公开(公告)号：EP1798312A1

公开(公告)日：2007-06-20

申请号：EP05780242.3

申请日：2005-08-12

申请人： The Furukawa Electric Co., Ltd.

发明人： IWAMA, Hisashi c/o The Furukawa Electric Co., Ltd. ,  TANAKA, Hiroaki c/o The Furukawa Electric Co., Ltd ,  KIMURA, Harunobu c/o The Furukawa Electric Co. Ltd ,  TANAKA, Hitoshi c/o The Furukawa Electric Co., Ltd ,  HIROTA, Yutaka c/o The Furukawa Electric Co., Ltd.

IPC分类号： C25C7/08 ,  C25C7/02

CPC分类号： C25C7/007 ,  C25C7/02 ,  C25C7/08

摘要： An apparatus for recovering a metal, which comprises a metal-recovering board (2) having an electrodeposition surface (2a, 2t) for the attachment of a metal component (R) precipitated from a solution and an insulating material (2b) formed around a pattern of the electrodeposition surface (2a, 2t). The metal-recovering board (2) is immersed in a metal-containing solution in an electrolytic treatment vessel (1), and thereby the metal in the solution is selectively precipitated on the electrodeposition surface (2a, 2t) and is converted to a bulk. The resultant metal bulk is scraped together for recovery with a blade (6) in a form as it is. The above apparatus for recovering a metal can be suitably used for recovering a metal in a solution in a state allowing easy reuse with good efficiency.

摘要翻译： 一种用于回收金属的装置，其包括具有电沉积表面（2a，2t）的金属回收板（2），用于附着从溶液沉淀的金属组分（R）和形成在其上的绝缘材料（2b） 电沉积表面（2a，2t）的图案。 将金属回收板（2）浸渍在电解处理容器（1）中的含金属溶液中，从而将溶液中的金属选择性地析出在电沉积面（2a，2t）上，并转化成块状 。 将所得到的金属体刮擦在一起以用于以原样形式的叶片（6）进行回收。 上述用于回收金属的装置可以适当地用于在容易再利用的状态下以良好的效率回收溶液中的金属。

公开(公告)号：EP1744371A1

公开(公告)日：2007-01-17

申请号：EP05736664.3

申请日：2005-05-02

申请人： The Furukawa Electric Co., Ltd.

发明人： IKEDA, Nariaki, c/o THE FURUKAWA ELECTRIC CO., LTD ,  LI, Jiang, c/o THE FURUKAWA ELECTRIC CO., LTD. ,  YOSHIDA, Seikoh c/o THE FURUKAWA ELECTRIC CO., LTD

IPC分类号： H01L29/47 ,  H01L29/872

CPC分类号： H01L29/7787 ,  H01L29/2003

摘要： A GaN semiconductor device which has a low on-resistance, has a very small leak current when a reverse bias voltage is applied and is very excellent in withstand voltage characteristic, said GaN semiconductor device having a structure being provided with a III-V nitride semiconductor layer containing at least one hetero junction structure of III-V nitride semiconductors having different band gap energies; a first anode electrode arranged on a surface of said III-V nitride semiconductor by Schottky junction; a second anode electrode which is arranged on the surface of said III- V nitride semiconductor layer by Schottky junction, is electrically connected with said first anode electrode and forms a higher Schottky barrier than a Schottky barrier formed by said first anode electrode; and an insulating protection film which is brought into contact with said second anode electrode and is arranged on the surface of said III-V nitride semiconductor layer.

摘要翻译： 具有低导通电阻的GaN半导体器件，当施加反向偏置电压时具有非常小的漏电流并且具有非常优异的耐电压特性，所述GaN半导体器件具有设置有III-V族氮化物半导体 包含具有不同带隙能量的III-V族氮化物半导体的至少一个异质结结构的层; 通过肖特基结布置在所述III-V族氮化物半导体的表面上的第一阳极电极; 通过肖特基结布置在所述III-V族氮化物半导体层的表面上的第二阳极电极与所述第一阳极电连接并形成比由所述第一阳极形成的肖特基势垒更高的肖特基势垒; 以及与所述第二阳极电极接触并设置在所述III-V族氮化物半导体层的表面上的绝缘保护膜。

公开(公告)号：EP1744207A1

公开(公告)日：2007-01-17

申请号：EP05721024.7

申请日：2005-03-17

申请人： The Furukawa Electric Co., Ltd.

发明人： INOUE, Takashi, c/o The Furukawa Electric Co., Ltd ,  NAMIKI, Shu, c/o The Furukawa Electric Co., Ltd.

