摘要:
A suction unit 10 includes a main body portion having a first surface 13 on which a semiconductor wafer W formed with a semiconductor device D is arranged and a second surface 14 that is a surface opposite to the first surface 13, and in which a through-hole 15 that penetrates through the first surface 13 and the second surface 14 is formed and a light transmitting portion having a light incident surface 16 onto which light from the semiconductor device D is made incident and a light emitting surface 17 from which light made incident from the light incident surface 16 is emitted, and which is fitted to the through-hole 15. Further, in the first surface 13, a first suction groove 13a for vacuum sucking the semiconductor wafer W to fix the semiconductor device D to the light incident surface 16 is formed, and in the second surface 14, a second suction groove 14a for vacuum sucking the solid immersion lens S to fix the solid immersion lens S to the light emitting surface 17 is formed.
摘要:
Provided is a doped quartz glass member for plasma etching, which is used in a plasma etching process and is free from any problematic fluoride accumulation during use. The quartz glass member for plasma etching is used as a jig for semiconductor production in a plasma etching process, and includes at least two or more kinds of metal elements in a total amount of 0.01 wt% or more to less than 0.1 wt%, in which the metal elements are formed of at least one kind of a first metal element selected from metal elements belonging to Group 3B of the periodic table and at least one kind of a second metal element selected from the group consisting of Mg, Ca, Sr, Ba, Sc, Y, Ti, Zr, Hf, lanthanoids, and actinoids.
摘要:
A sample holder includes a substrate composed of ceramics, having a sample holding surface provided in an upper face thereof; a supporting member composed of metal, an upper face of the supporting member covering a lower face of the substrate; and a joining layer composed of indium or an indium alloy, the substrate and the supporting member being joined to each other via the joining layer. The joining layer has a layer region in at least one of a joining surface to the substrate and a joining surface to the supporting member, a content percentage of indium oxides of the layer region being higher than that of an intermediate region in a thickness direction of the joining layer.
摘要:
Embodiments of apparatus for supporting a substrate are disclosed herein. In some embodiments, an apparatus for supporting a substrate includes: a support surface; and a plurality of substrate contact elements protruding from the support surface, wherein the plurality of substrate contact elements are formed of a material having a hardness less than or equal to a hardness of silicon, having a low adhesion, having a coefficient of static friction large enough to prevent sliding, having a surface roughness less than or equal to 10 Ra, and that is electrically conductive.
摘要:
A sample holder includes a substrate composed of ceramics, having a sample holding surface provided in an upper face thereof; a supporting member composed of metal, an upper face of the supporting member covering a lower face of the substrate; and a joining layer composed of indium or an indium alloy, the substrate and the supporting member being joined to each other via the joining layer. The joining layer has a layer region in at least one of a joining surface to the substrate and a joining surface to the supporting member, a content percentage of indium oxides of the layer region being higher than that of an intermediate region in a thickness direction of the joining layer.
摘要:
The present invention is related to a substrate holder for vertical galvanic metal, preferably copper, deposition on a substrate to be treated comprising a first substrate holder part and a second substrate holder part, wherein both substrate holder parts comprise an inner metal comprising part and an outer non-metallic part characterized in that the substrate holder further comprises i) At least one hanging element in each substrate holder part for mechanically connecting the substrate holder to a treatment container, ii) At least one first sealing element in each substrate holder part arranged between the substrate to be treated and the respective substrate holder part, iii) At least one single second sealing element for the entire substrate holder arranged between the inner metal comprising part of the substrate holder and the outer non-metallic part of the substrate holder, iv) At least one fastening system for detachably fastening both substrate holder parts to each other for holding the substrate to be treated, v) At least one first contact element in each substrate holder part for forwarding current from an outer source through the hanging element to the at least second contact element, and vi) At least one second contact element in each substrate holder part for forwarding current from the at least first contact element to the substrate to be treated.
摘要:
A sample holder includes a substrate composed of ceramics, having a sample holding surface provided in an upper face thereof; a supporting member composed of metal, an upper face of the supporting member covering a lower face of the substrate; and a joining layer composed of indium or an indium alloy, the substrate and the supporting member being joined to each other via the joining layer. The joining layer has a layer region in at least one of a joining surface to the substrate and a joining surface to the supporting member, a content percentage of indium oxides of the layer region being higher than that of an intermediate region in a thickness direction of the joining layer.
摘要:
A placement member (1) in accordance with an embodiment of the present invention includes a base (4) having a placement section (3) on which an object (2) is placed, and a coating film (5) that coats at least a part of the placement section (3). The placement section (3) has a bottom face (8), a plurality of projections (9) projecting from the bottom face (8), and an annular protrusion (10) that protrudes from the bottom face (8) at the same height as the plurality of projections (9) and surrounds the plurality of projections (9). The coating film (5) has a first region (15) that coats top faces (11) of the projections (9) and a second region (16) that coats a top face (13) of the annular protrusion (10) and has a smaller thickness than that of the first region (15).
摘要:
A method of dispersing semiconductor chips from a wafer of semiconductor chips onto a substrate while preserving the neighboring relationship of each chip to each adjacent chip is disclosed. The method includes dispersing the wafer into sequential columns of semiconductor chips with a first pitch between columns while preserving the neighboring relationship and sequentially dispersing the columns of semiconductor chips into rows of individual chips with a second pitch between rows onto a substrate while preserving the neighboring relationship.
摘要:
Improved durability and longevity of spin chucks is achieved by using a composite support pin structure in which a pin body of a chemically inert plastic includes a hollow cavity containing an insert formed from a material whose Young's modulus is greater than that of the inert plastic.