公开(公告)号：EP3227975A1

公开(公告)日：2017-10-11

申请号：EP15790997.9

申请日：2015-11-09

Applicant: Phoenix Contact GmbH & Co. KG

Inventor： SCHAPER, Elmar ,  SCHOPPE, Mathias

IPC: H01R31/06 ,  H05K1/11 ,  H01R9/26

CPC classification number: H01R31/06 ,  H01R9/26 ,  H05K1/0245 ,  H05K1/117 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/09172

Abstract: The present invention relates to a connecting adapter (100) for a connecting terminal assembly, the connecting terminal assembly having a number of electrical connecting terminals. The connecting adapter comprises: a printed circuit board (101) with a comb-type conducting structure having a number of comb teeth (103), each comb tooth (103) having an electrical contact surface (105); and an electrical plug connector interface (107) for a plug connector, said electrical plug connector interface (107) having electrical terminals (109) which are electrically connected to the electrical contact surfaces (105) of the comb teeth (103). The electrical plug connector interface (107) is arranged on the printed circuit board (101).

Abstract translation: 本发明涉及一种用于连接端子组件的连接适配器（100），该连接端子组件具有多个电连接端子。 所述连接适配器包括：具有梳状导电结构的印刷电路板（101），所述梳状导电结构具有多个梳齿（103），每个梳齿（103）具有电接触表面（105）; 和用于插头连接器的电插头连接器接口（107），所述电插头连接器接口（107）具有电连接到梳齿（103）的电接触表面（105）的电端子（109）。 电插头连接器接口（107）布置在印刷电路板（101）上。

公开(公告)号：EP2503652B1

公开(公告)日：2017-02-22

申请号：EP10831396.6

申请日：2010-09-28

Applicant: Japan Aviation Electronics Industry, Limited

Inventor： KUDO Takaaki ,  SHIMOJI Kenichi

IPC: H01R12/57 ,  H01R12/71 ,  H01R13/41

CPC classification number: H01R12/57 ,  F21K9/00 ,  F21V3/00 ,  F21V19/0055 ,  F21V23/06 ,  F21Y2115/10 ,  H01R12/716 ,  H01R12/75 ,  H01R13/41 ,  H01R13/73 ,  H05K1/117 ,  H05K3/325 ,  H05K2201/09063 ,  H05K2201/09172 ,  H05K2201/10446

公开(公告)号：EP2738798A1

公开(公告)日：2014-06-04

申请号：EP12817380.4

申请日：2012-07-20

Applicant: Kyocera Corporation

Inventor： TSUJINO, Mahiro ,  MIYAHARA, Manabu

IPC: H01L23/04

CPC classification number: H01L24/42 ,  H01L23/057 ,  H01L23/10 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/171 ,  H05K3/3442 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/09409 ,  H05K2201/09909 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor device housing package(1) includes a base body (5) having, on its upper surface, a mounting region for placement of a semiconductor device (3); a frame body (7) having a frame-like portion disposed on the upper surface of the base body (5) so as to surround the mounting region, and an opening penetrating through from an inner side of the frame-like portion to an outer side thereof; a flat plate-like insulating member (9) disposed in the opening so as to extend from an interior of the frame body (7) to an exterior thereof; wiring conductors (11) disposed on an upper surface of the insulating member (9) so as to extend from the interior of the frame body (7) to the exterior thereof; and a continuous metallic film (35) disposed on a part of the upper surface of the insulating member (9), the metallic film (35) lying outside the frame body (7) so as to surround the wiring conductors (11).

