公开(公告)号：EP0228212A3

公开(公告)日：1989-09-27

申请号：EP86309619.4

申请日：1986-12-10

Applicant: HITACHI, LTD.

Inventor： Funamoto, Takao ,  Katou, Mituo ,  Kajiwara, Ryoichi ,  Matsuzaka, Takeshi ,  Shida, Tomohiko ,  Takahashi, Kazuya ,  Wachi, Hiroshi ,  Watanabe, Masatoshi ,  Yamada, Minoru ,  Sugawara, Katuo ,  Nakanishi, Keiichirou

IPC: H05K7/20 ,  H01L23/46 ,  H01L23/52 ,  H01L23/42

CPC classification number: H05K1/0373 ,  H01L23/473 ,  H01L23/5383 ,  H01L23/5385 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/064 ,  H01L2924/00

Abstract: An integrated circuit device has a wiring substrate (2) on one surface of which integrated circuit chips (l) are mounted. A power source substrate (5) of a laminated structure is in contact with the opposite surface of the wiring substrate (2), the power source substrate being of alternate laminations of conductor layers (7) of a heat conductive metal and insulating layers (6) of an elec­trically insulating material, which layers are bonded together. Means such as pins (4) electrically connect the wiring substrate and the power source substrate to each other, and hence connect the chips (l) to the conductive layers (7), a heat radiating means is provided in at least one of either or both of the conductor layers (7) and the insulating layers (6) and radiates heat, which occurs in the power source substrate (5), to the exterior of the device. Such an integrated circuit device has a power source substrate (5) of a remarkably high heat radiating effici­ency, and may permit a high density of integrated circuit chips (l) on the wiring substrate (2).

公开(公告)号：EP3410478A1

公开(公告)日：2018-12-05

申请号：EP17173262.1

申请日：2017-05-29

Applicant: Mitsubishi Electric R & D Centre Europe B.V. ,  Mitsubishi Electric Corporation

Inventor： MRAD, Roberto ,  MOLLOV, Stefan

IPC: H01L25/07 ,  H01L23/427 ,  H01L21/48

CPC classification number: H01L25/071 ,  H01L21/4882 ,  H01L23/427 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/185 ,  H05K2201/064 ,  H05K2201/10166 ,  H05K2203/0723

Abstract: The present invention concerns a power module composed of a first and second parts (100a, 100b), the first part being composed of conductor layers and insulation layers, characterized in that a first conductor layer is on bottom of the first part, the second part is composed of at least one second conductor layer, the first and/or the second conductor layers comprise cavities that form pipes (300a, 300b) when the first and second conductor layers are in contact, and in that the first and the second conductor layers are bonded together by a metal plating (400a, 400g) of the walls of the pipes.

公开(公告)号：EP3367769A1

公开(公告)日：2018-08-29

申请号：EP18155720.8

申请日：2018-02-08

Applicant: Krohne Messtechnik GmbH

Inventor： Brockhaus, Helmut ,  Erkelenz, Alexander ,  Matt, Achim

IPC: H05K7/20

CPC classification number: H05K1/0203 ,  H05K7/1422 ,  H05K7/202 ,  H05K2201/064

Abstract: Beschrieben und dargestellt ist eine Vorrichtung (1) zur Aufnahme einer Elektronik (2) umfassend ein geschlossenes Gehäuse (3) mit einer Gehäusewand (4), wenigstens ein Elektronikbauteil (2), eine Halterung (5) und einen Lüfter (6) mit einem Lüftergehäuse (7), wobei das Elektronikbauteil (2), die Halterung (5) und der Lüfter (6) innerhalb des Gehäuses (3) angeordnet sind und wobei der Lüfter (6) in der Halterung (5) angeordnet ist. Die Aufgabe eine Vorrichtung zur Aufnahme einer Elektronik anzugeben, die eine alternative Kühlung der Elektronik in einem geschlossenen Gehäuse ermöglicht, ist dadurch gelöst, dass der Lüfter (6) als Ventilator (6) ausgestaltet ist und dass der Lüfter (6) im Betrieb einen kontinuierlichen Luftstrom zur Kühlung der Elektronik (2) erzeugt.

