained in the step (b) in an aqueous solution or an alcoholic solution to elute the solvent and the chloride of the alkaline metal or alkaline earth metal, followed by drying to obtain a para-aramid porous film; and
step (d) of impregnating the porous film obtained in the step (c) as a substrate with the thermoplastic resin and/or thermosetting resin to produce a prepreg.

Abstract translation: 本发明提供具有均匀形成，低线性热膨胀系数和良好的机械强度，包括多孔对位取向芳香族聚酰胺薄膜和热塑性树脂和/或热固性树脂，该多孔对位取向芳香族聚酰胺薄膜感轻质预浸渍体 浸渍有热塑性树脂和/或热固性树脂，其制造方法，以及使用其的印刷电路基板/电路板。 一种生产用于生产预浸料，其包括多孔对位取向芳香族聚酰胺薄膜和热塑性树脂和/或热固性树脂，处理该多孔对位取向的芳族聚酰胺薄膜中浸渍有热塑性树脂和/或热固性树脂，该方法包括 以下步骤（a）至（d）：工序（a）形成由（重量）具有以1.0固有粘度的对位取向芳香族聚酰胺的含有1至10％的溶液的薄膜状材料制成，以2.8升/克 和1〜10％（重量）的碱金属或碱土金属的氯化物在极性酰胺系溶剂或极性尿素溶剂; 步骤（b）在不低于20℃的温度或不膜状材料的保持超过-5℃来沉积从薄膜状材料的对位取向芳香族聚酰胺; 在浸渍步骤（b）中得到的薄膜状材料以wässrige溶液或在醇溶液中进行干燥以获得一个对位，以洗脱溶剂和碱金属或碱土金属的氯化物，随后的步骤（c） 芳族聚酰胺多孔膜; 和浸渍的步骤（d）的多孔膜得到的在步骤（c）为与热塑性树脂和/或热固性树脂以生产的预浸料的基片。

公开(公告)号：EP0199328B1

公开(公告)日：1992-08-12

申请号：EP86105496.3

申请日：1986-04-21

Applicant: ASAHI GLASS COMPANY LTD.

Inventor： Ohta, Hironori ,  Mukaiyama, Takashi

IPC: H05K1/03

CPC classification number: C03B37/011 ,  C03B37/075 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/0296 ,  Y10T428/2973 ,  Y10T428/298 ,  Y10T442/3008 ,  Y10T442/3114 ,  Y10T442/601 ,  Y10T442/611

公开(公告)号：EP0295816A3

公开(公告)日：1990-06-13

申请号：EP88305111.2

申请日：1988-06-03

Applicant: SHIN-KOBE ELECTRIC MACHINERY CO LTD

Inventor： Kariya, Kenichi ,  Noda, Masayuki ,  Yamaguchi, Takahiro ,  Takahashi, Katsuji

IPC: H05K1/03 ,  H05K3/46 ,  B32B15/08 ,  C08J5/04

CPC classification number: B32B15/14 ,  B32B5/022 ,  B32B5/024 ,  B32B5/08 ,  B32B15/08 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/188 ,  B32B2305/20 ,  B32B2457/08 ,  C08J5/047 ,  C08J2363/00 ,  H05K1/0346 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/0355 ,  Y10T428/31681 ,  Y10T442/3138 ,  Y10T442/3252 ,  Y10T442/3415 ,  Y10T442/656

Abstract: A woven or nonwoven fabric made of a mixture of at least two of meta-aramid, polyethylene terephthalate and glass fibers is impregnated with a solution of an adduct of an epoxy resin and a copolymer of acrylonitrile and butadiene having carboxyl groups at both chaim ends; as a preliminary reaction product or mixed with another epoxy resin. A curing agent maybe included in the solution. The dried impregnated fabric is dried and a metal foil, e.g. of copper, is placed over at least one face of the fabric base and is laminated thereto by heat and pressure. The resultant laminate is usable as a printed circuit board and can be bent to a desired shape.

公开(公告)号：EP0309982A2

公开(公告)日：1989-04-05

申请号：EP88115864.6

申请日：1988-09-27

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： Bolt, John Davis ,  Button, Daniel Paul ,  Yost, Bruce Allen

IPC: C08J5/24 ,  H05K1/03 ,  H01L23/14

CPC classification number: C08J5/044 ,  B32B27/04 ,  H01L23/145 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K1/0366 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/068 ,  H01L2924/00

Abstract: A composite containing high purity crystal­line ceramic fibers in a polymeric matrix, suitable for use as a microelectronic device package or circuit board. The composite exhibits high thermal conducti­vity, and low coefficients of thermal expansion in-­plane, and moderate thermal conductivities and low dielectric constants out-of-plane.

Abstract translation: 在聚合物基质中含有高纯度结晶陶瓷纤维的复合材料，适合用作微电子器件封装或电路板。 该复合材料具有高导热性和低平面内的热膨胀系数，以及适度的热导率和低介电常数。

公开(公告)号：EP0285714A1

公开(公告)日：1988-10-12

申请号：EP87303056.3

申请日：1987-04-08

Applicant: Corning Glass Works

Inventor： Wu, Shy-Hsien

IPC: B32B19/02 ,  B32B15/14

CPC classification number: H05K1/0366 ,  B32B19/04 ,  H05K2201/0245 ,  H05K2201/0251 ,  H05K2201/0293

Abstract: Laminated synthetic mica articles are disclosed that have particular applicability as substrates in electronic components. The articles comprise a core of stacked and consolidated, synthetic mica sheets that are impregnated with resin, and a copper foil sealed to a face on the article. Adherence of the copper foil is enhanced by use of a micaceous facing layer and bonding sheet, both being resin-impregnated and the resin cure being advanced beyond the normal B-stage level before assembly. Insulation resistance is enhanced by providing an advanced resin coating on the copper foil before assembly. Use of a bismaleimide triazine and epoxy mixed resin is also disclosed whereby a transformation temperature (Tg) of about 200°C. is obtained.

