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公开(公告)号：EP1622198B1
公开(公告)日：2013-10-09
申请号：EP05016228.8
申请日：2005-07-26
Applicant: BROTHER KOGYO KABUSHIKI KAISHA
Inventor： Sugahara, Hiroto, Brother Kogyo K.K.
IPC: H01L23/373 , H01L23/473
CPC classification number: H01L23/3736 , B41J2/14233 , B41J2002/14491 , B41J2202/08 , H01L23/367 , H01L23/3735 , H01L23/473 , H01L2224/16 , H05K1/0203 , H05K1/0272 , H05K1/053 , H05K3/305 , H05K2201/064 , H05K2201/066 , H05K2201/10674
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82.发明授权DRAHTBESCHRIEBENE LEITERPLATTE ODER PLATINE MIT LEITERBAHNEN UND LEITUNGSDRÄHTEN MIT RECHTECKIGEM QUERSCHNITT 有权WIRE DESCRIBED PCB或董事会，交通线路电线与矩形截面HEAD
公开(公告)号：EP1842402B2
公开(公告)日：2012-11-28
申请号：EP06706388.3
申请日：2006-01-24
Applicant: JUMATECH GmbH
Inventor： WÖLFEL, Markus
CPC classification number: H05K3/103 , H05K1/0272 , H05K3/222 , H05K2201/064 , H05K2201/098 , H05K2201/10257 , H05K2201/1028 , H05K2201/10287
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83.发明授权Thermal management system and method for electronic equipment mounted on coldplates 有权安装在散热器组件系统为热转移法和一
公开(公告)号：EP1599081B1
公开(公告)日：2011-07-13
申请号：EP05253019.3
申请日：2005-05-17
Applicant: RAYTHEON COMPANY
Inventor： Barson, George F. , Weber, Richard M. , Haws, James L.
IPC: H05K7/20 , H05K1/02 , H01L23/473
CPC classification number: H05K7/20254 , H01L23/473 , H01L2924/0002 , H05K1/0206 , H05K1/0272 , H05K3/0058 , H05K2201/064 , H01L2924/00
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公开(公告)号：EP2308274A1
公开(公告)日：2011-04-13
申请号：EP09780632.7
申请日：2009-07-15
Applicant: Robert Bosch GmbH
Inventor： KUGLER, Andreas , VOIGTLAENDER, Klaus , KIMMICH, Peter
CPC classification number: H05K1/185 , H01L23/427 , H01L23/473 , H01L23/49822 , H01L23/4985 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/25 , H01L24/82 , H01L24/96 , H01L25/071 , H01L25/072 , H01L25/074 , H01L2224/04105 , H01L2224/24137 , H01L2224/2518 , H01L2924/01013 , H01L2924/01029 , H01L2924/01047 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/1433 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H05K1/0206 , H05K1/0272 , H05K1/162 , H05K1/189 , H05K3/4614 , H05K3/4644 , H05K2201/0379 , H05K2201/064 , H05K2201/066 , H05K2201/09745 , H05K2201/10166 , H05K2203/1469
Abstract: The invention relates to a printed circuit board (1) with a sheet-like board substrate (2) and with at least one electronic component (3), wherein it is provided that the component (3) is arranged within the board substrate (2). The invention also relates to a corresponding method for producing the printed circuit board.
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85.发明授权
公开(公告)号：EP1271646B1
公开(公告)日：2011-02-23
申请号：EP02291371.9
申请日：2002-06-04
Applicant: ALSTOM Transport SA
Inventor： Beuille, Christophe , Breit, Fabrice
IPC: H01L23/473 , H01L23/373
CPC classification number: H01L23/473 , H01L23/367 , H01L23/3732 , H01L2924/0002 , H05K1/0272 , H05K1/0306 , H05K2201/064 , H05K2201/10166 , Y10T29/49126 , H01L2924/00
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Patent Agency Ranking
公开(公告)号：EP2193701A1
公开(公告)日：2010-06-09
申请号：EP08804643.8
申请日：2008-09-24
Applicant: Thales Nederland B.V.
Inventor： BROK, Gerrit Johannes Hendrikus Maria , WITS, Wessel Willems , MANNAK, Jan Hendrik , LEGTENBERG, Rob
CPC classification number: H05K1/0272 , H01L23/467 , H01L24/45 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01013 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K2201/064 , H05K2201/09072 , H05K2201/10734 , Y10T29/49117 , Y10T29/49165 , H01L2924/00014 , H01L2924/00012
Abstract: Electronic circuitry comprises a circuit board (34) and at least one component (30,32) mounted on the circuit board (34), wherein the at least one component (30,32) generates heat in use, the circuit board (34) includes at least one aperture (48, 50) aligned with the component (30,32) or a respective one of the components, and the electronic circuitry is configured to provide, in use, a path for coolant fluid to flow through the or each aperture (48, 50) and past the at least one component (30,32).
