公开(公告)号：EP1417151A1

公开(公告)日：2004-05-12

申请号：EP02712117.7

申请日：2002-02-18

Applicant: NCSR "DEMOKRITOS"

Inventor： TSAMIS, Christos,NCSR "Demokritos" ,  TSEREPI, Angeliki,NCSR "Demokritos" ,  NASSIOPOULOU, Androula, G.,NCSR "Demokritos"

IPC: B81B3/00 ,  G01F1/684 ,  H05B1/00

CPC classification number: H05B3/265 ,  B81B2201/0278 ,  B81B2203/0109 ,  B81B2203/0118 ,  B81C1/00682 ,  B81C1/0069 ,  B81C2201/0115 ,  G01F1/6845 ,  G01N27/12 ,  G01N27/16 ,  G01N27/18

Abstract: This invention provides a front-side silicon micromachining process for the fabrication of suspended Porous Silicon membranes in the form of bridges or cantilevers and of thermal sensor devices employing these membranes. The fabrication of the suspended Porous Silicon membranes comprises the following steps: (a) formation of a Porous Silicon layer (2) in, at least one, predefined area of a Silicon substrate (1), (b) definition of etch windows (5) around or inside said Porous Silicon layer (2) using standard photolithography and (c) selective etching of the Silicon substrate (1), underneath the Porous Silicon layer (2), by using dry etching techniques to provide release of the Porous Silicon membrane and to form a cavity (6) under the said Porous Silicon layer. Furthermore, the present invention provides a method for the fabrication of thermal sensors based on Porous Silicon membranes with minimal thermal losses, since the proposed methodology combines the advantages that result from the low thermal conductivity of Porous Silicon and the use of suspended membranes. Moreover, the front-side micromachining process proposed in the present invention simplifies the fabrication process. Various types of thermal sensor devices, such as calorimetric-type gas sensors, conductometric-type gas sensors and thermal conductivity sensors are described utilizing the proposed methodology.

公开(公告)号：EP1227307A1

公开(公告)日：2002-07-31

申请号：EP01961319.9

申请日：2001-09-03

Applicant: Nikon Corporation

Inventor： ISHIZUYA, Tohru ,  SUZUKI, Junji

IPC: G01J1/02 ,  G01J5/40 ,  H01L27/148

CPC classification number: B81B3/0081 ,  B81B2201/0278 ,  B81B2201/042 ,  B81B2203/0109 ,  G01J5/40 ,  H01L27/14812 ,  H01L27/14818 ,  H01L27/14875

Abstract: A thermal displacement element comprises a substrate, and a supported member supported on the substrate. The supported member includes first and second displacement portions, a heat separating portion exhibiting a high thermal resistance and a radiation absorbing portion receiving the radiation and converting it into heat. Each of the first and second displacement portions has at least two layers of different materials having different expansion coefficients and stacked on each other. The first displacement portion is mechanically continuous to the substrate without through the heat separating portion. The radiation absorbing portion and the second displacement portion are mechanically continuous to the substrate through the heat separating portion and the first displacement portion. The second displacement portion is thermally connected to the radiation absorbing portion. A radiation detecting device comprises a thermal displacement element and a displacement reading member fixed to the second displacement portion of the thermal displacement element and used for obtaining a predetermined change corresponding to a displacement in the second displacement portion.

Abstract translation: 热位移元件包括衬底和支撑在衬底上的支撑构件。 被支撑构件包括第一和第二位移部分，表现出高热阻的热分离部分和接收辐射并将其转换成热量的辐射吸收部分。 第一和第二位移部分中的每一个具有至少两层具有不同膨胀系数并且彼此堆叠的不同材料。 第一位移部分在不通过热分离部分的情况下机械地连接到基板。 辐射吸收部分和第二位移部分通过热分离部分和第一位移部分机械地连接到基底。 第二位移部分热连接到辐射吸收部分。 放射线检测装置包括热位移元件和固定到热位移元件的第二位移部分的位移读取构件，用于获得对应于第二位移部分中的位移的预定变化。

公开(公告)号：EP3140245A1

公开(公告)日：2017-03-15

申请号：EP15719195.8

申请日：2015-04-23

Applicant: Epcos AG

Inventor： PAHL, Wolfgang

IPC: B81B7/02

CPC classification number: B81B7/02 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2201/0292 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/092 ,  B81B2207/096 ,  B81B2207/097 ,  H01L24/20 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/15192 ,  H01L2924/00

