公开(公告)号：EP0279769A2

公开(公告)日：1988-08-24

申请号：EP88630026.8

申请日：1988-02-17

Applicant: ROGERS CORPORATION

Inventor： Arthur, David J. ,  Mosko, John C. ,  Jackson, Connie S. ,  Traut, Robert G.

IPC: H05K1/03 ,  H01L23/14 ,  H01B3/12

CPC classification number: H05K1/0373 ,  C08K9/06 ,  H01B3/445 ,  H01L23/145 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/034 ,  H05K1/0366 ,  H05K1/056 ,  H05K3/389 ,  H05K3/4626 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/2995 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31692 ,  C08L27/12 ,  H01L2924/00

Abstract: The electrical substrate material preferably comprises polytetrafluoroethylene filled with silica along with a small amount of microfiberglass. In an important feature of this invention, the ceramic filler (silica) is coated with a silane coating material.

Abstract translation: 电基片材料优选包含聚四氟乙烯填充有二氧化硅微玻璃纤维少量沿。 在本发明的一个重要特征，所述陶瓷填料（二氧化硅）涂覆有硅烷涂层材料。

公开(公告)号：EP0194908A2

公开(公告)日：1986-09-17

申请号：EP86400279.5

申请日：1986-02-10

Applicant: Shin-Etsu Chemical Co., Ltd.

Inventor： Suzuki, Niichiro ,  Ogushi, Yoshimi ,  Imai, Kiyoshi ,  Ohta, Nobuhiro ,  Ueno, Susumu

IPC: H05K3/38 ,  B32B15/08

CPC classification number: H05K3/386 ,  H05K1/0393 ,  H05K3/381 ,  H05K3/389 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2203/095

Abstract: @ The invention provides a flexible metal-foiled laminate of an insulating base film of a synthetic resin, e.g. polyimide, and a metal, e.g. copper, foil adhesively bonded together and suitable for use as a base plate for printed circuit boards by virtue of the high heat resistance and greatly increased adhesive bonding strength between the base film and the metal foil. The laminate is prepared by use of a silicone-based adhesive and the surface of the base film is, prior to adhesive bonding, subjected to a treatment of exposure to an atmosphere of low temperature plasma generated in a gaseous organosilicon compound such as trimethyl ethoxy silane, optionally, diluted with an inorganic gas such as oxygen..

公开(公告)号：EP2460765B1

公开(公告)日：2018-06-06

申请号：EP10804247.4

申请日：2010-07-09

Applicant: Mitsubishi Gas Chemical Company, Inc.

Inventor： MATSUMOTO, Takahiro ,  TSURUYA, Hirotaka ,  BAN, Hajime ,  AKITA, Reiki

IPC: C08K9/04 ,  C08L101/00 ,  H01B3/00 ,  H01B17/00 ,  H05K1/03 ,  C04B35/628 ,  C09C1/00

CPC classification number: C09C1/56 ,  B82Y30/00 ,  C01B31/02 ,  C01B32/05 ,  C01P2004/03 ,  C01P2004/16 ,  C01P2004/32 ,  C01P2004/64 ,  C01P2006/40 ,  C08K7/04 ,  C08K9/04 ,  H01B3/004 ,  H05K1/0373 ,  H05K2201/0239 ,  H05K2201/0323 ,  Y10T428/2982

Abstract: Provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed and further adding water thereto and a method for producing the same. Also, provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed, further adding a coupling agent having an alkoxide group and then adding water thereto and a method for producing the same. Further, provided is a high dielectric constant resin composite material obtained by blending the insulated ultrafine powder of the present invention with a resin in a volume ratio (insulated ultrafine powder/resin) falling in a range of 5/95 to 50/50.

公开(公告)号：EP2330876B1

公开(公告)日：2017-11-01

申请号：EP09811600.7

申请日：2009-09-07

Applicant: Tokyo University of Science Foundation

Inventor： TANIGUCHI, Jun ,  YOSHINO, Norio

IPC: H05K3/20 ,  B29C33/56 ,  B29C59/02

CPC classification number: B29C33/56 ,  B29C33/424 ,  B29C33/60 ,  B29C37/0053 ,  H05K3/025 ,  H05K3/20 ,  H05K2201/0239 ,  H05K2201/0373 ,  H05K2203/1152 ,  Y10T428/24479 ,  Y10T428/24612 ,  Y10T428/24802 ,  Y10T428/24926 ,  Y10T428/31663

公开(公告)号：EP2947122B1

公开(公告)日：2017-08-30

申请号：EP14740816.5

申请日：2014-01-14

Applicant: Mitsubishi Gas Chemical Company, Inc.

