摘要:
Une ébauche pour circuit électrique multicouches comprend un support plat en matériau isolant qui contient au moins une couche interne (5,6), parallèle aux faces du support et présentant un réseau conducteur continu formé par la répétition à deux dimensions d'un même motif. Ce réseau libère une première grille, de pas constant p, de sites non conducteurs (2) et forme une seconde grille, décalée de pl2 par rapport à la première, de sites dont au moins un par motif (3) est non conducteur et dont les autres (1) appartiennent au réseau conducteur. Ainsi, une connexion peut être effectuée entre la couche interne et un composant porté par le support à l'aide d'un trou métallisé traversant l'un desdits autres sites (1).
摘要:
An electronic device may have control circuitry coupled to input-output devices such as a display. A flexible input-output device may be formed from an elastomeric substrate layer. The substrate layer may have signal paths to which components are mounted. Openings may be formed in the elastomeric substrate layer between the signal paths to create a stretchable mesh-shaped substrate. The electrical components may each include an interposer having solder pads soldered to the elastomeric substrate. Electrical devices such as micro-light-emitting diodes may be soldered to the interposers. The electrical components may also include electrical devices such as sensors and actuators. A stretchable lighting unit may have a stretchable light guide illuminated by a stretchable light source.
摘要:
Die Erfindung betrifft eine Platine (1) für ein elektronisches Steuergerät (7) umfassend eine Mehrzahl elektrischer Schnittstellen, die Schnittstellen umfassend jeweils ein erstes Verbindungselement (2) zum Herstellen einer Mehrzahl elektrischer Kontakte zwischen der Platine (1) und einer Tochterplatine (3), wobei die ersten Verbindungselemente (2) paarweise spiegelsymmetrisch bezüglich von gedachten Spiegelebenen auf der Platine (1) angeordnet sind.
摘要:
Das erfindungsgemässe LED Lichtband (10A; 10B) weist ein eine Längsrichtung (L) definierendes Trägerband (12) mit einer Oberseite (14) und einer Unterseite (16) auf. Das Trägerband (12) ist thermisch leitfähig und mindestens auf der Oberseite (14) elektrisch isolierend. Weiter weist das LED Lichtband (10A; 10B) auf der Oberseite angeordnete Wannen (26) auf, welche auf der vom Trägerband (12) abgewandten Seite offen und reflektierend sind. Mindestens jeweils ein LED Chip (34) ist in den Wannen (26) angeordnet. Das LED Lichtband (10A; 10B) weist weiter elektrische Speiseleiterbahnen (58, 60) und Serienschaltungsleiterbahnen (41) auf, wobei die Serienschaltungsleiterbahnen (41) jeweils eine Anzahl der LED Chips (34) zwischen einer positiven und einer negativen Speiseleiterbahn (58, 60) in Serie schalten, und die Speiseleiterbahnen (58, 60) Speiseleiterbahnanschlüsse (56, 58) aufweisen, die dazu bestimmt sind, eine Verbindung mit einem Speisegerät zu ermöglichen. Weiter weist das LED Lichtband (10A; 10B) ein Leuchtstoffmaterial (44) auf, welches die Wellenlänge des emittierten Lichts der LED Chips (34) verändert und das LED Lichtband (10A; 10B) weist eine transluzente oder transparente Abdeckung (46) auf, welche die LED Chips (34) und das Leuchtstoffmaterial (44) vor äusseren Einflüssen schützt.