IPC分类号： G02F1/365

CPC分类号： G02F1/365 ,  G02F2203/26 ,  G02F2203/54

摘要： The present invention provides a method for designing an optical pulse shaper including a first optical propagation line unit having a nonlinear medium and a dispersion medium concatenated, including: specifying design specifications of the first optical propagation line unit; and based on the design specification, calculating a quasi-periodic stationary pulse of which a waveform of an input optical pulse to the first optical propagation line unit is similar to a waveform of an output pulse from the first optical propagation line unit.

摘要翻译： 本发明提供了用于光脉冲成形器，其包括具有非线性介质和分散介质级联，第一光传播线路单元的设计的方法，包括：指定第一光传播线路单元的设计规格; 并且基于设计规格，计算其中的准周期性静止脉冲的输入光脉冲到第一光传播线路单元的波形类似于从第一光传播线路单元的输出脉冲的波形。

公开(公告)号：EP1742230A1

公开(公告)日：2007-01-10

申请号：EP05736585.0

申请日：2005-04-26

申请人： The Furukawa Electric Co., Ltd.

发明人： FUKUDA, Hideo; c/o THE FURUKAWA ELECTRIC CO., ,  KIM, Yong, Hoon; c/o THE FURUKAWA ELECTRIC CO., ,  FUSHIMI, Noriyoshi; c/o THE FURUKAWA ,  KOBAYASHI, Isamu; c/o THE FURUKAWA ELECTRIC CO., ,  SAITO, Minoru; c/o THE FURUKAWA ELECTRIC CO., ,  ONODERA, Makoto; c/o THE FURUKAWA ELECTRIC CO.,

IPC分类号： H01B7/02 ,  H01B3/30 ,  H01B7/00 ,  H01F27/28 ,  H01F27/32

CPC分类号： H01B3/301 ,  H01F27/323 ,  H01F27/324 ,  Y10T428/2933 ,  Y10T428/294 ,  Y10T428/2947

摘要： A multilayer insulated wire has a conductor and two or more extrusion-insulating layers to cover the conductor,
wherein at least one layer of the insulating layers other than an innermost layer is formed by a resin mixture containing a polyphenylene sulfide resin (A) as a continuous phase and an olefin-based copolymer ingredient (B) as a dispersed phase,or
wherein at least one layer of the insulating layers other than an innermost layer is formed by a resin mixture containing a polyphenylene sulfide resin (A) as a continuous phase, and an olefin-based copolymer ingredient (B) and a polyamide (E) as a dispersed phase;
a transformer is made by the multilayer insulated wire.

摘要翻译： 多层绝缘电线具有导体和两个或更多个挤出绝缘层以覆盖导体，其中除了最内层之外的至少一层绝缘层由含有聚苯硫醚树脂（A）作为 连续相和作为分散相的烯烃类共聚物成分（B），或者通过含有作为连续相的聚苯硫醚树脂（A）的树脂混合物形成除了最内层以外的至少一层绝缘层 ，和作为分散相的烯烃类共聚物成分（B）和聚酰胺（E） 变压器由多层绝缘线制成。

公开(公告)号：EP1717265A1

公开(公告)日：2006-11-02

申请号：EP05775961.5

申请日：2005-08-31

申请人： The Furukawa Electric Co., Ltd.

发明人： MASUDA, Kohji, The Furukawa Electric Co., Ltd. ,  ITO, Masayasu, The Furukawa Electric Co., Ltd. ,  YOSHIDA, Naoki, The Furukawa Electric Co., Ltd.

IPC分类号： C08J9/12 ,  B29C67/20 ,  C08L67/00 ,  B29K267/00 ,  B29K105/04

CPC分类号： B29C44/3446 ,  B29C44/3453 ,  C08J9/0066 ,  C08J9/122 ,  C08J2201/032 ,  C08J2367/00

摘要： An object of the present invention is to provide a thermoplastic resin sheet which has both high reflectance ratio and excellent shape-holding property suitable for backlights and illumination boxes for use in illumination signboards, illumination fixtures and displays and illumination boxes.
The thermoplastic resin foam is manufactured by a manufacturing method comprising a process for containing inert gas by holding thermoplastic resin sheet containing metallic oxide in a pressurized inert gas atmosphere and a process for heating the thermoplastic resin sheet in which the inert gas is contained at a temperature higher than the softening temperature of the thermoplastic resin, under normal pressure, and foaming the resin.