Inventor： TOMIZAWA, Katsuya ,  CHIBA, Tomo ,  TAKAHASHI, Hiroshi ,  SHIGA, Eisuke ,  UEYAMA, Daisuke ,  NOMIZU, Kentaro

IPC: C08J5/24 ,  C08K3/22 ,  C08K9/06 ,  C08K9/08 ,  H05K1/03

CPC classification number: C09D179/08 ,  C08J5/24 ,  C08K3/34 ,  C08K3/36 ,  C08K9/04 ,  C08K9/06 ,  C08K9/08 ,  C08K2003/2227 ,  C08K2003/2241 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/011 ,  C08L101/00 ,  C09D165/00 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/31663 ,  Y10T442/2861 ,  Y10T442/2992 ,  C08L83/04

公开(公告)号：EP3188314A1

公开(公告)日：2017-07-05

申请号：EP15835308.6

申请日：2015-08-18

Applicant: Mitsui Mining and Smelting Co., Ltd.

Inventor： KAMIKORIYAMA, Yoichi ,  YAMAUCHI, Shinichi ,  YOSHIDA, Mami ,  NAKAYAMA, Shigeki

IPC: H01R4/02 ,  H01B1/22 ,  H01R11/01 ,  H05K3/32

CPC classification number: H01B1/026 ,  C08K3/08 ,  C08K9/06 ,  C08K2003/085 ,  C08K2201/001 ,  C08K2201/003 ,  H01B1/22 ,  H05K1/09 ,  H05K1/11 ,  H05K3/32 ,  H05K3/4007 ,  H05K2201/0239 ,  H05K2201/0272 ,  H05K2203/11 ,  H05K2203/1131 ,  H05K2203/121

Abstract: To provide a connection structure (10) including two conductors (21, 31) and a copper connection (11) electrically connecting the conductors. The connection (11) is made mainly of copper. The connection (11) has a plurality of voids. The connection (11) contains an organosilicon compound in the voids. The connection preferably has a microstructure including an aggregate of a plurality of particles that are fused and bonded to each other to form a neck therebetween. Preferably, the connection has a microstructure including a plurality of large-diameter copper particles having a relatively large diameter and small-diameter copper particles having a smaller diameter than the large-diameter copper particles, the large-diameter copper particles each being fused and bonded to the small-diameter copper particles, the small-diameter copper particles being fused and bonded to each other, and a plurality of the small-diameter copper particles being located around the large-diameter copper particle.

Abstract translation: 为了提供包括两个导体（21,31）和电连接导体的铜连接（11）的连接结构（10）。 连接（11）主要由铜制成。 连接（11）具有多个空隙。 连接（11）在空隙中含有有机硅化合物。 该连接部优选具有微结构，该微结构包括彼此融合并结合以在其间形成颈部的多个颗粒的聚集体。 优选地，所述连接部具有微结构，所述微结构包括多个具有相对较大直径的大直径铜颗粒和具有比所述大直径铜颗粒小的直径的小直径铜颗粒，所述大直径铜颗粒各自熔合并结合 小直径铜粒子彼此融合而接合，多个小直径铜粒子位于大直径铜粒子的周围。

公开(公告)号：EP2947122A1

公开(公告)日：2015-11-25

申请号：EP14740816.5

申请日：2014-01-14

Applicant: Mitsubishi Gas Chemical Company, Inc.

Inventor： TOMIZAWA, Katsuya ,  CHIBA, Tomo ,  TAKAHASHI, Hiroshi ,  SHIGA, Eisuke ,  UEYAMA, Daisuke ,  NOMIZU, Kentaro

IPC: C08L101/00 ,  C08J5/24 ,  C08K3/22 ,  C08K9/06 ,  H05K1/03

CPC classification number: C09D179/08 ,  C08J5/24 ,  C08K3/34 ,  C08K3/36 ,  C08K9/04 ,  C08K9/06 ,  C08K9/08 ,  C08K2003/2227 ,  C08K2003/2241 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/011 ,  C08L101/00 ,  C09D165/00 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/31663 ,  Y10T442/2861 ,  Y10T442/2992 ,  C08L83/04

Abstract: The present invention provides a resin composition including: nanoparticles (A) of alumina and/or boehmite having an average particle size of 1.0 nm to 100 nm; fine particles (B) having an average particle size of 0.20 µm to 100 µm; and a thermosetting resin (C), wherein the nanoparticles (A) have their surfaces treated with a polysiloxane-based modifier.

