公开(公告)号：EP2683035A3

公开(公告)日：2015-04-08

申请号：EP13174631.5

申请日：2013-07-02

申请人： MAHLE International GmbH

发明人： Nestmann, Bernhard ,  Weber, Stephan

IPC分类号： H01R12/52 ,  H01R12/57 ,  H01R12/91 ,  H01R43/02 ,  G01D5/14 ,  H05K3/36 ,  G01D11/24

CPC分类号： H01R12/52 ,  G01D5/145 ,  G01D11/245 ,  H01R12/57 ,  H01R12/91 ,  H01R43/0256 ,  H01R43/0263 ,  H05K3/368 ,  H05K2201/10265

摘要： Die vorliegende Erfindung betrifft eine Stellvorrichtung (1) zum bidirektionalen Verstellen eines Stellglieds (2) mit einem Gehäuse (4) aus Kunststoff und mit einer Positionssensorik (15) zum Erfassen einer Position einer mobilen Komponente (16) der Stellvorrichtung (1) relativ zu einer stationären Komponente (17) der Stellvorrichtung (1), wobei die Positionssensorik (15) eine Platine (18) aufweist, die wenigstens einen Positionssensor (19) trägt und die mit einer zumindest teilweise in den Kunststoff des Gehäuses (4) eingebetteten Metallstruktur (20) elektrisch kontaktiert ist.
Die Dauerhaltbarkeit der elektr. Verbindung in der Stellvorrichtung (1) lässt sich verbessern, wenn die Platine (18) über wenigstens ein Kontaktelement (24) mit der Metallstruktur (20) elektrisch kontaktiert ist, das zwischen einer elektrisch mit der Platine (18) kontaktierten Platinenkontaktzone (25) und einer elektrisch mit der Metallstruktur (20) kontaktierten Metallstrukturkontaktzone (26) eine wellenförmig gebogene Federzone (27) aufweist, die Relativbewegungen zwischen der Platinenkontaktzone (25) und der Metallstrukturkontaktzone (26) federelastisch aufnimmt.

公开(公告)号：EP2630695A4

公开(公告)日：2014-07-23

申请号：EP11852451

申请日：2011-09-27

申请人： SHERMAN NEIL S

发明人： SHERMAN NEIL S

IPC分类号： H01R12/71 ,  H01R12/57 ,  H01R12/70 ,  H01R13/639

CPC分类号： H01R12/714 ,  H01R12/585 ,  H01R12/7023 ,  H01R12/7064 ,  H01R13/639 ,  H05K3/325 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10598 ,  H05K2201/10628

摘要： A connector for mounting to a circuit board for comprising a connector device with a body, a plurality of alignment members, and one or more contact elements, wherein the alignment members extend through a plurality of alignment holes of the printed circuit board from the first surface and past the second surface of the circuit board and wherein the contact elements engage one more contact pads on the first surface of the circuit board, and a separate retention device having a supporting element and a plurality of fixed sockets is positioned along the second surface of the printed circuit board to receive the alignment members of the connector device therein so that the circuit board is positioned between the body of the connector device and the retention device to temporarily or permanently retain the contact elements of the connector device in contact with the contact pads of the circuit board.

公开(公告)号：EP2352207A4

公开(公告)日：2014-04-30

申请号：EP10830050

申请日：2010-11-16

申请人： KITAGAWA IND CO LTD

发明人： KURITA TOMOHISA ,  YUMI HIDEO ,  NAKAMURA TATSUYA ,  KONDA KENJI ,  KITANO HIROKI

IPC分类号： H01R12/51 ,  H01R12/52 ,  H01R12/55

CPC分类号： H01R12/57 ,  H01R13/2442 ,  H01R13/245 ,  H01R43/205 ,  H05K1/0215 ,  H05K9/0016 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/1031 ,  H05K2203/0195 ,  Y02P70/611

摘要： A contact includes a solder bonding portion, an elastic contact portion, and a suction portion. An undersurface of the solder bonding portion is a solder bonding face which is to be solder bonded to the conductor pattern. The elastic contact portion is connected to one end of the solder bonding portion and bent over the solder bonding portion. When in contact with a conductive member, the elastic contact portion is pressed against the conductive member while being elastically deformed. The suction portion is connected to the solder bonding portion independently of the elastic contact portion. The suction portion is made a suction face for a suction nozzle of an automatic mounter, with its top end being arranged in parallel to the undersurface of the solder bonding portion on the conductive member side of the elastic contact portion.

