公开(公告)号：EP1752296A2

公开(公告)日：2007-02-14

申请号：EP06016152.8

申请日：2006-08-02

申请人： SONY CORPORATION ,  TAIYO INK MFG. CO., LTD.

发明人： Igarashi, Koichi, c/o Sony Corp. ,  Ono, Shogo, c/o Sony Corp. ,  Tomita, Manabu, c/o Sony Corp. ,  Kohno, Minoru, c/o Sony Corp. ,  Ushiki, Shigeru, c/o Ranzan Facility, Taiyo Ink ,  Makita, Shohei, c/o Ranzan Facility, Taiyo Ink

IPC分类号： B41J2/16

CPC分类号： B41J2/1632 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1631 ,  B41J2/1639 ,  Y10T29/42 ,  Y10T29/49083 ,  Y10T29/49401

摘要： Disclosed is a liquid ejecting recording head with improved operational reliability. A first coating resin layer of a liquid ejecting recording head, having a liquid flow duct and a liquid ejecting orifice, is formed of an oxetane resin composition that contains, as necessary components, an oxetane compound having at least one oxetanyl group in a molecule, and a cationic photopolymerization initiator.

摘要翻译： 公开了一种具有改进的操作可靠性的液体喷射记录头。 具有液体流动管道和液体喷射孔的液体喷射记录头的第一涂覆树脂层由氧杂环丁烷树脂组合物形成，该组合物在分子中含有至少一个氧杂环丁烷基的氧杂环丁烷化合物， 和阳离子光聚合引发剂。

公开(公告)号：EP1219680A4

公开(公告)日：2005-03-30

申请号：EP00961194

申请日：2000-09-22

申请人： TAIYO INK MFG CO LTD

发明人： NIKAIDOU MASARU ,  HIRAHARA SHOKO ,  KURABAYASHI NARIAKI

IPC分类号： C09D4/00 ,  C09D4/02 ,  G03F7/027 ,  G03F7/028 ,  H01J9/14 ,  C08L33/06 ,  C08F290/06

CPC分类号： H01J9/142 ,  C09D4/00 ,  G03F7/027

摘要： An ultraviolet-curable resin composition which contains a photopolymerizable compound containing a phosphorus atom and a photopolymerizable compound having a carboxyl group and has a surface tension at 25 DEG C of 30 to 50 mN/m. Preferably, it comprises (a) a compound having one or more (meth)acryloyl groups per molecule and a phosphorus atom, (b) a compound having one carboxyl group and one (meth)acryloyl group per molecule, (c) a compound having one or more (meth)acryloyl groups per molecule, (d) a leveling agent, and (e) a photoinitiator. The ultraviolet-curable resin composition is useful as a protective material for etching, especially as a back-coating material in shadow mask production.

公开(公告)号：EP1266922A4

公开(公告)日：2004-04-21

申请号：EP00902949

申请日：2000-02-14

申请人： TAIYO INK MFG CO LTD

发明人： IWAIDA SATORU ,  OHNO YOSHIHIRO ,  ISONO MASAYUKI ,  SEKIMOTO AKIO

IPC分类号： C08F2/46 ,  C08G59/14 ,  C08G59/42 ,  C09D4/00 ,  C09D5/00 ,  C09D11/00 ,  C09D133/02 ,  C09D157/10 ,  C09D163/00 ,  G03F7/027 ,  G03F7/032 ,  G03F7/038 ,  H05K3/28

CPC分类号： G03F7/0388 ,  C08G59/4246 ,  C08G59/4292 ,  C09D163/00 ,  G03F7/032 ,  G03F7/038 ,  H05K3/287 ,  Y10T428/24917 ,  C08L2666/02

摘要： A photocurable/thermosetting composition which is useful for forming a matte film and is developable with an aqueous alkali solution. The composition comprises (A) a photosensitive prepolymer obtained by reacting an (un)saturated polybasic acid anhydride with hydroxyl groups of an ester of a novolak epoxy compound with an unsaturated monocarboxylic acid, (B) a carboxylated copolymer resin, (C) a photopolymerization initiator, (D) a diluent, and (E) a polyfunctional epoxy compound having at least two epoxy groups per molecule and optionally contains (F) an inorganic filler. The composition can further contain (G) a hardener for epoxy resins. This composition is suitable for use in forming a solder resist for printed circuit boards.

