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    Secondary battery
    25.
    发明公开
    Secondary battery 有权
    二次电池

    公开(公告)号：EP2200113A1

    公开(公告)日：2010-06-23

    申请号：EP09179386.9

    申请日：2009-12-16

    Applicant: Samsung SDI Co., Ltd.

    Inventor： Kim, Bongyoung ,  Ha, Jaeyoung ,  Kim, Youngho

    IPC: H01M2/22 ,  H01M10/04 ,  H01M2/04

    CPC classification number: H01M2/0404 ,  H01M2/22 ,  H01M10/0436 ,  H01M10/052 ,  H01M10/42 ,  H01M10/425 ,  H01M2200/106 ,  H05K1/117 ,  H05K3/328 ,  H05K3/3405 ,  H05K2201/09172 ,  H05K2201/1034

    Abstract: Disclosed is a secondary battery (10) comprising: a bare cell (100); a protection circuit module (200) having a board (210) having a first hole (210a) formed by opening a portion of a first short edge (211) thereof and located on the bare cell (100); and a first lead plate (300) located between the bare cell (100) and the protection circuit module (200) to support portions of the board (210) located on opposite sides of the first hole (210a) about the first hole (210a) thereby.

    Abstract translation: 公开了一种二次电池（10），包括：裸电池（100） 保护电路模块（200），其具有电路板（210），所述电路板具有通过打开其第一短边（211）的一部分而形成并位于所述裸电池（100）上的第一孔（210a）; 和位于裸电池（100）和保护电路模块（200）之间的第一引线板（300），以支撑位于第一孔（210a）的相对侧上的板（210）的围绕第一孔（210a）的部分 ）。

    SYSTEM COMPRISING AT LEAST TWO PRINTED CIRCUIT BOARDS
    27.
    发明授权
    SYSTEM COMPRISING AT LEAST TWO PRINTED CIRCUIT BOARDS 有权
    组件技术连接至少两个印刷电路

    公开(公告)号：EP1238445B1

    公开(公告)日：2007-05-23

    申请号：EP01967170.0

    申请日：2001-07-13

    Applicant: Koninklijke Philips Electronics N.V.

    Inventor： RENIERS, Johannes, F., A.

    IPC: H01R12/28

    CPC classification number: H05K3/366 ,  H01R12/52 ,  H05K2201/048 ,  H05K2201/09172

    Abstract: In a system comprising two printed circuit boards, each printed circuit board is provided with at least one electrical contact element for electrically interconnecting the printed circuit boards. One of the electrical contact elements comprises at least one electroconductive pin formed from one of the printed circuit boards, while the other electrical contact element is formed by at least one hole in the other printed circuit board, a wall of said hole being covered with an electrically conducting layer.

    Telecommunications plug, an assembly including a telecommunications module and a plug, and a method of manufacturing a plug
    28.
    发明公开
    Telecommunications plug, an assembly including a telecommunications module and a plug, and a method of manufacturing a plug 有权
    插头，用于电信组件具有用于插头的电信模块和一个插头，和制造方法

    公开(公告)号：EP1770832A1

    公开(公告)日：2007-04-04

    申请号：EP05021514.4

    申请日：2005-09-30

    Applicant: 3M Innovative Properties Company

    Inventor： Bonvallat, Pierre ,  Koruschowitz, Axel ,  Metral, Guy ,  Perrier, Gaetan

    IPC: H01R13/66

    CPC classification number: H05K1/144 ,  H01R13/6658 ,  H01R24/62 ,  H01R2107/00 ,  H05K1/0254 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/09172

    Abstract: A plug (10) includes a housing (12) and at least one functional component (54, 56) and/or circuit and is connectable with contacts of a telecommunications module, wherein the plug (10) includes at least two printed circuit boards (14, 16).
    An assembly, such as a distribution point, in particular a main distribution frame includes at least one telecommunications module and at least one plug (10).
    A method of manufacturing a plug including a housing and at least one functional component, which is connectable with contacts of a telecommunications module, includes the step of arranging at least two printed circuit boards in the plug.

    Abstract translation: 插头（10）包括壳体（12）和至少一个功能部件（54，56）和/或电路，并且可连接与电信模块的触点，worin插头（10）包括至少两块印刷电路板（ 14，16）。 在组装时，搜索作为分发点，尤其是总配线架包括至少一个电信模块和至少一个插头（10）。 一种制造插头包括外壳和至少一个功能部件的方法，在所有可连接与电信模块的触点，包括在所述插塞设置至少两块印刷电路板的步骤。

    PRINTED BOARD, MANUFACTURING METHOD THEREFOR AND STRUCTURE FOR CONNECTING CONDUCTOR ELEMENTS TO THE PRINTED BOARD
    29.
    发明公开
    PRINTED BOARD, MANUFACTURING METHOD THEREFOR AND STRUCTURE FOR CONNECTING CONDUCTOR ELEMENTS TO THE PRINTED BOARD 失效
    GEDRUCKTE PLATTE UND VERFAHREN ZU DEREN HERSTELLUNG

    公开(公告)号：EP0893945A1

    公开(公告)日：1999-01-27

    申请号：EP98900724.0

    申请日：1998-01-22

    Applicant: ROHM CO., LTD.

    Inventor： NAKAMURA, Satoshi ,  TANAKA, Masaharu

    IPC: H05K1/02 ,  H05K1/18

    CPC classification number: H05K3/4015 ,  H05K3/3405 ,  H05K3/341 ,  H05K2201/09172 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10962 ,  Y02P70/613

    Abstract: There are disclosed printed board (5) on which electronic parts are mounted, a method for manufacturing the printed board, and a structure for connecting conductor elements (8, 8') to this printed board. The printed board includes an insulating supporting substrate (50) and at least one metallic terminal (53, 54). The supporting substrate is provided with at least one opening (51, 52) through the substrate, and the metallic terminal is fixed to the supporting substrate without protruding from the supporting substrate and bridges the opening.

    Abstract translation: 公开了其上安装有电子部件的印刷电路板（5），印刷电路板的制造方法以及用于将导体元件（8,8'）连接到该印刷电路板的结构。 印刷电路板包括绝缘支撑基板（50）和至少一个金属端子（53,54）。 支撑基板设置有穿过基板的至少一个开口（51,52），并且金属端子固定到支撑基板而不从支撑基板突出并桥接开口。

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