Abstract translation: 公开了具有作为电子部件中的基材的特殊适用性的复合合成云母制品。 这些制品包括用树脂浸渍的堆叠和固结的合成云母片的芯，以及密封在制品上的面上的铜箔。 通过使用云母面层和粘合片，在组装之前树脂浸渍和树脂固化超过正常的B阶段水平，提高了铜箔的粘附性。 通过在组装之前在铜箔上提供先进的树脂涂层来提高绝缘电阻。 还公开了双马来酰亚胺三嗪和环氧树脂混合树脂的使用，由此获得约200℃的转变温度（Tg）。

公开(公告)号：EP0115399B1

公开(公告)日：1987-09-23

申请号：EP84300276.7

申请日：1984-01-17

Applicant: Corning Glass Works

Inventor： Hoda, Syed Nurul ,  Olszewski, Anthony Richard

IPC: D21H5/18 ,  H05K1/03

CPC classification number: H05K1/0366 ,  D21H13/44 ,  H05K2201/0293 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/251 ,  Y10T428/2911 ,  Y10T428/31518

公开(公告)号：EP0079608B1

公开(公告)日：1987-02-04

申请号：EP82110542.6

申请日：1982-11-15

Applicant: KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA

Inventor： Fushiki, Yasuo ,  Oizumi, Masayuki ,  Abe, Masaharu ,  Watanabe, Makoto

IPC: B32B15/08 ,  H05K1/02 ,  D21H5/00

CPC classification number: B32B15/12 ,  B32B15/08 ,  B32B27/18 ,  B32B27/36 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2307/3065 ,  B32B2457/08 ,  H05K1/034 ,  H05K1/0373 ,  H05K3/386 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2201/0355 ,  H05K2203/122 ,  Y10S428/92 ,  Y10S428/921 ,  Y10T428/31522 ,  Y10T428/31681 ,  Y10T428/31688 ,  Y10T428/31703

公开(公告)号：EP0053395A1

公开(公告)日：1982-06-09

申请号：EP81110060.1

申请日：1981-12-01

Applicant: KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA

Inventor： Oizumi, Masayuki ,  Abe, Masaharu ,  Fushiki, Yasuo

IPC: B32B29/06 ,  C08K5/02 ,  C08L67/06 ,  D21H3/02

CPC classification number: B32B15/12 ,  B32B7/12 ,  B32B15/20 ,  B32B29/06 ,  B32B2255/12 ,  B32B2255/24 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/062 ,  B32B2307/3065 ,  B32B2311/12 ,  B32B2367/00 ,  C08K5/02 ,  C09K21/08 ,  D21H5/0002 ,  D21H21/34 ,  D21H27/32 ,  D21H27/34 ,  D21H27/38 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/122 ,  Y10S428/921 ,  Y10T428/31681 ,  Y10T428/31786 ,  Y10T428/3179 ,  Y10T428/31982 ,  Y10T428/31993 ,  C08L67/06

Abstract: A flame-retarded copper-clad laminate is provided comprising a plurality of paper substrate layers each impregnated with an unsaturated polyester resin and a copper cladding adhesively bonded onto at least one side thereof.
The improvement comprises said unsaturated polyester resin containing an aliphatic and/or alicyclic brominated flame-retardant and aromatic brominated flame-retardant in combination.

公开(公告)号：EP0040848A1

公开(公告)日：1981-12-02

申请号：EP81104019.5

申请日：1981-05-25

Applicant: KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA

Inventor： Fushiki, Yasuo ,  Abe, Masaharu ,  Oizumi, Masazuki

IPC: B32B27/10 ,  H01B3/48 ,  H05K3/02 ,  B32B27/04

CPC classification number: B32B27/10 ,  B32B7/12 ,  B32B15/08 ,  B32B27/04 ,  B32B27/36 ,  B32B27/38 ,  B32B2305/72 ,  B32B2457/08 ,  H01B3/48 ,  H05K1/036 ,  H05K2201/0145 ,  H05K2201/0195 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/1476 ,  Y10S428/901 ,  Y10T428/24967 ,  Y10T428/31515 ,  Y10T428/31529 ,  Y10T428/31692 ,  Y10T428/3179 ,  Y10T428/3188 ,  Y10T428/31906 ,  Y10T428/31967

Abstract: An electrical laminate comprising a plurality of fibrous cellulosic substrated layers (1) and alternately interposed layers of cured epoxy or unsaturated polyester resin (2) between the adjacent substrate layers, wherein each of the substrate layers is embedded in a matrix.of said cured resin which is substantially integral with said layers of cured resin, and consists essentially of cellulosic fibers having thereon a coating of methylol group-containing resin such as aminoplast resins. The laminate may be unclad or cladded with a metal foil.

Abstract translation: 一种电气层压板，包括多个纤维状纤维素基层（1）和相邻基底层之间交替插入的固化环氧树脂或不饱和聚酯树脂层（2），其中每个基底层嵌入所述固化树脂的基质中， 与所述固化树脂层基本上成一体，并且基本上由其上具有含羟甲基的树脂如氨基塑料树脂的涂层的纤维素纤维组成。 层压体可以用金属箔未包覆或包覆。