Abstract: A sensor component having a first sensor element and a second sensor element (SE1, SE2) for one sensor function each is proposed, in which a base element (BE), a wall element (WE) in the form of a frame and a cover (DE) together enclose a cavity (CV) of a housing. The first sensor element (SE1) is a MEMS sensor and is mounted inside the cavity on the base element of the housing. The second sensor element (SE2) is in the form of an ASIC with an active sensor surface (SA) and is mounted on or under the cover or is embedded in the cover. Electrical external contacts (AK) for the first and second sensor elements are provided on an external surface of the housing. The cavity has at least one opening (OE) or bushing (DF).

Abstract translation: 具有MEMS传感器和用于一个传感器的ASIC的传感器部件各自起作用。 基部元件，框架形式的壁元件和盖子一起封闭壳体的空腔。 MEMS传感器安装在壳体的基座元件的腔内。 ASIC具有有源传感器表面并且被安装在盖上或下方或嵌入盖中。 用于MEMS传感器和ASIC的电气外部触点设置在外壳的外表面上。 空腔具有至少一个开口或衬套。

公开(公告)号：EP3010316A1

公开(公告)日：2016-04-20

申请号：EP15153847.7

申请日：2015-02-04

Applicant: Nokia Technologies OY

Inventor： Robinson, Adam ,  Cotton, Darryl Paul James ,  Andrew, Piers ,  Ryhanen, Tapani

IPC: H05K1/02

CPC classification number: B81B7/0054 ,  B81B2201/0278 ,  B81B2201/0292 ,  H05K1/0283 ,  H05K1/167 ,  H05K2201/09018 ,  H05K2201/09109 ,  H05K2201/09263 ,  H05K2201/10151

Abstract: An apparatus and method wherein the method comprises: a deformable substrate; a curved support structure configured to support at least a portion of a resistive sensor wherein the resistive sensor comprises a first electrode, a second electrode and a resistive sensor material provided between the electrodes; at least one support configured to space the curved support structure from the deformable substrate so that when the deformable substrate is deformed the curved support structure is not deformed in the same way; wherein the resistive sensor is positioned on the curved support structure so as to limit deformation of the resistive sensor when the deformable substrate is deformed.

Abstract translation: 一种设备和方法，其中该方法包括：可变形基板; 弯曲支撑结构，其被配置为支撑电阻传感器的至少一部分，其中所述电阻传感器包括第一电极，第二电极和设置在所述电极之间的电阻传感器材料; 至少一个支撑件，所述至少一个支撑件被构造成将所述弯曲支撑结构与所述可变形基板隔开，使得当所述可变形基板变形时，所述弯曲支撑结构不以相同方式变形; 其中所述电阻传感器定位在所述弯曲支撑结构上，以便当所述可变形衬底变形时限制所述电阻传感器的变形。

公开(公告)号：EP1986950A4

公开(公告)日：2014-06-04

申请号：EP07709443

申请日：2007-01-31

Applicant: NIKLAUS FRANK ,  STEMME GÖRAN

Inventor： NIKLAUS FRANK ,  STEMME GÖRAN

IPC: B81C1/00 ,  H01L21/98

CPC classification number: B81C1/00714 ,  B81B2201/0278 ,  B81B2201/042

公开(公告)号：EP2001062A4

公开(公告)日：2012-03-28

申请号：EP07740161

申请日：2007-03-28

Applicant: KOBE STEEL LTD

Inventor： HIRANO TAKAYUKI ,  KAWAKAMI NOBUYUKI ,  KANNAKA MASATO

IPC: B81C1/00 ,  C23C16/42 ,  G01F1/692 ,  G01J1/02 ,  H01L35/34 ,  H01L37/00

CPC classification number: G01F1/692 ,  B81B2201/0278 ,  B81B2203/0127 ,  B81C1/00666 ,  B81C2201/0169 ,  B81C2201/0178 ,  C23C16/402 ,  C23C16/56 ,  Y10T428/24488 ,  Y10T428/24612

公开(公告)号：EP2172755A1

公开(公告)日：2010-04-07

申请号：EP08017466.7

申请日：2008-10-06

Applicant: Sensirion AG

Inventor： Streiff, Matthias ,  Sunier, Robert ,  Mayer, Felix

IPC: G01J5/02 ,  G01J5/04 ,  G01J5/12 ,  B81B7/00

CPC classification number: G01J5/02 ,  B81B7/0067 ,  B81B2201/0207 ,  B81B2201/0278 ,  G01J5/04 ,  G01J5/045 ,  G01J5/12

