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公开(公告)号：EP3378080A1
公开(公告)日：2018-09-26
申请号：EP16804968.2
申请日：2016-11-14
发明人： VAN KAMPEN, Robertus Petrus , HUFFMAN, James Douglas , RENAULT, Mickael , DASTIDER, Shibajyoti Ghosh , MUYANGO, Jacques Marcel
CPC分类号： H01H1/0036 , B81B3/0021 , B81B2201/016 , B81C1/00142 , H01H2001/0084
摘要： The present invention generally relates to a mechanism for making a MEMS switch that has a robust RF-contact by avoiding currents to run through a thin sidewall in a via from the RF-contact to the underlying RF-electrode.
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公开(公告)号：EP3028291B1
公开(公告)日：2018-04-25
申请号：EP14755235.0
申请日：2014-08-01
摘要： The present invention generally relates to a MEMS DVC utilizing one or more MIM capacitors. The MIM capacitor may be disposed between the MEMS device and the RF pad or the MIM capacitor may be integrated into the MEMS device itself. The MIM capacitor ensures that a low resistance for the MEMS DVC is achieved.
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公开(公告)号：EP3254294A1
公开(公告)日：2017-12-13
申请号：EP16703698.7
申请日：2016-01-28
CPC分类号： H01G4/005 , B81B2201/016 , H01H1/0036 , H01H59/0009 , H01H2001/0057 , H01H2001/0084
摘要： The present disclosure generally relates to a MEMS DVC utilizing one or more MIM capacitors located in the anchor of the DVC and an Ohmic contact located on the RF-electrode. The MIM capacitor in combination with the ohmic MEMS device ensures that a stable capacitance for the MEMS DVC is achieved with applied RF power.
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公开(公告)号：EP3205018A1
公开(公告)日：2017-08-16
申请号：EP15774834.4
申请日：2015-09-23
发明人： PARKHURST, Ray
摘要： Embodiments disclosed herein generally relate to power amplifier matching circuits used for matching impedance and harmonic control in a device, such as a cellular phone. In one example, a power amplifier matching circuit includes two DVCs, four inductors, a transistor, and a capacitor. Utilizing the two DVCs, the impedance matching ratio and the center frequency of the circuit are capable of adjustment as needed. Moreover, the inclusion of the two DVCs may also prevent harmonic frequencies from undesirably passing through the power amplifier matching circuit to the antenna of a cellular device. The power amplifier matching circuit may be used in conjunction with an amplifier, where the output of the amplifier is proportional to the current in the circuit.
摘要翻译： 这里公开的实施例一般涉及用于匹配诸如蜂窝电话的设备中的阻抗和谐波控制的功率放大器匹配电路。 在一个示例中，功率放大器匹配电路包括两个DVC，四个电感器，晶体管和电容器。 利用两个DVC，电路的阻抗匹配比和中心频率可根据需要进行调整。 此外，包括两个DVC还可以防止谐波频率不合需要地穿过功率放大器匹配电路到达蜂窝设备的天线。 功率放大器匹配电路可以与放大器结合使用，其中放大器的输出与电路中的电流成比例。
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46.发明公开DEVICE WITH VARIABLE FREQUENCY FILTER FOR REJECTING HARMONICS 审中-公开VORRICHTUNG MIT过滤器VARIABLER FREENENZEN ZURUNTERDRÜCKUNGVON OBERSCHWINGUNGEN
公开(公告)号：EP3130080A1
公开(公告)日：2017-02-15
申请号：EP15716956.6
申请日：2015-04-02
发明人： PARKHURST, Ray , GADDI, Roberto
CPC分类号： H04B1/123 , H04B1/0458 , H04B1/18
摘要： The present disclosure generally relates to a device having a variable frequency filter that rejects harmonics generated by a variable reactance device. The variable frequency filter may be coupled to the antenna and the variable reactance device. The filter includes a variable capacitor and an inductor coupled together as a resonant circuit. The filter may be used in cellular technology to prevent harmonic frequencies that are created by another variable reactance device from reaching the antenna of the cellular device. Furthermore, the filter can reflect any receiving frequencies from the antenna and prevent the receiving frequencies from passing through.