摘要翻译： 本发明的目的是提供一种热塑性树脂片，其具有高反射率和适合于用于照明招牌，照明器具和显示器和照明箱的背光和照明盒的良好保形性。 热塑性树脂发泡体是通过包含惰性气体的制造方法制造的，该方法包括在加压惰性气体气氛中保持含有金属氧化物的热塑性树脂片材，以及加热含有惰性气体的热塑性树脂片材的温度 高于热塑性树脂的软化温度，并在常压下发泡。

公开(公告)号：EP1701416A2

公开(公告)日：2006-09-13

申请号：EP06004593.7

申请日：2006-03-07

申请人： The Furukawa Electric Co., Ltd.

发明人： Ueno, Seiichi c/o The Furukawa Electric Co., Ltd ,  Yabu, Takenobu c/o The Furukawa Electric Co., Ltd ,  Aoyagi, Shigeharu c/o The Furukawa Electr Co., Ltd ,  Shinozaki, Hirotomo c/o The Furukawa Elec Co., Ltd

IPC分类号： H01R13/66

CPC分类号： H01R9/226 ,  H01R4/2433 ,  H01R13/501 ,  H01R13/506 ,  H01R13/665 ,  Y10S439/925

摘要： There is provided a communication control IC-incorporating connector characterized in that a communication control IC is incorporated in a housing; an equipment-side connecting portion for connecting the equipment-side lead of the IC to the male terminal of an equipment-side connector is provided in the interior on the front end side of the housing, and a bus wiring-side connecting portion for connecting the bus wiring-side lead of the IC to the electric wire of a bus wiring circuit is provided in the interior on the rear end side of the housing; and in the equipment-side connecting portion, a two-way female connecting terminal in which the equipment-side lead inserting portion of the IC and the male terminal inserting portion of the equipment-side connector are provided alternately is incorporated.

摘要翻译： 提供了一种在没有通信控制IC在壳体结合为特征的通信控制IC结合连接器; 雄性到设备侧的IC的设备侧引线连接到设备侧连接器的端子连接部在其内部设置在所述壳体的前端侧，和总线布线侧用于连接连接部 IC的到总线布线电路的电线的总线布线侧引出在上壳体的后端侧的内部设置; 及在设备侧连接部，在交替设置在IC的设备侧引线插入部和公端子插入装置侧连接器的部分的双向阴连接端子结合。

公开(公告)号：EP1628333A1

公开(公告)日：2006-02-22

申请号：EP04726294.4

申请日：2004-04-07

申请人： The Furukawa Electric Co.,Ltd.

发明人： ISHIWATA, Shinichi The Furukawa Electric Co.,Ltd. ,  INADA, Masakatsu The Furukawa Electric Co., Ltd.

IPC分类号： H01L21/301 ,  B81C1/00

CPC分类号： B23K26/364 ,  B81C1/00619

摘要： A method of manufacturing a thin-film circuit substrate, containing:

(a) gouging a surface of a circuit substrate in a depth at least approximately equal to a thickness of a final product of the substrate, to form a section to be formed a penetrating section;
(b) providing a protecting adhesive tape to adhere to the gouged surface of the substrate, before a backing surface of the substrate is ground;
(c) grinding the backing surface in such a thickness that the gouged section would not penetrate;
(d) dry etching entirely the backing surface, while the tape adheres to the substrate, after completion of the grinding for the backing surface; and
(e) making the gouged section of the substrate to penetrate, by the dry etching, thereby forming the penetrating structure section; and,
a protecting adhesive tape usable in the method.

公开(公告)号：EP1603206A2

公开(公告)日：2005-12-07

申请号：EP05108306.1

申请日：2000-02-03

申请人： THE FURUKAWA ELECTRIC CO., LTD.

发明人： YOSHIDA, Junji ,  TSUKIJI, Naoki ,  IKETANI, Akira ,  KIMURA, Naoki ,  NIEKAWA, Jun ,  KIMURA, Toshio ,  AIKIYO, Takeshi

IPC分类号： H01S5/10 ,  H01S5/028 ,  H01S5/024

CPC分类号： H01S5/34 ,  B82Y20/00 ,  H01S5/02216 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/02492 ,  H01S5/028 ,  H01S5/1039 ,  H01S5/146 ,  H01S5/3403

摘要： In the semiconductor laser device of the present invention, a semiconductor stacked structure including an active layer comprising a strained multi-quantum well structure is formed on a substrate 1, a cavity length is larger than 1000 µm but equal to or smaller than 1800 µm, and a low-reflection film S 1 having a reflectance of 3% or less is formed on one facet and a high-reflection film S 2 having a reflectance of 90% or more is formed on the other facet. The semiconductor laser module has a structure in which the semiconductor laser device is set to a cooling device constituted by electrically alternately arranging 40 pairs or more of the Peltier elements and holding them by top and bottom ceramic plates and sealed in the package. A grating having a reflection bandwidth of 1.5 nm or less is formed on an optical fiber to be built in.