Abstract: An infrared sensor comprises a vacuum cavity (28) with a temperature sensor (4) located therein. An infrared filter plate (19) is located at a distance from and above the temperature sensor (4) by means of a spacer (20). The filter plate forms the top wall of the vacuum cavity (28). An additional seal layer (29) can be provided for sealing spacer (20) if spacer (20) not gas-tight. This design dispenses with a separate cap between the vacuum cavity (28) and the filter plate (19), which allows to manufacture the device more easily.

Abstract translation: 红外传感器包括具有位于其中的温度传感器（4）的真空腔（28）。 红外滤光片（19）通过间隔物（20）位于距离温度传感器（4）一定距离处。 过滤板形成真空腔（28）的顶壁。 如果间隔件（20）不是气密的，则可以设置附加的密封层（29）用于密封间隔件（20）。 该设计在真空腔（28）和过滤板（19）之间分配了一个单独的盖，这允许更容易地制造该装置。

公开(公告)号：EP2035326A1

公开(公告)日：2009-03-18

申请号：EP07728389.3

申请日：2007-04-23

Applicant: Robert Bosch GmbH

Inventor： BENZEL, Hubert ,  ARMBRUSTER, Simon ,  SCHELLING, Christoph ,  HOECHST, Arnim ,  FEYH, Ando

IPC: B81B3/00 ,  G01J5/10 ,  G01K7/01

CPC classification number: B81B3/0081 ,  B81B2201/0278 ,  B81B2203/0109 ,  B81B2207/015 ,  B81C2201/0109 ,  G01J5/06 ,  G01J5/20

Abstract: The invention relates to a sensor, especially for location-independent detection. Said sensor comprises a substrate (1), at least one microstructured sensor element (52) having an electrical property that varies with temperature, and at least one membrane (36.1) above a cavern (26, 74, 94), the sensor element (52) being arranged on the lower face of the at least one membrane (36.1), and the sensor element (52) being connected via leads (60, 62; 98-1, 98-2, 100-1, 100-2) which extend in, on or below the membrane (36.1). According to the invention, especially a plurality of sensor elements (52) can be configured as diode pixels in a monocrystalline layer that is formed by epitaxial growth. In the membrane (36.1), suspension springs (70) can be configured that receive the individual sensor elements (52) in an elastic and insulating manner.

公开(公告)号：EP1834162B1

公开(公告)日：2009-03-11

申请号：EP06705760.4

申请日：2006-01-04

Applicant: Universität Kassel

Inventor： RANGELOW, Ivo ,  IVANOV, Tzvetan ,  IVANOVA, Katerina

IPC: G01J5/40

CPC classification number: G01J5/40 ,  B81B3/0018 ,  B81B2201/0278 ,  G01J5/44

Abstract: A microsystem component with a device (3) deformable under the influence of temperature changes is disclosed. The device comprises at least one first (4, 5) and second (8) element with differing thermal expansion coefficients and different thermal conductivities. The elements (4, 5; 8) are physically separate and arranged and connected to each other such that the device (3) assumes flexure states which are dependent on the temperature.

公开(公告)号：EP1986950A1

公开(公告)日：2008-11-05

申请号：EP07709443.1

申请日：2007-01-31

Applicant: Niklaus, Frank ,  Stemme, Göran

Inventor： Niklaus, Frank ,  Stemme, Göran

IPC: B81B1/00 ,  B81C3/00 ,  H01L21/98

CPC classification number: B81C1/00714 ,  B81B2201/0278 ,  B81B2201/042

Abstract: The invention relates to a method for making a MEMS device having connectors for interconnecting components in the MEMS device. The method comprises applying a sacrificial material layer on a first substrate wafer, the thickness of the sacrificial layer essentially defining the length of the connectors. Connectors made of electrically conducting and/ or mechanically rigid material are provided and embedded in the sacrificial material layer. Components are provided on top of the sacrificial layer by 3D integration with wafer bonding, to connect the components to the connectors. It also relates to a MEMS device made by 3D integration with wafer bonding comprising first and a second components interconnected by connectors having a length of > 4μm. The components can comprise integrated circuits.