公开(公告)号：EP0955668B1

公开(公告)日：2005-10-05

申请号：EP99109110.9

申请日：1999-05-07

Applicant: Rockwell Science Center, LLC

Inventor： Yao, Jun J. ,  Anderson, Robert J.

IPC: H01L21/00 ,  B81B3/00 ,  B81C1/00

CPC classification number: B81C1/00484 ,  B81B2203/0118 ,  B81C2201/0108 ,  B81C2201/014 ,  B81C2201/019

公开(公告)号：EP1454349A2

公开(公告)日：2004-09-08

申请号：EP02793902.4

申请日：2002-11-08

Applicant: Coventor, Incorporated ,  Turnstone Systems Inc.

Inventor： CUNNINGHAM, Shawn, J. ,  TATIC-LUCIC, Sveltana

IPC: H01L21/302 ,  H01L21/4763 ,  H01P1/10 ,  H01H57/00 ,  H02B1/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A method for fabricating a trilayered beam MEMS device includes depositing a sacrificial layer (310) on a substrate and depositing and removing a portion of a first conductive layer on the sacrificial layer (310) to form a first conductive microstructure (312); depositing a structural layer (322) on the first conductive microstructure (312); the sacrificial layer (310), and the substrate (300) and forming a via through the structural layer (322) to the first conductive microstructure (312); depositing a second conductive layer (336) on the structural layer (322) and in the via; forming a second conductive microstructure (324) by removing a portion of the second conductive layer (336), wherein the second conductive microstructure (324) electrically communicates with the first conductive microstructure (312) through the via; and removing a sufficient amount of the sacrificial layer (310) so as to separate the first conductive microstructure (312) from the substrate, wherein the structural layer (322) is supported by the substrate at a first end is freely suspended above the substrate at an opposing second end.

公开(公告)号：EP1454333A1

公开(公告)日：2004-09-08

申请号：EP02797085.4

申请日：2002-11-08

Applicant: Conventor, Incorporated ,  Turnstone Systems Inc.

Inventor： CUNNINGHAM, Shawn, J. ,  DEREUS, Dana, R. ,  Sett, Subham ,  TATIC-LUCIC, Svetlana

IPC: H01H57/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A movable, trilayered microcomponent (108) suspended over a substrate (102) is provided and includes a first electrically conductive layer (116) patterned to define a movable electrode (114). The first metal layer (116) is separated from the substrate (102) by a gap. The microcomponent (108) further includes a dielectric layer formed (112) on the first metal layer (116) and having an end fixed with respect to the substrate (102). Furthermore, the microcomponent (102) includes a second electrically conductive layer (120) formed on the dielectric layer (112) and patterned to define an electrode interconnect (124) for electrically communicating with the movable electrode (114).

公开(公告)号：EP2788280B1

公开(公告)日：2018-06-20

申请号：EP12810454.4

申请日：2012-12-06

Applicant: Georgia Tech Research Corporation

Inventor： KOHL, Paul, A. ,  SAHA, Rajarshi ,  FRITZ, Nathan

IPC: B81C1/00

CPC classification number: B81C1/00261 ,  B81B3/0018 ,  B81C1/00333 ,  B81C2201/0108 ,  B81C2203/0154

Abstract: This invention discloses and claims a cost-effective, wafer-level package process for microelectromechanical devices (MEMS). Specifically, the movable part of MEMS device is encapsulated and protected while in wafer form so that commodity, lead-frame packaging can be used. An overcoat polymer, such as, epoxycyclohexyl polyhedral oligomeric silsesquioxanes (EPOSS) has been used as a mask material to pattern the sacrificial polymer as well as overcoat the air-cavity. The resulting air-cavities are clean, debris-free, and robust. The cavities have substantial strength to withstand molding pressures during lead-frame packaging of the MEMS devices. A wide range of cavities from 20 μm×400 μm to 300 μm×400 μm have been fabricated and shown to be mechanically stable. These could potentially house MEMS devices over a wide range of sizes. The strength of the cavities has been investigated using nano-indentation and modeled using analytical and finite element techniques. Capacitive resonators packaged using this protocol have shown clean sensing electrodes and good functionality.

公开(公告)号：EP3013736A1

公开(公告)日：2016-05-04

申请号：EP14747174.2

申请日：2014-06-27

Applicant: MiniPumps, LLC

Inventor： PANG, Changlin ,  SHIH, Jason ,  JIANG, Fukang ,  LIU, Changgeng ,  CAFFEY, Sean ,  URAZAKI, Andrew

IPC: B81C1/00 ,  F04B43/00 ,  F04B45/04 ,  F15C5/00 ,  A61M5/142 ,  F16K99/00

CPC classification number: A61M5/14586 ,  A61M5/14276 ,  A61M2005/14204 ,  B29C59/14 ,  B29C2791/004 ,  B29K2023/00 ,  B81B2203/0127 ,  B81C99/008 ,  B81C2201/0108 ,  F04B43/0054 ,  F04B45/04 ,  F16K2099/008

Abstract: A removable material is deposited or otherwise applied to a flat substrate surface in a pattern corresponding to desired corrugations in a membrane, e.g., a deflection diaphragm. The applied material serves as a scaffold for a polymeric material, which is applied thereover, and following cure or hardening, the polymeric material is removed to form a finished corrugated membrane.

Abstract translation: 将可移除材料沉积或以其它方式施加到平坦的基材表面上，其形式对应于膜（例如偏转膜片）中所需的波纹。 施加的材料用作聚合物材料的支架，其在其上施加，并且在固化或硬化之后，去除聚合物材料以形成成品波纹膜。

公开(公告)号：EP2395395B1

公开(公告)日：2013-10-16

申请号：EP11169115.0

申请日：2011-06-08

Applicant: Shin-Etsu Chemical Co., Ltd.