公开(公告)号：EP2208405A1

公开(公告)日：2010-07-21

申请号：EP08845428.5

申请日：2008-11-03

申请人： Cinterion Wireless Modules GmbH

发明人： WENDLER, Ralf ,  ROMAHN, Jörg ,  BÖLCKE, Annette

IPC分类号： H05K1/11 ,  H05K1/14

CPC分类号： H05K3/325 ,  H01R12/52 ,  H05K1/0219 ,  H05K1/0243 ,  H05K3/368 ,  H05K2201/0311 ,  H05K2201/09381 ,  H05K2201/09809 ,  H05K2201/10189 ,  H05K2201/10265

摘要： The invention relates to a configuration, comprising a first circuit board (ELP), which has a contact surface (KF) for contacting a connection element (VE), said contact surface (KF) comprising a central contact point and a concentric ring enclosing said central contact point; a second circuit board (ZLP); and a connection element (VE), which is electrically contacted on a first side with the second circuit board (ZLP) and which comprises a first spring element (FE1) and at least one second spring element (FE2, FE3) on a second side, which is opposite the first side, said first spring element (FE1) being electrically contacted with the central contact point of the first circuit board (ELP) and the at least one second spring element (FE2, FE3) being electrically contacted with the concentric ring of the first circuit board (ELP).

公开(公告)号：EP2143189A2

公开(公告)日：2010-01-13

申请号：EP08805551.2

申请日：2008-05-07

申请人： Sonceboz Automative SA

发明人： STRAHM, Martin ,  GEISER, Michael ,  GANDEL, Pierre ,  LOUSSERT, Guillaume

IPC分类号： H02K5/22 ,  H05K3/30 ,  G12B11/00

CPC分类号： H01R12/58 ,  H01R12/57 ,  H02K5/225 ,  H02K11/33 ,  H02K2211/03 ,  H05K3/325 ,  H05K3/3447 ,  H05K2201/0311 ,  H05K2201/10265 ,  H05K2201/10659

摘要： The present invention relates to a dashboard indicator module comprising, in a casing, a rotary motor, an output shaft, mechanical reduction means associated with the motor, at least one electrical supply coil, electrical connection tabs linked to the coils leaving said casing and electrical contact elements, characterized in that said electrical contact elements can be fitted on the connection tabs in order to produce solderless connectors on the printed circuit or even removed from the connection tabs in order to allow the connection tabs of the motor to be soldered directly to the printed circuit.

公开(公告)号：EP2073614A2

公开(公告)日：2009-06-24

申请号：EP08254002.2

申请日：2008-12-15

申请人： Hosiden Corporation

发明人： Ohmori, Yasuhiro

IPC分类号： H05K3/30

CPC分类号： H05K3/301 ,  F21V19/008 ,  H01H85/202 ,  H01R33/0836 ,  H05K2201/10113 ,  H05K2201/10265 ,  H05K2201/10295 ,  H05K2201/10393

摘要： An object of the present invention is to provide a contact and a connecting device capable of stably connecting and supporting an electronic component such as a cold cathode fluorescent lamp in midair.
A contact 200 for connection with a cold cathode fluorescent lamp 10 includes a base part 210, a supporting part 220 that is provided on top of the base part 210 for supporting a lead terminal 12 of a cold cathode fluorescent lamp 10, and at least two clamp parts 230 that are provided on top of the base part 210 so as to be located on respective outer sides of the supporting part 220. The clamp parts 230 are adapted to sandwich the lead terminal 12 of the lamp 10 between themselves and the supporting part 220. Alternatively, the clamp parts 230 may be adapted to sandwich part of an adapter for the lead terminal.

摘要翻译： 本发明的目的是提供一种能够在空中稳定地连接和支撑诸如冷阴极荧光灯的电子部件的接触和连接装置。 用于与冷阴极荧光灯10连接的触点200包括基部210，设置在用于支撑冷阴极荧光灯10的引线端子12的基部210的顶部上的支撑部220，以及至少两个 夹持部件230设置在基部210的顶部，以便位于支撑部件220的相应的外侧上。夹持部件230适于将灯10的引线端子12夹在它们之间和支撑部件之间 替代地，夹持部件230可以适于夹持用于引线端子的适配器的一部分。

公开(公告)号：EP1959717A1

公开(公告)日：2008-08-20

申请号：EP06833717.9

申请日：2006-11-30

申请人： IBIDEN CO., LTD.

发明人： KARIYA, Takashi ,  FURUTANI, Toshiki ,  KAWANISHI, Takeshi

IPC分类号： H05K1/18

CPC分类号： H05K3/4015 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/72 ,  H01L24/78 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/838 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/326 ,  H05K3/341 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2203/049 ,  Y10T29/49135 ,  Y10T29/49142 ,  Y10T29/49149 ,  Y10T29/49153 ,  H01L2224/13099 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2224/48 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).