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87.发明公开Thermal management system and method for electronic equipment mounted on coldplates 有权安装在散热器组件系统为热转移法和一
公开(公告)号：EP2112875A3
公开(公告)日：2009-12-02
申请号：EP09165347.7
申请日：2005-05-17
Applicant: Raytheon Company
Inventor： Barson, George F , Weber, Richard M , Haws, James L
IPC: H05K7/20 , H05K1/02 , H01L23/473
CPC classification number: H05K7/20254 , H01L23/473 , H01L2924/0002 , H05K1/0206 , H05K1/0272 , H05K3/0058 , H05K2201/064 , H01L2924/00
Abstract: According to an embodiment of the present invention, a thermal management system for electronic components (102) includes a plastic coldplate (100) having a mounting surface for mounting one or more electronic components (102), one or more passageways configured to have a fluid flow therethrough disposed within the plastic coldplate (100), and a highly conductive material disposed within the plastic coldplate and thermally coupled to the mounting surface (102). The highly conductive material is operable to transfer heat from the mounting surface (102) to the fluid flow.
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88.发明公开
公开(公告)号：EP1848578A2
公开(公告)日：2007-10-31
申请号：EP06719889.5
申请日：2006-01-31
Applicant: HARRIS CORPORATION
Inventor： SMITH, C. W. , NEWTON, Charles, M. , JAYNES, Paul, B.
IPC: B29C65/00
CPC classification number: B32B37/06 , B32B37/04 , B32B37/08 , B32B37/10 , B32B37/1009 , B32B37/185 , B32B2305/55 , B32B2309/02 , B32B2457/08 , H05K1/189 , H05K3/284 , H05K2201/064 , H05K2203/068 , H05K2203/1121 , H05K2203/1311 , H05K2203/304
Abstract: A method and apparatus is disclosed for affixing a cover layer (18) formed of liquid crystal polymer to a flex circuit (20) consisting of circuit elements (54) mounted to a liquid crystal polymer substrate (52) in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants and to provide thermal protection of temperature sensitive circuit elements within the flex circuit during the encapsulation process.
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89.发明公开DRAHTBESCHRIEBENE LEITERPLATTE ODER PLATINE MIT LEITUNGSDRÄHTEN MIT RECHTECKIGEM ODER QUADRATISCHEM QUERSCHNITT 有权WIRE DESCRIBED PCB或董事会，交通线路电线与矩形截面HEAD
公开(公告)号：EP1842402A2
公开(公告)日：2007-10-10
申请号：EP06706388.3
申请日：2006-01-24
Applicant: JUMATECH GmbH
Inventor： WÖLFEL, Markus
CPC classification number: H05K3/103 , H05K1/0272 , H05K3/222 , H05K2201/064 , H05K2201/098 , H05K2201/10257 , H05K2201/1028 , H05K2201/10287
Abstract: The invention relates to a wire-printed circuit board or card (1) comprising conductors (6) that run on and/or in the circuit board or card between connection points (4). The aim of the invention is to improve a circuit board of this type. To achieve this, at least one of the conductors (6) has a rectangular or square cross-section. In addition, at least some of the conductors have a hollow cross-section, in which a coolant or heating agent circulates.
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90.发明公开Thermal management system and method for electronic equipment mounted on coldplates 有权安装在散热器组件系统为热转移法和一
公开(公告)号：EP1599081A3
公开(公告)日：2007-05-23
申请号：EP05253019.3
申请日：2005-05-17
Applicant: RAYTHEON COMPANY
Inventor： Barson, George F. , Weber, Richard M. , Haws, James L.
IPC: H05K7/20 , H05K1/02 , H01L23/473
CPC classification number: H05K7/20254 , H01L23/473 , H01L2924/0002 , H05K1/0206 , H05K1/0272 , H05K3/0058 , H05K2201/064 , H01L2924/00
Abstract: According to an embodiment of the present invention, a thermal management system for electronic components (102) includes a plastic coldplate (100) having a mounting surface for mounting one or more electronic components (102), one or more passageways configured to have a fluid flow therethrough disposed within the plastic coldplate (100), and a highly conductive material disposed within the plastic coldplate and thermally coupled to the mounting surface (102). The highly conductive material is operable to transfer heat from the mounting surface (102) to the fluid flow.
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