摘要翻译： 用于形成消光膜并可用碱​​水溶液显影的光固化/热固性组合物。 该组合物包含（A）通过（不）饱和多元酸酐与酚醛清漆环氧化合物的酯与不饱和一元羧酸的羟基反应而得到的光敏预聚物，（B）羧化共聚物树脂，（C）光聚合 （D）稀释剂和（E）每分子具有至少两个环氧基团的多官能环氧化合物，并且任选地含有（F）无机填料。 该组合物可以进一步含有（G）用于环氧树脂的硬化剂。 该组合物适用于形成用于印刷电路板的阻焊剂。

公开(公告)号：EP3742871A1

公开(公告)日：2020-11-25

申请号：EP19741873.4

申请日：2019-01-15

申请人： Taiyo Ink Mfg. Co., Ltd.

发明人： SHIINA Touko ,  SATO Kazuya ,  ARAI Yasuaki ,  SHIMAMIYA Mariko

IPC分类号： H05K3/28 ,  B32B15/08 ,  B32B27/00 ,  C08J5/12 ,  C09D201/00 ,  G03F7/004 ,  H05K1/02

摘要： Provided is a curable resin composition in which cracks and peeling do not easily occur in a cured coating film while maintaining adhesiveness with a base material (insulating portion) or a circuit (conductive portion), even in the case of forming a cured coating film having an area where the coating film of the curable resin composition is overlapping on the circuit board. The curable resin composition according to the present invention is a curable resin composition comprising a curable resin, characterized in that, when a cured coating film α comprising a cured product of the curable resin composition is formed on the surface of the base material, the shear strength between the insulating portion and the cured coating film α is referred to as A (MPa); when a cured coating film α comprising a cured product of the curable resin composition is formed on the surface of the conductive portion of the base material, the shear strength between the conductive portion and the cured coating film α is referred to as B (MPa); and when a cured coating film α comprising a cured product of the curable resin composition is formed on the surface of a cured coating film β comprising the cured product of the curable resin composition, the shear strength between the cured coating film α and the cured coating film β is referred to as C (MPa); then A, B and C are all 1 MPa or more and 15 MPa or less; and A and B are 0.5 times or more and 5 times or less than C.

公开(公告)号：EP3067371B1

公开(公告)日：2020-02-12

申请号：EP14860632.0

申请日：2014-09-30

申请人： Taiyo Ink Mfg. Co., Ltd.

发明人： SHIMURA Masayuki ,  FURUTA Yoshiyuki ,  YUMOTO Masao

IPC分类号： C08F2/44 ,  B41M5/00 ,  C08F2/48 ,  C09D4/02 ,  C09D11/00 ,  H05K3/28

公开(公告)号：EP3419051A1

公开(公告)日：2018-12-26

申请号：EP17753076.3

申请日：2017-02-09

申请人： Taiyo Ink Mfg. Co., Ltd.

发明人： FUNAKOSHI, Chihiro ,  SATO, Kazuya ,  ITO, Nobuhito

IPC分类号： H01L23/12 ,  C08L101/00 ,  H01L23/00

CPC分类号： C08L101/00 ,  H01L23/00 ,  H01L23/12 ,  H01L2224/12105 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/3511 ,  H01L2924/37001

摘要： Provided are a curable resin composition that can reduce the amount of warpage both at a temperature for mounting a semiconductor wafer or a semiconductor package, in particular, a fan-out wafer level package (FO-WLP) and at room temperature for, for example, conveying wafers, and a fan-out wafer level package that includes a warpage correction layer made of a cured product of the curable resin composition. The curable resin composition is curable through at least two types of curing reactions, and includes a curable component (A1) that contracts in volume through one curing reaction, and a curable component (B1) that contracts in volume through another curing reaction.

