公开(公告)号：EP1902779A3

公开(公告)日：2008-04-02

申请号：EP08000280.1

申请日：2003-02-25

Applicant: Hitachi Chemical Co., Ltd.

Inventor： The designation of the inventor has not yet been filed

IPC: B01J19/00 ,  B01L3/00

CPC classification number: B01L3/502707 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00788 ,  B01J2219/00822 ,  B01J2219/00833 ,  B01J2219/0086 ,  B01J2219/00869 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0838 ,  B01L2300/0874 ,  B01L2300/0887 ,  B01L2400/0481 ,  B01L2400/0655 ,  B81B2201/051 ,  B81C1/00119 ,  B81C2201/019 ,  B81C2203/032 ,  Y10T156/10

Abstract: A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and at least one hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system. A second support may be disposed on the first support and the hollow filament.

Abstract translation: 用于微流体系统的支撑单元包括第一支撑件; 设置在所述第一支撑件的表面上的第一粘合剂层; 以及至少一根中空丝，所述中空丝设置在所述第一粘合剂层的表面上以具有任意形状并用作所述微流体系统的流动通道层。 第二支撑件可以设置在第一支撑件和中空细丝上。

公开(公告)号：EP1902781A2

公开(公告)日：2008-03-26

申请号：EP08000284.3

申请日：2003-02-25

Applicant: Hitachi Chemical Co., Ltd.

Inventor： The designation of the inventor has not yet been filed

IPC: B01J19/00 ,  B01L3/00

CPC classification number: B01L3/502707 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00788 ,  B01J2219/00822 ,  B01J2219/00833 ,  B01J2219/0086 ,  B01J2219/00869 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0838 ,  B01L2300/0874 ,  B01L2300/0887 ,  B01L2400/0481 ,  B01L2400/0655 ,  B81B2201/051 ,  B81C1/00119 ,  B81C2201/019 ,  B81C2203/032 ,  Y10T156/10

Abstract: A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system.

Abstract translation: 用于微流体系统的支撑单元包括第一支撑件; 设置在所述第一支撑体的表面上的第一粘合剂层; 以及铺设在第一粘合剂层的表面上的具有任意形状并用作微流体系的流动通道层的至少两个相等的中空丝。

公开(公告)号：EP1845060A1

公开(公告)日：2007-10-17

申请号：EP07104337.6

申请日：2007-03-16

Applicant: HONEYWELL INC.

Inventor： Yu, Lianzhong

IPC: B81B3/00

CPC classification number: B81C1/00484 ,  B81B2201/0235 ,  B81B2201/033 ,  B81B2203/0136 ,  B81C2201/019

Abstract: A method of manufacturing a vertical comb structure for a microelectromechanical (MEMS) device. Tooth structures are formed on a first wafer. A second water is then bonded to the tooth structures of the first wafer. The tooth structures are then released to form a comb structure. Forming the tooth structures on the first wafer includes using oxidation, photolithography, etching, epitaxy, and chemical and mechanical polishing to create the tooth structures on the first wafer.

Abstract translation: 一种制造用于微机电（MEMS）装置的垂直梳结构的方法。 齿结构形成在第一晶片上。 然后将第二水接合到第一晶片的齿结构。 然后释放齿结构以形成梳结构。 在第一晶片上形成齿结构包括使用氧化，光刻，蚀刻，外延和化学和机械抛光以在第一晶片上产生齿结构。

公开(公告)号：EP1820571A1

公开(公告)日：2007-08-22

申请号：EP06002630.9

申请日：2006-02-09

Applicant: Roche Diagnostics GmbH ,  F.HOFFMANN-LA ROCHE AG

Inventor： Sandoz, Roger ,  Effenhauser, Carlo

IPC: B01L3/00

CPC classification number: B01F5/061 ,  B01F13/0059 ,  B01F2005/0621 ,  B01F2005/0636 ,  B01J2219/00511 ,  B01J2219/00889 ,  B01L3/502707 ,  B01L3/502746 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0887 ,  B01L2400/086 ,  B81B1/00 ,  B81B2201/058 ,  B81C2201/019

Abstract: A micro fluidic device comprises a laminate structure, comprising a plurality of individual layers. At least one layer (1) comprises a micro fluidic structure or micro fluidic channel (3) and at least on one side of said layer a further layer (11) is arranged comprising a three-dimensional (3D) structure (13) such, that the 3D-structure is influencing a flow characteristic of a fluid within the micro fluidic channel (3).

Abstract translation: 微流体装置包括层压结构，包括多个单独的层。 至少一个层（1）包括微流体结构或微流体通道（3），并且至少在所述层的一侧上布置另外的层（11），其包括三维（3D）结构（13） 3D结构影响微流体通道（3）内的流体的流动特性。

公开(公告)号：EP1798196A1

公开(公告)日：2007-06-20

申请号：EP05257719.4

申请日：2005-12-15

Applicant: Infineon Technologies SensoNor AS

Inventor： Westgaard, Trond

IPC: B81B7/00

CPC classification number: B81C1/00269 ,  B81C2201/019 ,  B81C2203/031

Abstract: A multi-layer device comprises a first layer with a micro-mechanical component formed thereon. There are also first and second sealing layers, with the first layer sandwiched between the first and second sealing layers and anodically bonded thereto to define a cavity therein as is provided within the cavity together with an electrode for reducing UV emission, the electrode formed on at least a part of a surface of the second sealing layer internal to the cavity and arranged to be in electrical contact, in use, with the first layer.