摘要翻译： 在本发明的半导体激光装置中，在基板1上形成包括应变多量子阱结构的有源层的半导体层叠结构，空洞长度大于1000μm但为1800μm以下， 并且在一个面上形成反射率为3％以下的低反射膜S1，并且在另一个面上形成反射率为90％以上的高反射膜S 2。 半导体激光器模块具有这样的结构，其中半导体激光器件被设置为通过电气交替地布置40对或更多个珀耳帖元件并由顶部和底部陶瓷板保持并且密封在封装中的冷却装置。 在内置的光纤上形成具有1.5nm以下的反射带宽的光栅。

公开(公告)号：EP1603158A1

公开(公告)日：2005-12-07

申请号：EP04717227.5

申请日：2004-03-04

申请人： THE FURUKAWA ELECTRIC CO., LTD.

发明人： SHIRAI, Takehiro, The Furukawa Electric Co., Ltd. ,  IWASE, Masayuki, The Furukawa Electric Co., Ltd.

IPC分类号： H01L23/50

CPC分类号： G02B6/4201 ,  G02B6/3885 ,  G02B6/4277 ,  G02B6/428 ,  G02B6/4292 ,  H01L23/24 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/056 ,  H05K3/06 ,  H05K3/44 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09754 ,  H05K2201/10121 ,  H05K2203/0323 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A printed wiring board (10) includes a plurality of conductor plates (10a) spaced apart from one another including at least one conductor plate that is used as a lead for electrical connection with an external circuit; an insulating layer (10b) formed on or astride the conductor plates or on and astride the conductor plates; and a plurality of wiring patterns (10d) formed on the insulating layer. At least one of the conductor plates is electrically connected with at least one of the wiring patterns via a via-hole (11a), a method of manufacturing the printed wiring board, and a lead frame package and an optical module that use the printed wiring board.

摘要翻译： 印刷电路板（10）包括彼此间隔开的多个导体板（10a），包括至少一个用作与外部电路电连接的引线的导体板; 绝缘层（10b），其形成在导体板上或跨越导体板上或跨越导体板; 以及形成在所述绝缘层上的多个布线图案（10d）。 导体板中的至少一个通过通孔（11a）至少一个布线图案，制造印刷线路板的方法和引线框架封装以及使用印刷布线的光学模块电连接 板。

公开(公告)号：EP1602518A2

公开(公告)日：2005-12-07

申请号：EP05300368.7

申请日：2005-05-11

申请人： THE FURUKAWA ELECTRIC CO., LTD.

发明人： Aoki, Takanori ,  Kanbayashi, Hirokazu ,  Kawazoe, Toshihiro ,  Kusano, Kazuyuki ,  Yanagimoto, Hironori

IPC分类号： B60J5/06 ,  E05F15/14 ,  H02G11/02

CPC分类号： B60R16/0215 ,  B60R16/027 ,  E05D11/0081 ,  E05F15/632 ,  E05F2015/447 ,  E05Y2400/654 ,  E05Y2800/342 ,  E05Y2800/344 ,  E05Y2900/531 ,  F16L3/015 ,  H02G3/0468 ,  H02G11/006

摘要： A power supply device for a sliding door (12) comprising an extra-length absorbing unit (14), a door side fixing unit (16) fixed to a sliding door, a flexible tube (18) extending from said extra-length absorbing unit (14) to said door side fixing unit (16), and a wire harness (20) wired from a vehicle body (10) through said extra-length absorbing unit (14), said flexible tube (18) and said door side fixing unit (16) to the sliding door (12),
wherein said extra-length absorbing unit (14) includes a case (30) having a gate (28) for said flexible tube, a rotating drum (32) for winding said flexible tube in the case, and a torsion spring (34) for providing a turning force with said rotating drum in a winding direction of said flexible tube.

摘要翻译： 一种用于滑动门（12）的电源装置，包括超长吸收单元（14），固定到滑动门的门侧固定单元（16），从所述超长吸收单元延伸的柔性管（18） （14）到所述门侧固定单元（16），以及从车体（10）穿过所述超长吸收单元（14）布线的线束（20），所述柔性管（18）和所述门侧固定 单元（16）到所述滑动门（12），其中所述超长吸收单元（14）包括具有用于所述柔性管的门（28）的壳体（30），用于将所述柔性管 以及用于在所述柔性管的卷绕方向上与所述旋转滚筒一起提供转动力的扭转弹簧（34）。