公开(公告)号：EP3067371A4

公开(公告)日：2017-07-19

申请号：EP14860632

申请日：2014-09-30

申请人： TAIYO INK MFG CO LTD

发明人： SHIMURA MASAYUKI ,  FURUTA YOSHIYUKI ,  YUMOTO MASAO

IPC分类号： C08F2/44 ,  B41M5/00 ,  C08F2/48 ,  C09D4/02 ,  C09D7/12 ,  C09D11/00 ,  H05K3/28

CPC分类号： C09D4/00 ,  C08F2/48 ,  C09D5/00 ,  C09D7/1216 ,  C09D7/40 ,  C09D7/61 ,  C09D11/101 ,  C09D11/322 ,  C09D11/38 ,  C09D133/066 ,  H05K1/0373 ,  H05K3/287 ,  H05K3/3452 ,  H05K2201/0209 ,  H05K2203/0759 ,  C08F220/20 ,  C08F2222/1013 ,  C08F2222/1026

摘要： Provided is a curable composition for a printed wiring board, which composition exhibits high physical strength as a coating film in terms of solder heat resistance, pencil hardness and the like and in which the components contained therein are not likely to precipitate in long-term storage even when the composition is configured to have a low viscosity and thereby made applicable to ink-jet printing, spin-coating and the like. The curable composition for a printed wiring board is characterized by comprising (A) a filler having a specific gravity of 3 or less, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator. The (A) filler having a specific gravity of 3 or less is preferably an inorganic filler.

摘要翻译： 本发明提供一种印刷线路板用固化性组合物，该固化性组合物在焊锡耐热性，铅笔硬度等方面显示出作为涂膜的高物理强度，并且在长期保管中不易析出 即使当组合物被配置为具有低粘度并由此适用于喷墨印刷，旋涂等时也是如此。 （A）比重为3以下的填充材料，（B）含羟基的（甲基）丙烯酸酯化合物和（C）光聚合引发剂的特征在于印刷电路板用固化性组合物。 比重为3以下的（A）填料优选为无机填料。

公开(公告)号：EP3054752A4

公开(公告)日：2017-03-22

申请号：EP14849338

申请日：2014-09-30

申请人： TAIYO INK MFG CO LTD

发明人： SHIMURA MASAYUKI ,  FURUTA YOSHIYUKI ,  YUMOTO MASAO

IPC分类号： H05K3/28 ,  B41M5/00 ,  C08F2/48 ,  C08F220/10 ,  C09D4/02 ,  C09D4/06 ,  C09D11/10 ,  C09D11/101 ,  C09D11/30 ,  C09D133/06

CPC分类号： C08F287/00 ,  C08F2/48 ,  C08F220/10 ,  C09D4/06 ,  C09D11/10 ,  C09D11/101 ,  C09D11/30 ,  C09D133/06 ,  H05K3/287 ,  H05K3/381 ,  H05K2203/013

摘要： Provided are: a curable composition that has excellent flexibility and shows excellent adhesion to both a plastic substrate and a conductor layer; a coating film of the curable composition; and a printed circuit board comprising a pattern-cured coating film obtained from the coating film. The present invention relates to: a curable composition for a printed circuit board, which is characterized by comprising (A) a block copolymer, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator; a coating film obtained by photo-curing the curable composition; and a printed circuit board comprising a resist pattern formed from the coating film.

摘要翻译： 本发明提供：可固化组合物确实具有优异的柔韧性和显示优异的粘附性对塑料基材a和一个导体层; 一涂膜的固化性组合物; 和印刷电路板，其包括一个图案固化涂料从涂布电影胶片获得的。 本发明涉及：用于印刷电路板的可固化组合物，所有这些是由包含（a）嵌段共聚物，（B）含羟基的（甲基）丙烯酸酯化合物和（C）光聚合引发剂为特征的; 的涂膜得到的由光固化可固化组合物; 和印刷电路板，其包括从涂层电影形成的抗蚀剂图案。

公开(公告)号：EP2116902A1

公开(公告)日：2009-11-11

申请号：EP08710841.1

申请日：2008-02-06

申请人： Taiyo Ink MFG. CO., LTD.