Abstract translation: 多层装置包括在其上形成有微机械部件的第一层。 还有第一和第二密封层，其中第一层夹在第一和第二密封层之间并阳极结合到其上以在空腔内设置一个空腔，以及用于减少紫外线发射的电极，形成在电极上的电极 所述第二密封层的表面的至少一部分在所述腔的内部并且被布置成在使用中与所述第一层电接触。

公开(公告)号：EP1436237B1

公开(公告)日：2007-03-07

申请号：EP02747799.1

申请日：2002-07-09

Applicant: IMEGO AB

Inventor： BERGSTEDT, Leif ,  PERSSON, Katrin

IPC: C03C27/00 ,  H05K3/00 ,  H01L21/473

CPC classification number: H01L24/26 ,  B81C1/00357 ,  B81C2201/019 ,  H01L24/83 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01011 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01058 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K1/0306 ,  H05K3/28

Abstract: The present invention relates to a method of anodic bonding a first structure (14) to a glass layer (12). The method comprises the steps of arranging a conductive pattern (11) on a substrate, providing the glass layer on said conductive pattern (11), providing said first structure on said glass layer (12), providing an electrode on one side of said first structure, and applying a voltage to said conductive pattern and said electrode to obtain an electrical field across said first structure and said glass layer, between said conductive pattern (11) and said electrode (15) produce an anodic bonding between said first structure and said glass layer.

公开(公告)号：EP1737574A2

公开(公告)日：2007-01-03

申请号：EP05750627.1

申请日：2005-02-14

Applicant: THE UNIVERSITY OF NORTH CAROLINA AT CHAPEL HILL ,  NORTH CAROLINA STATE UNIVERSITY

Inventor： DESIMONE, Joseph, M. ,  ROLLAND, Jason, P. ,  DENISON, Ginger, M.

IPC: B01L11/00

CPC classification number: B81C99/0085 ,  B01L3/0268 ,  B01L3/502707 ,  B01L3/502738 ,  B01L7/52 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2400/0481 ,  B01L2400/0655 ,  B29C66/9121 ,  B81B2201/051 ,  B81C1/00206 ,  B81C2201/019 ,  B81C2201/034 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0034 ,  F16K2099/008 ,  F16K2099/0084 ,  Y10T137/0329 ,  Y10T428/13 ,  Y10T428/24

Abstract: The presently disclosed subject matter provides functional perfluoropolyether (PFPE) materials for use in fabricating and utilizing microscale devices, such as a microfluidic device. The functional PFPE materials can be used to adhere layers of PFPE materials to one another or to other substrates to form a microscale device. Further, the presently disclosed subject matter provides a method for functionalizing the interior surface of a microfluidic channel and/or a microtiter well. Also the presently disclosed subject matter provides a method for fabricating a microscale structure through the use of a sacrificial layer of a degradable material.

公开(公告)号：EP1369380B1

公开(公告)日：2006-08-23

申请号：EP03019362.7

申请日：2001-11-30

Applicant: febit biotech GmbH

Inventor： Strobelt, Tilo ,  Frech, Johannes, c/o Innevo Consulting ,  Nommensen, Peter ,  Müller, Martin ,  Stähler, Cord-F.

IPC: B81B1/00 ,  B81C1/00 ,  B01L3/00 ,  G01N27/447 ,  B01J19/00

CPC classification number: B81B1/00 ,  B01L3/502707 ,  B01L2200/12 ,  B81B2201/058 ,  B81B2203/0338 ,  B81C1/00119 ,  B81C1/00357 ,  B81C2201/019 ,  Y10T436/11 ,  Y10T436/25 ,  Y10T436/2575

公开(公告)号：EP1561724A1

公开(公告)日：2005-08-10

申请号：EP05250525.2

申请日：2005-02-01

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Wu, Guanghua ,  Mirza, Amir Raza

IPC: B81B3/00 ,  B81C1/00 ,  G01P15/08

CPC classification number: B81B3/0086 ,  B60C23/0408 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2203/0118 ,  B81C1/00214 ,  B81C1/00357 ,  B81C2201/019 ,  G01L19/0092 ,  G01P15/0802 ,  G01P15/123 ,  G01P2015/0828

Abstract: In one aspect, a microelectromechanical device and method of producing the device includes an accelerometer (110) with a thinned flexure structure (112). In another embodiment, the device and method of producing the device includes an accelerometer (110) and a pressure sensor (120) integrated on a single chip (100).

Abstract translation: 在一个方面，微机电装置和制造该装置的方法包括具有变薄的挠曲结构（112）的加速度计（110）。 在另一个实施例中，生产该装置的装置和方法包括集成在单个芯片（100）上的加速度计（110）和压力传感器（120）。

公开(公告)号：EP1459398A1

公开(公告)日：2004-09-22

申请号：EP02795994.9

申请日：2002-12-19

Applicant: Nantero, Inc.

Inventor： RUECKES, Thomas ,  SEGAL, Brent, M. ,  BROCK, Darren, K.

IPC: H01L51/40

CPC classification number: H01L21/76838 ,  B81C1/00142 ,  B81C2201/019 ,  B82Y10/00 ,  G11C13/025 ,  G11C23/00 ,  G11C2213/16 ,  G11C2213/81 ,  H01H1/0094 ,  Y10S977/734

Abstract: Methods of producing an electromechanical circuit element are described. A lower structure (103) having lower support structures and a lower electrically conductive element is provided. A nanotube ribbon (10) (or other electromechanically responsive element) is formed on an upper surface of the lower structure (103) so as to contact the lower support structures. An upper structure (102) is provided over the nanotube ribbon (101). The upper structure (102) includes upper support structures and an upper electrically conductive element. In some arrangements, the upper and lower electrically conductive elements are in vertical alignment, but in some arrangements they are not.