摘要翻译： 根据本发明的印刷电路板是印刷电路板（4），包括由金属线制成的元件安装销（1），以与半导体芯片（10）连接。 半导体芯片（10）是表面安装型半导体芯片，其在其安装表面上具有用于倒装芯片安装系统的电极焊盘。 部件安装销（1）通过引线接合技术形成。 该印刷电路板（4）能够减少由半导体芯片（10）和印刷电路板（4）的热膨胀系数之间的差异引起的误连接或断开。

公开(公告)号：EP1869950A2

公开(公告)日：2007-12-26

申请号：EP06738703.5

申请日：2006-03-15

申请人： E-Cath, Inc.

发明人： KENT, Harold, B. ,  KENT, Steven, T.

IPC分类号： H05B3/00

CPC分类号： H05K7/06 ,  A61M25/0021 ,  A61M25/0023 ,  A61M25/0043 ,  A61M25/0045 ,  A61M25/005 ,  A61M2025/0037 ,  A61M2025/004 ,  B01L3/5027 ,  B81B2201/058 ,  B81C3/008 ,  H05K1/0272 ,  H05K1/182 ,  H05K1/183 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/368 ,  H05K3/4046 ,  H05K2201/10265 ,  Y02P70/613 ,  Y10T29/4902 ,  Y10T29/49117 ,  Y10T137/0318 ,  Y10T137/8593

摘要： A method and system for transporting a fluid, gas, semi-solid, cryogen, or particulate matter, or combination thereof, between a three-dimensional structure and a substantially two-dimensional structure is disclosed. A system and method for electrically coupling a three-dimensional structure to a substantially two dimensional structure is also disclosed.

公开(公告)号：EP1749334B1

公开(公告)日：2007-11-14

申请号：EP05755116.0

申请日：2005-05-27

申请人： MOLEX INCORPORATED

发明人： NODA, Atsuhito ,  HOSHIKAWA, Shigeyuki ,  IKEDA, Hiroshi

IPC分类号： H01R4/02 ,  H01R13/24

CPC分类号： H01R4/028 ,  H01L23/49811 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05573 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/81012 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01R12/52 ,  H01R12/57 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2464 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/10265 ,  H05K2201/10719 ,  H05K2201/10946 ,  H01L2224/29099 ,  H01L2224/05599

摘要： Multiple small conductive and flexible hollow rings (10), each of which is made from a pliable material, provide a flexible connection medium for use between a substrate (23, 80, 82) and a microelectronic device package (88). Each ring is formed to have at least one protuberance (20) on the a ring's exterior surface. The protuberance has an apex (22) or point, which when placed against a surface, will scrub or scrape the surface as the ring is compressed by a force acting on the ring radially. By scrubbing a contact surface with the apex, surface contaminants and layered material that might interfere with electrical signals can be removed.

公开(公告)号：EP1604746A1

公开(公告)日：2005-12-14

申请号：EP04716316.7

申请日：2004-03-02

申请人： NAMIKI SEIMITSU HOUSEKI KABUSHIKI KAISHA

发明人： SUZUKI, Toshio, c/o Namiki Seimitsu Houseki K.K. ,  UEDA, Minoru, c/o Namiki Seimitsu Houseki K.K. ,  TAKANO, Tsuyoshi, c/o Namiki Seimitsu Houseki K.K.

IPC分类号： B06B1/04 ,  H02K5/22

CPC分类号： H02K5/225 ,  B06B1/045 ,  H02K5/00 ,  H02K7/061 ,  H02K2211/03 ,  H05K3/325 ,  H05K2201/10083 ,  H05K2201/10265

摘要： In order to improve the reliability of an electrical connection between a power supply terminal of a vibrator and an electrode of a circuit board and to improve the efficiency of mounting the vibrator on the circuit board, the power supply terminal is made from a torsion coil spring and a contact portion of the power supply terminal in contact with the electrode of the circuit board is formed by winding. In addition, a torsion coil spring portion is wound around a spindle pin and a housing is provided with a step portion as a space for accommodating the contact portion without interference and a plane portion to which the contact portion faces. Moreover, a partition plate is provided between a pair of power supply terminals or a space where the contact portion can be elastically deformed is surrounded by a box member, a pair of power supply terminals having positive and negative polarities are extended in a bilaterally symmetric direction from torsion coil spring portions to the contact portions, and the power supply terminals are constructed so as to be elastically deformed to allow each contact portion to reach the outside of each torsion coil spring portion.