公开(公告)号：EP3363272A1

公开(公告)日：2018-08-22

申请号：EP16790783.1

申请日：2016-10-12

Applicant: Google LLC

Inventor： COOPER, James ,  LILJE, Joshua Norman

IPC: H05K9/00 ,  H01L23/552 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373

CPC classification number: H05K1/0203 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/373 ,  H01L23/427 ,  H01L23/552 ,  H05K1/0209 ,  H05K1/0216 ,  H05K1/111 ,  H05K1/181 ,  H05K3/303 ,  H05K3/321 ,  H05K2201/0323 ,  H05K2201/064 ,  H05K2201/0707 ,  H05K2201/10371 ,  H05K2201/2018

Abstract: An electronic device includes a printed circuit board (PCB), the PCB including at least one grounding pad, an integrated circuit mounted on the PCB; an electrically-conductive frame mounted on the PCB and surrounding the integrated circuit, the frame being electrically connected to the at least one grounding pad, and a flexible electrically-conductive, high-thermal-conductivity heat spreader in electrical contact with the frame and in thermal contact with the integrated circuit. The frame, the heat spreader, and the at least one grounding pad form an EMI shield that reduces EMI leakage from the integrated circuit outside a volume defined by the frame, the heat spreader, and the at least one grounding pad.

公开(公告)号：EP3353824A1

公开(公告)日：2018-08-01

申请号：EP16766262.6

申请日：2016-09-07

Applicant: Siemens Aktiengesellschaft

Inventor： FRANKE, Martin ,  FRÜHAUF, Peter ,  KNOFE, Rüdiger ,  MÜLLER, Bernd ,  NERRETER, Stefan ,  NIEDERMAYER, Michael ,  WITTREICH, Ulrich ,  ZÄSKE, Manfred

IPC: H01L35/28 ,  H01L23/38 ,  H01L23/467

CPC classification number: H01L35/30 ,  F04D25/06 ,  F04D33/00 ,  H01L23/38 ,  H01L23/467 ,  H01L35/28 ,  H02H5/04 ,  H05K1/0203 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/10037 ,  H05K2201/10151 ,  H05K2201/10219

Abstract: The invention relates to a cooling arrangement for an electronic component (11) or an electrical assembly having such a cooling arrangement. Said cooling arrangement has a passive heat sink (13) for cooling an electrical device (11). According to the invention, there is additionally provision for transducers (14), e.g. thermoelectric generators, to cause an additional cooling effect by dissipating heat from the electronic device (11) and at the same time to allow the generation of power. This can be used, by way of example, to drive an active cooling apparatus (23), such as a piezo fan (38), which additionally caters for cooling the heat sink (13) and hence improves the cooling effect. The overall system is self-sufficient in terms of energy, since the requisite power supply is obtained from the waste heat from the electronic device (11). Advantageously, the power obtained can also be made available to other functional elements. The added costs of the additional cooling are therefore compensated for by saving on an energy source.

公开(公告)号：EP3302006A1

公开(公告)日：2018-04-04

申请号：EP16191722.4

申请日：2016-09-30

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Silvano De Sousa, Jonathan ,  Reitmaier, Bernhard ,  Schlaffer, Erich ,  Stahr, Johannes ,  Schrittwieser, Wolfgang ,  Weidinger, Gerald ,  Kasper, Alexander ,  Grober, Gernot

IPC: H05K1/02

CPC classification number: H01L23/427 ,  F21V29/51 ,  F28D15/0275 ,  F28D20/023 ,  F28F3/086 ,  H01L21/673 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0272 ,  H05K2201/064

Abstract: The invention refers to a component carrier (1) comprising at least one heat pipe (20), wherein the at least one heat pipe (20) has at least a largely cylindrical heat pipe section (25) with a largely cylindrical profile (26) with an outer diameter (27). The at least one heat pipe (20) is embedded within a recess (50) of at least one inner layer (10, 12, 13, 14, 19) or is surface-mounted on an outer layer (10, 15) of said component carrier (1), wherein at least the largely cylindrical heat pipe section (25) of the heat pipe (20) is thermoconductively coupled by means of at least one adapter means (30, 130, 230, 330) that directly contacts the heat pipe (20) with at least one layer (10, 12, 13, 14, 15, 19) of the component carrier (1). Furthermore the invention refers to several methods for producing said component carrier (1).