公开(公告)号：EP1909545B1

公开(公告)日：2014-06-04

申请号：EP07117064.1

申请日：2007-09-24

Applicant: Deere & Company

Inventor： Livdahl, Richard J ,  Hawk, Nathan M ,  Johnston, Travis L ,  Segal, Vincent G ,  Wyland, Amanda R ,  Janssen, Dale A ,  Duppong, Jeffrey S

IPC: H05K3/30 ,  H05K7/14

CPC classification number: H05K3/366 ,  H05K3/301 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/10598 ,  H05K2201/10606

公开(公告)号：EP2560242A4

公开(公告)日：2014-03-05

申请号：EP11768859

申请日：2011-04-12

Applicant: YAZAKI CORP

Inventor： TAKAMURA NAOKI ,  KUROSAWA TOHRU

IPC: H01R12/72 ,  H01L27/14 ,  H01L27/146 ,  H01L27/148 ,  H01R12/71 ,  H01R12/77 ,  H01R13/05 ,  H04N5/225

CPC classification number: H05K5/0026 ,  G03B17/02 ,  H01L27/14618 ,  H01L27/14806 ,  H01L2924/0002 ,  H01R12/51 ,  H01R12/721 ,  H01R13/05 ,  H01R2201/26 ,  H04N5/2253 ,  H04N5/2257 ,  H05K1/117 ,  H05K2201/0311 ,  H05K2201/09172 ,  H01L2924/00

公开(公告)号：EP2436241B1

公开(公告)日：2013-04-24

申请号：EP10734779.1

申请日：2010-05-19

Applicant: KRS SA

Inventor： PETIT, Jacques

IPC: H05K1/14 ,  H05K7/16 ,  G09F9/33 ,  F21S2/00 ,  F21V19/00 ,  H01R35/04

CPC classification number: H01R35/04 ,  H01R12/52 ,  H01R12/721 ,  H05K1/148 ,  H05K2201/09172 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/1034

公开(公告)号：EP2503652A1

公开(公告)日：2012-09-26

申请号：EP10831396.6

申请日：2010-09-28

Applicant: Japan Aviation Electronics Industry, Limited

Inventor： KUDO Takaaki ,  SHIMOJI Kenichi

IPC: H01R24/00

CPC classification number: H01R12/57 ,  F21K9/00 ,  F21V3/00 ,  F21V19/0055 ,  F21V23/06 ,  F21Y2115/10 ,  H01R12/716 ,  H01R12/75 ,  H01R13/41 ,  H01R13/73 ,  H05K1/117 ,  H05K3/325 ,  H05K2201/09063 ,  H05K2201/09172 ,  H05K2201/10446

Abstract: To reduce a connector in a dimension in a fitting direction.
Contacts 11 each include a holding portion 111 which is inserted from an inserting direction orthogonal to a connector fitting direction and is held by a housing 12, a contact portion 112 which is continuous with the holding portion 111 and extends in the connector fitting direction, and a connection portion 113 which is continuous with the holding portion 111 and is connected to an LED mounting substrate. The housing 12 includes a housing main body 121 which is inserted in a hole formed in the LED mounting substrate, and a top board portion 122 formed on the housing main body 121. The housing main body 121 is formed with connector receiving portions 121a and 121b which accommodate the contact portions 112 and receive a cable connector. The top board portion 122 is formed with contact accommodating portions 122a which communicate with the connector receiving portions 121a and 121b and accommodate the holding portions 111. The housing main body 121 is formed with slots 121c via which the contacts 11 are inserted into the connector receiving portions 121a and 121b and the contact accommodating portions 122a from inserting directions orthogonal to the connector fitting direction.

Abstract translation: 为了减小连接器在一个方向上的尺寸。 触点11包括：保持部111，其从与插接方向正交的插入方向插入并由壳体12保持;与保持部111连续并沿连接器配合方向延伸的接触部112; 与保持部111连续并连接到LED安装基板的连接部113。 壳体12包括插入到形成在LED安装基板上的孔的壳体主体121和形成在壳体主体121上的顶板部122.壳体主体121形成有连接器容纳部121a和121b 其容纳接触部分112并接收电缆连接器。 顶板部分122形成有与连接器接收部分121a和121b连通并容纳保持部分111的触点容纳部分122a。壳体主体121形成有狭槽121c，触点11通过插槽121c插入到连接器接收部分 部分121a和121b以及接触容纳部分122a的插入方向与插接方向正交。

公开(公告)号：EP2497163A1

公开(公告)日：2012-09-12

申请号：EP10773787.6

申请日：2010-10-25

Applicant: Panduit Corp.

