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    Electroless copper plating
    41.
    发明公开
    Electroless copper plating 失效
    Verfahren zum stromlosen Abscheiden von Kupfer。

    公开(公告)号：EP0109015A1

    公开(公告)日：1984-05-23

    申请号：EP83111030.9

    申请日：1983-11-04

    Applicant: SHIPLEY COMPANY INC.

    Inventor： Abu-Moustafa, Magda ,  Valayil, Silvester Paul

    IPC: C23C3/02

    CPC classification number: C23C18/40 ,  C23C18/405

    Abstract: A non-fuming copper plating solution where formaldehyde fuming is eliminated by adjustment of the copper and formaldehyde to hydroxide. The preferred ratio of each to hydroxide is preferably at least 1 to 10.

    Abstract translation: 通过将铜和甲醛调节为氢氧化物而消除甲醛发烟的非发烟铜电镀溶液。 每个与氢氧化物的优选比例优选为至少1至10。

    Solution waste treatment
    43.
    发明公开
    Solution waste treatment 失效
    Verfahren zur Behandlung vonAbfallflüssigkeiten。

    公开(公告)号：EP0056832A1

    公开(公告)日：1982-08-04

    申请号：EP81100570.1

    申请日：1981-01-27

    Applicant: SHIPLEY COMPANY INC.

    Inventor： Kretas, George Anthony ,  Ireland, Irving Robert

    IPC: C02F9/00

    CPC classification number: C02F9/00 ,  C02F1/66 ,  C02F1/70 ,  C02F1/76 ,  C02F2101/20 ,  C02F2101/303 ,  C02F2209/06

    Abstract: A process is provided for the waste treatment of metal plating solutions. One embodiment of the process comprises removal of the metal values contained in solution and inactivation or destruction of the complexing agent's ability to complex heavy metals. A second embodiment comprises inactivation or destruction of the complexing agent as a first step, formation of a sludge if not formed by inactivation of the complexing agent and sludge removal. Either embodiment permits direct discharge of spent plating solutions into the environment without violation of federal or municipal regulation.

    Abstract translation: 提供了一种用于金属电镀溶液的废物处理的方法。 该方法的一个实施方案包括除去溶液中所含的金属值，灭活或破坏络合剂复合重金属的能力。 第二个实施方案包括作为第一步骤的络合剂的灭活或破坏，如果不是通过使络合剂失活和污泥去除而形成污泥。 任一实施例允许将废弃电镀溶液直接排放到环境中，而不违反联邦或市政法规。

    Process for applying a photoresist, and photoresist solution
    45.
    发明公开
    Process for applying a photoresist, and photoresist solution 无效
    施加光刻胶涂层和光致抗蚀剂溶液的方法。

    公开(公告)号：EP0027603A1

    公开(公告)日：1981-04-29

    申请号：EP80106133.4

    申请日：1980-10-09

    Applicant: SHIPLEY COMPANY INC.

    Inventor： Oddi, Michael J. ,  Orio, Alfred P.

    IPC: H05K3/06

    CPC classification number: H05K3/28 ,  G03F7/16 ,  H05K3/064 ,  H05K3/108 ,  H05K3/1216 ,  H05K2203/0759 ,  Y10S430/136

    Abstract: This invention is directed to processes for using a light sensitive photoresist material in the manufacture of an article having a surface permanently modified in an image pattern. The process comprises applying the photoresist to a substrate through a screen, preferably as a continuous, incompletely imaged layer and thereafter, imaging and developing to provide a relief image in the photoresist layer and treating the substrate to provide a permanent image in the finished article. The process is particularly useful in the manufacture of printed circuits. The process is believed to be a departure from conventional processes in the step of screening a light sensitive photoresist material over a substrate.

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