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    TRANSFER FILMS FOR BURNING AND METHOD OF FORMING SUBSTRATE WITH FUNCTIONAL PATTERN
    32.
    发明公开
    TRANSFER FILMS FOR BURNING AND METHOD OF FORMING SUBSTRATE WITH FUNCTIONAL PATTERN 审中-公开
    转印膜焚烧和一种用于生产衬底，功能模型

    公开(公告)号：EP2165851A1

    公开(公告)日：2010-03-24

    申请号：EP08765578.3

    申请日：2008-06-13

    Applicant: Toppan TDK Label Co Ltd. ,  Nippon Sheet Glass Co., Ltd.

    Inventor： IIKUMA, Akihiro ,  SHINOZAKI, Hideaki ,  KIKUCHI, Masahiro ,  OTSUKA, Tatsuya ,  KUBO, Taiichi ,  ONO, Kazuhisa

    IPC: B44C1/165 ,  B44C1/17

    CPC classification number: B44C1/1716 ,  B44C1/172 ,  H05K3/207 ,  H05K2203/1126 ,  Y10T428/2486 ,  Y10T428/24926

    Abstract: Transfer films for firing which have the excellent property of transferring a functional pattern and enable a pyrolysis gas generated by the firing of organic substances to be released smoothly, and which can form on a substrate a functional pattern free from defects such as a shape or function failure. One of the transfer films for firing comprises a release film and a multilayered structure formed so as to be in contact with one of the surfaces of the release film. The multilayered structure includes both a pressure-sensitive adhesive layer for bonding the transfer film for firing to a surface of a substrate and a functional pattern formed between the release film and the pressure-sensitive adhesive layer. The functional pattern comprises inorganic particles and a first organic substance removable by firing, and the pressure-sensitive adhesive layer comprises a second organic substance removable by firing and different from the first organic substance. The heat decomposition temperature of the first organic substance (Tdb), the heat decomposition temperature of the second organic substance (Tda), and the fusion bonding temperature of the inorganic particles (Tw) each measured under the firing conditions to be used for firing the multilayered structure transferred to a surface of a substrate satisfy the relationship Tdb.

    Abstract translation: 平稳地释放击发转印膜，其具有转移环的功能性图案的优良性能和使由有机物焙烧所产生的热解气体，并且可以形成在基片不含功能性图案的缺陷：例如，形状或功能 故障。 一个用于烧制的转印膜的包括释放膜和形成，以便在接触与释放电影的表面中的一个的多层结构。 该多层结构包括两个用于烧制到基底的表面和脱模膜和压敏粘合剂层之间形成的功能性图案转印膜接合的压敏粘合剂层。 功能性图案通过烧制包含无机粒子和第一有机物质可移除的，和所述压敏粘合剂层包括通过烧成可移动和不同于第一有机物质的第二有机物质。 第一有机物质（TDB）的热分解温度，以用于烧制该第二有机物质的热分解温度（TDA），和无机颗粒（TW）的烧制条件下每个测量的熔融粘结温度 转移到衬底的表面多层结构满足关系Tdb的。

    Methods of making high capacitance density embedded ceramic capacitors
    33.
    发明公开
    Methods of making high capacitance density embedded ceramic capacitors 审中-公开
    Verfahren zur Herstellung eingebetteter Keramikkondensatoren von hoherKapazitätsdichte

    公开(公告)号：EP1956616A1

    公开(公告)日：2008-08-13

    申请号：EP07023856.3

    申请日：2007-12-10

    Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

    Inventor： Borland, William ,  Drozdyk, Lorri P.

    IPC: H01G4/33 ,  H05K1/16 ,  H01G4/12

    CPC classification number: H01G4/33 ,  H01G4/1218 ,  H05K1/092 ,  H05K1/162 ,  H05K3/06 ,  H05K3/1291 ,  H05K3/4641 ,  H05K2201/017 ,  H05K2203/1126 ,  Y10T29/417 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49156

    Abstract: Methods of making metal/dielectric/metal structures (100) include casting metal slurry onto a fugitive substrate (105) to form the first electrode (110) and subsequently casting dielectric and metal slurries onto the first electrode (110), removing the fugitive substrate (105) and co-firing the structure, wherein the dielectric (120) comprises glass in an amount that is less than 20 weight% of the inorganic component of the dielectric (120) and the dielectric (120) achieves substantially complete densification. Alternatively, a metal tape and a dielectric tape, comprising glass in the above amount, may be formed and laminated together to form a metal/dielectric/metal green tape structure (100), which is co-fired, such that the structure achieves substantially complete densification.

    Abstract translation: 制造金属/电介质/金属结构（100）的方法包括将铸造金属浆料浇铸到短暂衬底（105）上以形成第一电极（110），随后将电介质和金属浆料浇铸到第一电极（110）上，去除短暂衬底 （105）并共烧烧所述结构，其中所述电介质（120）包含的量小于所述电介质（120）的无机组分的20重量％并且所述电介质（120）实现基本上完全致密化的量的玻璃。 或者，可以形成包含上述量的玻璃的金属带和介电带，并将其层叠在一起以形成共烧的金属/电介质/金属生带结构（100），使得该结构基本上达到 完全致密化。

    Oxygen doped firing of barium titanate on copper foil
    36.
    发明公开
    Oxygen doped firing of barium titanate on copper foil 审中-公开
    Brennen von Bariumtitanat auf Kupferfolie unter Sauerstoffdotierung

    公开(公告)号：EP1677320A1

    公开(公告)日：2006-07-05

    申请号：EP05025289.9

    申请日：2005-11-18

    Applicant: E.I. du Pont de Nemours and Company

    Inventor： Borland, William J.

    IPC: H01G4/12 ,  H05K1/16

    CPC classification number: H01G4/1227 ,  H05K1/092 ,  H05K1/162 ,  H05K3/1291 ,  H05K2201/017 ,  H05K2201/0355 ,  H05K2201/09763 ,  H05K2203/1126 ,  Y10T428/24917

    Abstract: The present invention relates to a method of making an embedded capacitor and a printed wiring board and includes providing a metallic foil (110); forming a first dielectric layer (128) over the metallic foil; forming a conductive layer (132) over at least a portion of the first dielectric layer; controlling an oxygen content of a controlled atmosphere; and firing the first dielectric layer and the conductive layer in a firing zone in the controlled atmosphere.

    Abstract translation: 本发明涉及一种制造嵌入式电容器和印刷电路板的方法，包括提供金属箔（110）; 在所述金属箔上形成第一介电层（128）; 在所述第一介电层的至少一部分上形成导电层（132）; 控制受控气氛的氧含量; 以及在受控气氛中的烧制区中烧制第一介电层和导电层。

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