Inventor： Kato, Hideto ,  Kanbara, Hiroshi ,  Furihata, Tomoyoshi ,  Hirano, Yoshinori

IPC: B81C1/00 ,  G03F7/023

CPC classification number: C09D163/04 ,  B81C1/00619 ,  B81C2201/0108 ,  G03F7/0226 ,  G03F7/0236 ,  G03F7/30 ,  G03F7/40 ,  G03F7/70466

公开(公告)号：EP2216289A4

公开(公告)日：2012-12-19

申请号：EP07823028

申请日：2007-11-02

Applicant: IKERLAN CT DE INVESTIGACIONES TECNOLOGICAS S COOP

Inventor： FERNANDEZ LEDESMA LUIS JOSE ,  TIJERO SERNA MARIA

IPC: B81C3/00 ,  F16K99/00

CPC classification number: B81C3/001 ,  B01L3/50273 ,  B01L3/502738 ,  B01L3/502746 ,  B81B2201/054 ,  B81C2201/0108 ,  B81C2203/037 ,  F16K99/0001 ,  F16K99/0015 ,  F16K2099/0074 ,  F16K2099/0094

公开(公告)号：EP2401224B1

公开(公告)日：2012-08-22

申请号：EP10710083.6

申请日：2010-02-24

Applicant: Universite Des Sciences Et Technologies De Lille

Inventor： ABBAS, Abdennour ,  GUILLOCHON, Didier ,  BOCQUET, Bertrand ,  SUPIOT, Philippe

IPC: B81C1/00

CPC classification number: B81C1/00071 ,  B81B2201/0214 ,  B81B2201/058 ,  B81B2203/0338 ,  B81C2201/0108 ,  B81C2201/018

Abstract: The invention relates to a method for making microchannels on a substrate, and to a substrate including such microchannels, which can particularly be used in the production of microstructured substrates for microelectronic, microfluidic and/or micromechanical systems. The method includes a step of (a) making at least one or at least two patterns (2) on the surface of a lower layer (1), and a step (b) of depositing, onto the lower layer and the pattern(s), a layer (3) of a polymer material produced by polymerisation in an optionally remote plasma-enhanced chemical vapour deposition reactor (PECVD, optionally RPECVD) of an organic or organometallic monomer with siloxane functions, e.g. tetramethyldisiloxane. The layer of polymer material is deposited so as to create, in the place of the pattern and after the decomposition of said pattern, or between two patterns without development-decomposition, a channel (4a, 4b, 4c, 4d), which is closed on at least a portion of the length thereof.

Abstract translation: 本发明涉及一种用于在基底上制造微通道的方法，并且涉及一种包括这种微通道的基底，其特别可以用于微电子，微流体和/或微机械系统的微结构基底的生产。 该方法包括以下步骤：（a）在下层（1）的表面上制作至少一个或至少两个图案（2）;以及步骤（b），在下层和图案上 ），通过在具有硅氧烷官能团的有机或有机金属单体的任选远程等离子体增强化学气相沉积反应器（PECVD，任选RPECVD）中聚合产生的聚合物材料层（3），例如 四甲基二硅氧烷。 沉积聚合物材料层以便在图案的位置中和在所述图案分解之后或在没有显影分解的两个图案之间产生通道（4a，4b，4c，4d），所述通道（4a，4b，4c，4d） 在其至少一部分长度上。

公开(公告)号：EP2395395A3

公开(公告)日：2012-08-01

申请号：EP11169115.0

申请日：2011-06-08

Applicant: Shin-Etsu Chemical Co., Ltd.

Inventor： Kato, Hideto ,  Kanbara, Hiroshi ,  Furihata, Tomoyoshi ,  Hirano, Yoshinori

IPC: G03F7/023

CPC classification number: C09D163/04 ,  B81C1/00619 ,  B81C2201/0108 ,  G03F7/0226 ,  G03F7/0236 ,  G03F7/30 ,  G03F7/40 ,  G03F7/70466

Abstract: A micro-structure is manufactured by patterning a sacrificial film, forming an inorganic material film on the pattern, providing the inorganic material film with an aperture, and etching away the sacrificial film pattern through the aperture to define a space having the contour of the pattern. The patterning stage includes the steps of (A) forming a sacrificial film using a composition comprising a cresol novolac resin and a crosslinker, (B) exposing patternwise the film to first high-energy radiation, (C) developing, and (D) exposing the sacrificial film pattern to second high-energy radiation and heat treating for thereby forming crosslinks within the cresol novolac resin.

公开(公告)号：EP2228401A1

公开(公告)日：2010-09-15

申请号：EP10163437.6

申请日：2003-10-31

Applicant: Georgia Tech Research Corporation

Inventor： Kohl, Paul A. ,  Allen, SueAnn Bidstrup ,  Henderson, Clifford Lee ,  Jayachandran, Joseph Paul ,  Reed, Hollie ,  White, Celesta, E.

IPC: C08J3/28 ,  G03C1/76 ,  G03C1/795 ,  G03C5/00 ,  G03C5/56

CPC classification number: B81C1/00476 ,  B81C2201/0108 ,  H01L21/7682 ,  Y10S430/114

Abstract: Polymers, methods of use thereof, and methods for fabricating a structure having air-gaps, are provided. One exemplary polymers, among others, includes, a composition having a sacrificial polymer and a photoacid generator.

Abstract translation: 聚合物，使用它们的方法，以及用于制造具有空气隙的结构的方法中，提供了。 一个示例性的聚合物，尤其包括，具有牺牲聚合物和光产酸剂的组合物。