摘要翻译： 本公开总体上涉及具有可变频率滤波器的装置，该可变频率滤波器抑制由可变电抗装置产生的谐波。 可变频率滤波器可以耦合到天线和可变电抗装置。 滤波器包括可变电容器和耦合在一起作为谐振电路的电感器。 滤波器可以用于蜂窝技术中以防止由另一可变电抗装置产生的谐波频率到达蜂窝设备的天线。 此外，滤波器可以反射来自天线的任何接收频率并防止接收频率通过。
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公开(公告)号：EP2751837A4
公开(公告)日：2015-04-08
申请号：EP12827352
申请日：2012-09-04
发明人： VAN KAMPEN ROBERTUS PETRUS , UNAMUNO ANARTZ , KNIPE RICHARD L , GADDI ROBERTO , MAHAMEED RASHED
IPC分类号： H01L27/14
CPC分类号： H01H59/0009 , B81B3/0097 , B81B7/04 , B81B2201/018 , B81B2203/0109 , B81B2203/0118 , B81B2203/0172 , B81B2203/0307
摘要： The present invention generally relates to a MEMS device having a plurality of cantilevers that are coupled together in an anchor region and/or by legs that are coupled in a center area of the cantilever. The legs ensure that each cantilever can move/release from above the RF electrode at the same voltage. The anchor region coupling matches the mechanical stiffness in all sections of the cantilever so that all of the cantilevers move together.
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公开(公告)号：EP2745301A1
公开(公告)日：2014-06-25
申请号：EP12759849.8
申请日：2012-08-17
CPC分类号： H01G5/16 , H01G5/38 , H01G7/00 , H01H59/0009 , Y10T29/43
摘要： Utilizing a variable capacitor for RF and microwave applications provides for multiple levels of intra-cavity routing that advantageously reduce capacitive coupling. The variable capacitor includes a bond pad that has a plurality of cells electrically coupled thereto. Each of the plurality of cells has a plurality of MEMS devices therein. The MEMS devices share a common RF electrode, one or more ground electrodes and one or more control electrodes. The RF electrode, ground electrodes and control electrodes are all arranged parallel to each other within the cells. The RF electrode is electrically connected to the one or more bond pads using a different level of electrical routing metal.
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公开(公告)号：EP2542499A2
公开(公告)日：2013-01-09
申请号：EP11707299.1
申请日：2011-02-25
IPC分类号： B81C1/00
CPC分类号： B81C1/00095 , B81B2203/04 , B81B2207/07 , B81C1/00611 , B81C2201/0104
摘要： The present invention generally relates to the formation of a micro-electromechanical system (MEMS) cantilever switch in a complementary metal oxide semiconductor (CMOS) back end of the line (BEOL) process. The cantilever switch is formed in electrical communication with a lower electrode in the structure. The lower electrode may be either blanket deposited and patterned or simply deposited in vias or trenches of the underlying structure. The excess material used for the lower electrode is then planarized by chemical mechanical polishing or planarization (CMP). The cantilever switch is then formed over the planarized lower electrode.
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50.发明公开FABRICATION OF MEMS BASED CANTILEVER SWITCHES BY EMPLOYING A SPLIT LAYER CANTILEVER DEPOSITION SCHEME 有权悬臂接通MEMS BASIS的使用的零件层悬臂存款计划生产
公开(公告)号：EP2389336A2
公开(公告)日：2011-11-30
申请号：EP10700934.2
申请日：2010-01-20
IPC分类号： B81B3/00
CPC分类号： B81B3/007 , B81B2201/014 , B81B2203/0118 , H01L41/094
摘要： Embodiments discussed herein generally disclose novel alternative methods that can be employed to overcome the gradient stress formed in refractory materials to be used for thin film MEMS cantilever switches. The use of a ‘split layer’ cantilever fabrication method, as described herein enables thin film MEMS cantilever switches to be fabricated resulting in low operating voltage devices while maintaining the mechanical rigidity of the landing portion of the final fabricated cantilever switch.
摘要翻译： 在基因集会讨论的实施例公开了新颖的替代方法也可以用来克服形成在耐火材料用于薄膜MEMS悬臂开关梯度应力。 使用“分割层”悬臂的制造方法，如在描述的启用导致低工作电压的装置，同时保持最终制造的悬臂式开关的着陆部分的机械刚度要制造的薄膜MEMS悬臂开关。
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