摘要:
The invention relates to an intelligent peripheral coupling assembly (IP) which has sub-assemblies on a circuit board comprising at least one conductor path layer, wherein the following are provided: a network coupling sub-assembly group (N) for coupling the peripheral coupling assembly (IP) to at least one - preferably central - control unit (CON) via a data network (DN); and/or a microcontroller sub-assembly group (MUG) for programmed operation of the peripheral coupling assembly (IP); and/or a programmable logic (PL) for connection to one or more peripheral coupling sub-assembly group(s) (PUG) used to establish the coupling to at least one peripheral device (PG) to be controlled and/or to be regulated and/or to be monitored; and, in a peripheral coupling sub-assembly group zone (SG) of the circuit board, a region for the peripheral coupling sub-assembly group(s) (PUG) for coupling to at least one peripheral device (PG) to be controlled and/or to be regulated and/or to be monitored; and at least one connector component (I/O-C) for electrical or optical or wireless connection of the peripheral coupling sub-assembly group(s) (PUG) to the peripheral device(s) (PG). The programmable logic (PL) and/or the microcontroller sub-assembly group (MUG) and/or the network coupling sub-assembly group (N) has or have a zone connection (VZC) for electrical connection via one or more conductor(s) to the peripheral coupling sub-assembly group(s) (PUG) in the peripheral coupling sub-assembly groups zone (SG), and each of the peripheral coupling sub-assembly group(s) (PUG) in the peripheral coupling sub-assembly groups zone (SG) has a connector component connection (VSC) for electrical connection via one or more conductor(s) to one or more pin(s) (P) of the connector component (I/O-C), wherein the peripheral coupling sub-assembly group(s) (PUG) in the peripheral coupling sub-assembly group(s) zone (SG) is or are assigned to a grid (R) having a plurality of grid spaces (RP), wherein there is at least one grid space (RP) in the grid (R) of the peripheral coupling sub-assembly groups zone (SG) which can be wholly or partially occupied by a peripheral coupling sub-assembly group (PUG), to which grid space one or more conductor(s) of the zone connection (VZC) is or are allocated in at least one conductor path layer (L0, L1, L2, L3, L4) of the circuit board designated therefor, by means of which conductor(s) the peripheral coupling sub-assembly group (PUG) can be electrically connected via one or more contact(s) (ZK). Also provided is at least one grid space (RP) in the grid (R) of the peripheral coupling sub-assembly groups zone (SG) which can be wholly or partially occupied by a peripheral coupling sub-assembly group (PUG) to which one or more conductor(s) of the connector component connection (VSC) is or are allocated, in at least one conductor path (L0, L1, L2, L3, L4) of the circuit board designated therefor, by means of which conductor(s) the peripheral coupling sub-assembly group (PUG) can be electrically connected via one or more contact(s) (CK). The invention further relates to a computer-assisted method for configuration of a data network-based system for controlling and/or regulating and/or monitoring at least one peripheral device by means of data transfer between participants of a data network.
摘要:
A pattern forming method ejects droplets of ink onto a base material by an inkjet method. A base material (Z) has a first region (42) and a second region (44) that differ in surface energy. At least two types of ink, a first ink (52a) that has volatile characteristics and a second ink (54a) that has curing characteristics, are used in the ink. The first ink (52a) and the first region (42) are lyophilic, and the second ink (54a) and the second region (44) are lyophilic. The pattern forming method has a droplet ejection step in which the first ink (52a) is ejected to the first region (42) and the second ink (54a) to the second region (44) simultaneously by a multipass system.
摘要:
Electro-optic component comprising a substrate (10) carrying an electrically conductive structure) (20) of an electrically conductive material, said electrically conductive structure (20) being embedded in a barrier structure (30) having a first inorganic layer (32), a second inorganic layer (34) and an organic layer (36) between said inorganic layers, said second inorganic layer and said organic layer being partitioned by the electrically conductive structure into organic layer portions (36a), the electro-optic component further comprising an electro-optic element (40) with a first translucent electrically conductive layer (42), a second electrically conductive layer (44) and an electro-optic layer (46) arranged between the first and the second electrically conductive layer,wherein either the translucent electrically conductive layer is a cathode and the second electrically conductive layer is an anode or the translucent electrically conductive layer is an anode and the second electrically conductive layer is a cathode and wherein the electro-optic component further comprises a protection layer (50) that in combination with the barrier structure encloses the electro-optic element (40), characterized in that the electrically conductive structure comprises an enclosing mesh (24) and at least one electrically conductive element (22a), wherein the at least one electrically conductive element (22a) is arranged in a zone (26a) that is enclosed by the enclosing mesh (24), and wherein the first translucent electrically conductive layer (42) is applied at a surface of the enclosing mesh (24) facing away from the substrate (10), and wherein the second electrically conductive layer (44) physically and electrically contacts the at least one electrically conductive element (22a) at a location laterally beyond the first translucent electrically conductive layer (42) and the electro-optic layer (46).
摘要:
The invention relates to an apparatus (20) for making contact with a direction-dependent electrical and/or electronic component (10) comprising a predefined first number of functions with which contact is to be made, having a main body (21) and a predefined first number of first contact elements (23) which are each assigned to a function with which contact is to be made according to a predefined connection assignment and are arranged on the main body (21) with predefined positioning, and to an associated component arrangement having such a contact-making apparatus (20). According to the invention, the first contact elements (23) are positioned on the main body (21) in a rotationally symmetrical manner through an angle of 90°, with the result that no different component-based functions lie on one another when the direction-dependent electrical and/or electronic component (10) is rotated through 90°.