Abstract translation: 本发明涉及一种包括至少一个热管（20）的部件载体（1），其中所述至少一个热管（20）具有至少一个基本上圆柱形的热管部分（25），该热管部分具有基本上圆柱形的轮廓（26） 具有外径（27）。 所述至少一个热管（20）嵌入至少一个内层（10,12,13,14,19）的凹部（50）内或者表面安装在所述至少一个内层（10,12,13,14,19）的外层（10,15） 其中至少所述热管（20）的大体上圆柱形的热管部分（25）通过至少一个直接接触热量的适配器装置（30,130,230,330）导热地耦合， （20）与所述部件载体（1）的至少一个层（10,12,13,14,15,19）连接。 此外，本发明涉及用于产生所述分量载波（1）的几种方法。

公开(公告)号：EP2098802B1

公开(公告)日：2017-05-10

申请号：EP09003131.1

申请日：2009-03-04

Applicant: BSH Hausgeräte GmbH

Inventor： Bauer, Franz ,  Englisch, Christian

IPC: H01L23/473 ,  H05K7/20 ,  F24H9/20 ,  H05K1/02

CPC classification number: F24H9/2028 ,  F24D2200/29 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K7/20927 ,  H05K2201/064 ,  H01L2924/00

公开(公告)号：EP2959210B1

公开(公告)日：2016-12-07

申请号：EP14710988.8

申请日：2014-02-24

Applicant: Philips Lighting Holding B.V.

Inventor： SWEEGERS, Norbertus Antonius Maria ,  DE SAMBER, Marc Andre

IPC: F21K99/00 ,  H05K1/02 ,  F21V29/58 ,  F21Y115/10 ,  F21Y111/00 ,  F21Y113/00

CPC classification number: F21V21/14 ,  C02F1/325 ,  F21K9/90 ,  F21V29/58 ,  F21Y2107/00 ,  F21Y2113/13 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/028 ,  H05K2201/051 ,  H05K2201/064 ,  H05K2201/10106

公开(公告)号：EP2763166A4

公开(公告)日：2016-01-27

申请号：EP12836204

申请日：2012-09-20

Applicant: NHK SPRING CO LTD

Inventor： YAMAUCHI YUICHIRO ,  SAITO SHINJI ,  AKABAYASHI MASARU ,  MORI SHOGO

IPC: H05K1/02 ,  B23P15/26 ,  C23C24/04 ,  F28D15/02 ,  H01L21/48 ,  H01L23/373 ,  H01L23/427 ,  H01L25/07 ,  H01L25/18 ,  H05K1/03 ,  H05K7/20

CPC classification number: F28D15/02 ,  B23P15/26 ,  C23C24/04 ,  F28D15/0233 ,  F28D15/0275 ,  H01L21/4871 ,  H01L23/3735 ,  H01L23/427 ,  H01L25/072 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K1/0272 ,  H05K1/0306 ,  H05K7/20336 ,  H05K2201/064 ,  Y10T29/49353 ,  H01L2924/00

公开(公告)号：EP2959210A1

公开(公告)日：2015-12-30

申请号：EP14710988.8

申请日：2014-02-24

Applicant: Koninklijke Philips N.V.

Inventor： SWEEGERS, Norbertus Antonius Maria ,  DE SAMBER, Marc Andre

IPC: F21K99/00 ,  F21Y111/00 ,  F21V29/00 ,  F21Y113/00 ,  F21Y101/02

CPC classification number: F21V21/14 ,  C02F1/325 ,  F21K9/90 ,  F21V29/58 ,  F21Y2107/00 ,  F21Y2113/13 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/028 ,  H05K2201/051 ,  H05K2201/064 ,  H05K2201/10106

Abstract: A lighting device (30) and a method of manufacturing such a lighting device are provided. The lighting device comprises a sheet assembly (7), which comprises a substrate (1) being at least partly light transmissive, a plurality of light sources (5) coupled to the substrate. At least a portion of the sheet assembly (7) is fixed in a rolled-up arrangement so as to form a roll (12), whereby the light sources (5) in the portion of the sheet assembly (7) are arranged to emit light at least partly inwards in the roll and/or at least partly towards at least one end (31) of the roll. The present invention is advantageous in that it provides enhanced lumen density output, which makes the lighting device useful for high brightness applications, such as head lights and fluid purification.

Abstract translation: 提供照明装置（30）和制造这种照明装置的方法。 照明装置包括片组件（7），其包括至少部分透光的衬底（1），耦合到衬底的多个光源（5）。 片材组件（7）的至少一部分被固定成卷起的布置以形成卷（12），由此片材组件（7）的部分中的光源（5）被布置成发射 在辊中至少部分地向内和/或至少部分地朝向辊的至少一个端部（31）。 本发明的优点在于其提供增强的流明密度输出，这使得照明装置可用于高亮度应用，例如头灯和流体净化。