Inventor： STRAKA, Frank, M. ,  TELLAS, Ronald, L.

IPC: H01R24/00

CPC classification number: H01R13/6466 ,  H01R4/2425 ,  H01R13/6625 ,  H01R13/6658 ,  H01R24/64 ,  H05K1/0228 ,  H05K1/118 ,  H05K1/147 ,  H05K1/162 ,  H05K2201/09172 ,  H05K2201/09672 ,  H05K2201/10189 ,  Y10S439/941

Abstract: A communication Jack has a housing with a face having a plug receiving aperture. A conductive path pairs extends from corresponding plug interface contacts located at the plug receiving aperture to corresponding output terminate. A first circuit board is connected to the plug interface contacts and a second circuit board is connected to the plug Interface contacts and the output terminals. The first circuit board has a first single stage of crosstalk compensation with opposite polarity of the crosstalk of a plug for a first combination of the conductive path pairs. The second circuit board includes a second single stage of opposite polarity crosstalk compensation for some of the conductive path pairs not compensated on the first circuit board. The stages cancel substantially ail of the crosstalk caused by the plug, for the signal operating frequencies, for corresponding combinations of the conductive path pairs.

公开(公告)号：EP1770832B1

公开(公告)日：2009-12-02

申请号：EP05021514.4

申请日：2005-09-30

Applicant: 3M Innovative Properties Company

Inventor： Bonvallat, Pierre ,  Koruschowitz, Axel ,  Metral, Guy ,  Perrier, Gaetan

IPC: H01R13/66

CPC classification number: H05K1/144 ,  H01R13/6658 ,  H01R24/62 ,  H01R2107/00 ,  H05K1/0254 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/09172

公开(公告)号：EP1837963A2

公开(公告)日：2007-09-26

申请号：EP06023250.1

申请日：2006-11-08

Applicant: Emcore Corporation

Inventor： Miao, Rongsheng ,  Kha, Nghia (Leo) ,  Olson, Todd

IPC: H01S5/022

CPC classification number: H05K1/147 ,  G02B6/4201 ,  G02B6/4269 ,  G02B6/4274 ,  G02B6/4281 ,  G02B6/4283 ,  H05K1/141 ,  H05K1/189 ,  H05K3/3447 ,  H05K2201/049 ,  H05K2201/09172 ,  H05K2201/10121

Abstract: The present invention discloses an adaptor suitable for use in optoelectronic circuit board. The adaptor according the present invention serves to adapt a package pin-out arrangement to a desired pin-out arrangement on a printed circuit board. The adaptor comprises a pin-in arrangement that electrically couples with the package pin-out arrangement. The adaptor further comprises an adaptor pin-out arrangement that is geometrically identical to the desired pin-out, and a flex-circuit that provides a plurality of electrical paths to connect the pin-in arrangement with the adaptor pin-out arrangement. In various embodiments, the adaptor further comprises a clamshell for holding the adaptor pin-out and the flex-circuit together in a single flat format.

Abstract translation: 本发明公开了一种适用于光电子电路板的适配器。 根据本发明的适配器用于使封装引脚布置适应于印刷电路板上的期望的引脚布置。 适配器包括与封装引脚布置电耦合的引脚布置。 适配器还包括几何地与期望的引脚输出相同的适配器引出布置，以及提供多个电路径以将引脚布置与适配器引脚布置连接的柔性电路。 在各种实施例中，适配器还包括用于将适配器引出端和柔性电路保持在一起的单个平面格式的蛤壳。