发明人： KAKUTANI, Takenori ,  MIYABE, Hidekazu

IPC分类号： G03F7/32 ,  G03F7/004 ,  G03F7/027 ,  G03F7/40

CPC分类号： G03F7/027 ,  G03F7/322 ,  G03F7/40 ,  H05K3/0023 ,  H05K3/287 ,  H05K2203/124

摘要： A composition for forming a cured film pattern comprises a combination of: an alkaline developable photocurable and thermosetting composition containing no thermal curing catalyst; and a developing solution comprising an aqueous solution of a basic curing catalyst of a nitrogen-containing heterocyclic compound for promoting a thermosetting reaction so that it has a long pot-life (useful life) after mixing of a main agent and a hardener or has excellent storage stability as a one-package composition. Preferably, the basic curing catalyst is a heterocyclic compound having an amidine structure. A film of the photocurable and thermosetting composition is selectively exposed to an actinic energy ray and then developed with the developing solution to remove an unexposed area of the film. At this time, the basic curing catalyst penetrates into the photocured film to effect doping. As a result, the film becomes excellent in thermosetting properties besides the patterning properties by development.

摘要翻译： 一种用于形成固化膜图案组合物包含以下的组合：一个碱显影的光固化和不含热固化催化剂的热固性组合物; 以及用于宣传婷含氮杂环化合物的热固性反应，从而做到了具有主剂的混合后一个长的适用期（使用寿命）和硬化剂或具有优异的碱性固化催化剂的wässrige溶液的显影溶液，其包含 储存稳定性作为单组分组合物。 优选地，所述碱性固化催化剂为具有脒在结构的杂环化合物。 电影的光固化和热固性组合物的暴露，以选择性地对光化能量射线，然后用显影溶液显影在胶片的未曝光区域除去。 此时，碱性固化催化剂渗透到光固化膜，以实现掺杂。 其结果是，该薄膜变得优异在除了通过显影图案化特性热固性性质。

公开(公告)号：EP1857478A1

公开(公告)日：2007-11-21

申请号：EP06711602.0

申请日：2006-01-12

申请人： TAIYO INK MFG. CO., LTD.

发明人： USHIKI, Shigeru c/o TAIYO INK MFG. CO., LTD. ,  KUSAMA, Masatoshi c/o TAIYO INK MFG. CO., LTD. ,  MAKITA, Shohei c/o TAIYO INK MFG. CO. , LTD.

IPC分类号： C08F236/20 ,  C08F222/40 ,  B41J2/01 ,  C09D11/00 ,  H05K3/28 ,  B41M5/00

CPC分类号： H05K3/285 ,  C08F226/02 ,  C08F236/20 ,  C09D11/101 ,  C09D11/30 ,  H05K3/28 ,  H05K2203/013

摘要： A curable resin composition for an ink jet printer containing:
(A) a bis-allyl-nadi-imide compound defined by the following general formula (1) :

wherein R 1 represents an alkyl group having 2 to 18 carbon atoms, an aryl group, or an aralkyl group;
(B) a bismaleimide compound defined by the following general formula (2):

wherein R 2 represents an alkyl group having 2 to 32 carbon atoms, an aryl group, or an aralkyl group, and
(C) a diluent, and having a viscosity of 150 mPa·s or lower at 25°C.

摘要翻译： 用于喷墨打印机含有固化性树脂组合物：（A）由下述通式（1）所定义的二烯丙基纳迪酰亚胺化合物：worin，R 1个darstellt具有2至18个碳原子，以芳基烷基的 或在芳烷基; （B）由下述通式（2）所定义的双马来酰亚胺化合物：worin R 2 darstellt具有2至32个碳原子，以芳基烷基，或芳烷基，和（C）稀释剂，和具有粘度 的在25℃下150毫帕·秒或更低