Abstract translation: 本发明提供一种树脂组合物，其包含：平均粒径为1.0nm〜100nm的氧化铝和/或勃姆石的纳米粒子（A） 平均粒径为0.20μm〜100μm的微粒（B） 和热固性树脂（C），其中纳米粒子（A）的表面用聚硅氧烷基改性剂处理过。

公开(公告)号：EP2521638A1

公开(公告)日：2012-11-14

申请号：EP10809156.2

申请日：2010-12-22

Applicant: Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Inventor： BENWADIH, Mohamed ,  HEITZMANN, Marie

IPC: B26F1/26 ,  H01L21/768

CPC classification number: H05K3/0044 ,  H05K2201/0239 ,  H05K2203/0522 ,  H05K2203/0746

Abstract: The method for making a hole (5) in a layer (4) comprises the provision of first and second adhesion areas (1a) and (1b) on a surface of a substrate (2). The first area (1a) has dimensions corresponding to the dimensions of the hole (5). The method comprises depositing a layer (4) on the first and second areas (1a) and (1b). The material of the layer (4) has an adhesion coefficient to the first area (1a) lower than the adhesion coefficient to the second area (1b). The part of the layer arranged above the first area (1a) is eliminated by a fluid jet (6).

公开(公告)号：EP2290132A1

公开(公告)日：2011-03-02

申请号：EP09766514.5

申请日：2009-05-29

Applicant: Nippon Mining & Metals Co., Ltd.

Inventor： MORIYAMA Terumasa ,  KAMINAGA Kengo

IPC: C23C28/00 ,  B32B15/01 ,  C25D7/06 ,  H05K3/38

CPC classification number: H05K3/384 ,  C23C28/00 ,  C23C28/321 ,  C23C28/345 ,  C23C28/3455 ,  C25D3/562 ,  C25D3/565 ,  C25D7/0614 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12569 ,  Y10T428/12583 ,  Y10T428/1259 ,  Y10T428/12618 ,  Y10T428/1266 ,  Y10T428/12792 ,  Y10T428/12847 ,  Y10T428/12903 ,  Y10T428/12944 ,  Y10T428/263 ,  Y10T428/27 ,  Y10T428/273

Abstract: Provided is a copper foil for a printed circuit board comprising a layer including nickel, zinc, a compound of nickel and that of zinc (hereinafter referred to a "nickel zinc layer") on a roughened surface of a copper foil, and a chromate film layer on the nickel zinc layer, wherein the zinc add-on weight per unit area of the nickel zinc layer is 180µg/dm 2 or more and 3500µg/dm 2 or less, and the nickel weight ratio in the nickel zinc layer {nickel add-on weight 1 (nickel add-on weight + zinc add-on weight)} is 0.38 or more and 0.7 or less. This surface treatment technology of a copper foil is able to effectively prevent the circuit corrosion phenomenon in cases of laminating a copper foil on a resin base material and using a sulfuric acid hydrogen peroxide etching solution to perform soft etching to the circuit.

Abstract translation: 本发明提供一种印刷电路板，其包括一个层包括镍，锌，镍的化合物的铜箔和没有锌（由称为“镍锌层”之后）在铜箔的粗糙表面上，和铬酸盐电影 层中的镍锌层上，worin锌附加每镍锌层的单位面积重量为每次180μg/ dm 2以上和3500μg/ dm 2的或更小，并且在镍锌层中的镍的重量比{镍附加 - 酮1重量（镍添加重量+锌添加重量）}是0时38分以上且0.7以下。 的铜箔的该表面处理技术能够有效地防止腐蚀电路现象层叠上的树脂基材的铜箔，并用硫酸过氧化氢蚀刻液来进行软蚀刻到电路的情况下。

公开(公告)号：EP2226346A4

公开(公告)日：2011-01-26

申请号：EP08791811

申请日：2008-07-29

Applicant: PANASONIC ELEC WORKS CO LTD

Inventor： FUJISAWA HIROYUKI ,  TAMIYA HIROKI

IPC: C08G59/32 ,  B32B15/08 ,  C08G59/62 ,  C08J5/24 ,  C08K3/22 ,  C08K7/18 ,  C08L63/00 ,  H05K1/03 ,  H05K3/46

CPC classification number: H05K1/0373 ,  B32B5/024 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/04 ,  B32B27/12 ,  B32B27/38 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2307/306 ,  B32B2307/50 ,  B32B2457/08 ,  C08G59/38 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/08 ,  C08K3/22 ,  C08K3/36 ,  C08K5/13 ,  C08L63/00 ,  H05K3/4626 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/31529 ,  C08L2666/22