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公开(公告)号：EP2290128B1
公开(公告)日：2013-10-02
申请号：EP10173802.9
申请日：2010-08-24
IPC分类号： C23C18/14 , C23C18/16 , C25D5/12 , C25D5/50 , C25D7/12 , C23C18/32 , H01L21/288 , H01L21/285 , H01L21/768
CPC分类号： C25D5/12 , C23C18/1605 , C23C18/1642 , C23C18/1653 , C23C18/1667 , C23C18/1692 , C23C18/32 , C25D5/50 , C25D7/126 , H01L21/28518 , H01L21/288 , H01L21/76889 , H01L31/022425
摘要： Silicon containing substrates are coated with nickel. The nickel is coated with a protective layer and the combination is heated to a sufficient temperature to form nickel silicide. The nickel silicide formation may be performed in oxygen containing environments.
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公开(公告)号：EP2017373A3
公开(公告)日：2013-09-11
申请号：EP08160839.0
申请日：2008-07-21
IPC分类号： C25D3/50
摘要： A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.
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公开(公告)号：EP2332960A3
公开(公告)日：2013-08-28
申请号：EP10194457.7
申请日：2010-12-10
发明人： Aqad, Emad , Li, Mingqi , Mattia, Joseph
IPC分类号： C07J9/00 , C07C381/12 , C07J31/00 , G03F7/004 , G03F7/038
CPC分类号： G03F7/0045 , C07C381/12 , C07J31/006 , G03F7/0046 , G03F7/0382
摘要： New photoacid generator compounds ("PAGs") are provided that comprise a cholate moiety and photoresist compositions that comprise such PAG compounds.
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74.发明公开Improved flux method for tin and tin alloys 有权Verbessertes FlussverfahrenfürZinn und Zinnlegierungen
公开(公告)号：EP2617859A1
公开(公告)日：2013-07-24
申请号：EP13151765.8
申请日：2013-01-18
发明人： LEVEY, Peter R.
CPC分类号： C25D9/02 , B23K1/203 , B23K35/0233 , B23K35/262 , B23K35/3618 , B23K35/362 , C23C2/08 , C23C2/26 , C23C2/30 , C25D3/32 , C25D3/60 , C25D5/505
摘要： A flux composition which includes one or more organic compounds including one or more sulfonic acid groups, salts or anhydrides thereof is applied to tin or tin alloy deposits. The flux composition is then homogenized on the tin or tin alloy to inhibit tin or tin alloy oxidation and improve brightness of the tin or tin alloy.
摘要翻译： 将包含一种或多种包含一种或多种磺酸基团的有机化合物，其盐或酸酐的助熔剂组合物施用于锡或锡合金沉积物。 然后将助焊剂组合物在锡或锡合金上匀化以抑制锡或锡合金氧化并改善锡或锡合金的亮度。
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公开(公告)号：EP2565297A2
公开(公告)日：2013-03-06
申请号：EP12180894.3
申请日：2012-08-17
IPC分类号： C25D3/60
摘要： White bronze is electroplated from a cyanide-free tin/copper bath onto a void inhibiting layer coating a copper underlayer. The void inhibiting metal layer includes one or more void inhibiting metals.
摘要翻译： 白青铜从不含氰化物的锡/铜浴电镀到涂覆铜底层的空隙抑制层上。 空洞抑制金属层包括一种或多种空洞抑制金属。
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公开(公告)号：EP2444527A3
公开(公告)日：2013-02-27
申请号：EP11185970.8
申请日：2011-10-20
发明人： Hayashi, Shinjiro , Sakai, Makoto
摘要： To provide a tin plating solution having uniformity of through-hole plating, uniformity of film thickness distribution and no burn deposits even. The tin plating solution include a tin ion source, at least one non-ionic surfactant, imidazoline dicarboxylate and 1,10-phenanthroline.
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公开(公告)号：EP2559486A1
公开(公告)日：2013-02-20
申请号：EP12180782.0
申请日：2012-08-17
发明人： Liu, Feng , Rzeznik, Maria Anna
CPC分类号： C23C18/1803 , B01J23/40 , B01J23/48 , B01J23/50 , B01J23/70 , B01J31/061 , B01J31/28 , B01J35/0013 , B01J37/16 , B01J2531/0272 , B01J2531/17 , C23C18/1633 , C23C18/2086 , C23C18/30 , C23C18/31 , C23C18/32 , C23C18/38
摘要： Catalysts include nanoparticles of catalytic metal and cellulose or cellulose derivatives. The catalysts are used in electroless metal plating. The catalysts are free of tin.
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78.发明公开High temperature resistant silver coated substrates 有权Hochtemperaturenbeständigesilberbeschichtete基材
公开(公告)号：EP2551382A1
公开(公告)日：2013-01-30
申请号：EP12177759.3
申请日：2012-07-25
CPC分类号： C25D3/12 , B32B15/018 , C22C5/06 , C22C9/04 , C23C18/1644 , C23C18/1651 , C23C18/1653 , C23C18/1671 , C23C18/34 , C23C18/36 , C23C18/48 , C23C18/52 , C23C28/023 , C25D3/30 , C25D3/32 , C25D3/46 , C25D3/562 , C25D3/60 , C25D5/12 , Y10T428/12715
摘要： A thin film of tin is plated directly on nickel coating a metal substrate followed by plating silver directly on the thin film of tin. The silver has good adhesion to the substrate even at high temperatures.
摘要翻译： 将锡的薄膜直接镀在镀镍的金属基底上，然后将银直接镀在锡的薄膜上。 即使在高温下，银对基材也具有良好的附着力。
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公开(公告)号：EP1788011B1
公开(公告)日：2013-01-09
申请号：EP06255807.7
申请日：2006-11-13
IPC分类号： C08G77/14 , G02B6/00 , C08K5/5415 , C09D183/06 , G02B1/04 , C08J5/18
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80.发明公开Topcoat compositions for photoresist and immersion photolithography process using them 有权用于光致抗蚀剂和方法Immersionsfotolithografisches顶涂层组合物使用相同的
公开(公告)号：EP2511766A1
公开(公告)日：2012-10-17
申请号：EP12163989.2
申请日：2012-04-12
发明人： Wang, Deyan
CPC分类号： G03F7/11 , G03F7/0046 , G03F7/2041
摘要： Topcoat layer compositions are provided that are applied above a photoresist composition. The compositions find particular applicability to immersion lithography processing.
摘要翻译： 设置面漆层的组合物没有被上方的光致抗蚀剂组合物中的应用。 该组合物将特别适用于浸没式光刻处理。
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