公开(公告)号：EP2752839A1

公开(公告)日：2014-07-09

申请号：EP13193452.3

申请日：2013-11-19

Applicant: Hitachi Media Electronics Co., Ltd.

Inventor： Haruna, Fumio ,  Ogi, Yuya ,  Kobori, Tomoki ,  Seo, Yoshiho ,  Hatori, Masayuki ,  Ueda, Toshio

IPC: G09G3/02

CPC classification number: G09G5/10 ,  G09G3/025 ,  G09G2320/0271 ,  G09G2320/043 ,  G09G2320/0606 ,  G09G2320/0633 ,  G09G2320/0673 ,  G09G2360/144

Abstract: A laser beam display device includes a dimming setting input unit into which a dimming value corresponding to one of a plural dimming steps may be input. A first dimming processing unit having plural dimming LUTs stores dimming amounts, regarding the respective dimming steps, with the corresponding gradation levels as indexes. A second dimming processing unit having one gain LUT, holding gains regarding the respective dimming steps, and a multiplier. This creates the indexes for the respective dimming LUTs by multiplying a video signal by the gains, and a light source drive unit drives a laser diode on the basis of reference results obtained by referring to the dimming LUTs of the first dimming processing unit. Thus the luminance of the emission beam of the laser diode, which corresponds to the video signal, is dimmed in accordance with a dimming setting input from the dimming setting input unit.

Abstract translation: 激光束显示装置包括调光设置输入单元，其中可以输入与多个调光步骤之一相对应的调光值。 具有多个调光LUT的第一调光处理单元以相应的灰度级作为指标存储关于各个调光步骤的调光量。 具有一个增益LUT的第二调光处理单元，保持关于各个调光步骤的增益，以及乘法器。 这通过将视频信号乘以增益来创建各个调光LUT的索引，并且光源驱动单元基于通过参考第一调光处理单元的调光LUT获得的参考结果来驱动激光二极管。 因此，对应于视频信号的激光二极管的发射光束的亮度根据来自调光设置输入单元的调光设置输入而变暗。

公开(公告)号：EP1445861A3

公开(公告)日：2009-10-28

申请号：EP04000078.8

申请日：2004-01-05

Applicant: Hitachi Ltd. ,  Hitachi Media Electronics Co., Ltd.

Inventor： Fujiwara, Shinichi, Hitachi, Ltd. Int.Prop.Group ,  Harada, Masahide, Hitachi, Ltd. Int.Prop.Group ,  Matsumoto, Kunio, Hitachi, Ltd. Int.Prop.Group ,  Matsuzaki, Eiji, Hitachi, Ltd. Int.Prop.Group

IPC: H03H9/10 ,  H01L21/50 ,  H01L23/10 ,  H01L23/485 ,  H01L21/60 ,  H03H3/02 ,  H03H3/04 ,  H01L41/053 ,  B81B7/00

CPC classification number: H03H9/059 ,  B81B7/007 ,  B81C1/00269 ,  B81C2203/019 ,  B81C2203/036 ,  H01L23/10 ,  H01L23/552 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/05671 ,  H01L2224/11462 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/29199 ,  H01L2224/29355 ,  H01L2224/29388 ,  H01L2224/29444 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/81139 ,  H01L2224/81203 ,  H01L2224/81411 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/8183 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3025 ,  H03H3/007 ,  H03H3/08 ,  H03H9/1078 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/01049 ,  H01L2924/00

Abstract: An electronic device of a chip size having improved airtightness is designed to be formed by a reduced number of process steps. An electronic component including a chip having a functional surface and electrodes at least on one side and a substrate having a portion which can be connected to the electrodes of the chip is designed as such an electronic device. In the electronic component, electroconductive glass or an intermetallic compound is used for connection portions to establish electrical connections between the chip and the substrate and to simultaneously seal the device surface on the chip.

公开(公告)号：EP1469462B1

公开(公告)日：2008-08-27

申请号：EP04017651.3

申请日：1997-08-14

Applicant: Hitachi, Ltd. ,  Hitachi Media Electronics Co., Ltd.

Inventor： Inui, Shinro ,  Otoshi, Naohiko ,  Izumi, Katsuhiko,c/o Hitachi Ltd, Int.Prop. Group ,  Miura, Michio ,  Kuroda, Naomitsu ,  Mizuno, Ryuichiro c/o Hitachi Ltd, Int.Prop. Group

IPC: G11B7/09 ,  G11B7/135

CPC classification number: G11B7/1374 ,  G11B7/093 ,  G11B7/0933 ,  G11B7/0935 ,  G11B2007/0006

公开(公告)号：EP2709366A2

公开(公告)日：2014-03-19

申请号：EP13179310.1

申请日：2013-08-05

Applicant: Hitachi Media Electronics Co., Ltd.

Inventor： Kusaka, Hiromi ,  Seo, Yoshiho ,  Ouchi, Satoshi ,  Hatagi, Michio

IPC: H04N9/31 ,  G02B3/02

CPC classification number: H04N9/3129 ,  G02B5/04 ,  G02B26/101 ,  G02B26/105 ,  G02B27/09 ,  G02B27/0966 ,  G02B27/0972 ,  G03B21/2033 ,  G03B21/208

Abstract: A scanning type projector (100) two-dimensionally projecting a laser beam and generating an image according to the present invention comprises: a light source (101, 102, 103) having a light intensity corresponding to a pixel of the image and emitting a laser beam having an elliptical beam; a collimator lens (104, 105, 106) collimating a laser beam emitted from the light source (101, 102, 103) without converting the same into focused light; a beam contracting/shaping element (109) that reduces a luminous beam width in a predetermined direction of the laser beam emitted from the collimator lens (104, 105, 106); a condensing lens (110) that converts a laser beam emitted from the beam contracting/shaping element (109) into focused light corresponding to a projection distance (R); and a two-dimensional scanning unit (111) configured to two-dimensionally scan and project a laser beam emitted from the condensing lens (110).

公开(公告)号：EP1852979A2

公开(公告)日：2007-11-07

申请号：EP07016077.5

申请日：2006-06-05

Applicant: Hitachi, Ltd. ,  Hitachi Media Electronics Co., Ltd. ,  Hitachi Cable Ltd.

Inventor： Adachi, Satoshi ,  Katagishi, Makoto ,  Murata, Ikuo ,  Iwamura, Masumi ,  Takei, Ken ,  Sugiyama, Takahiro ,  Shirakawa, Yohei

IPC: H04B1/38 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q9/04 ,  H01Q1/38

CPC classification number: H01Q1/38 ,  H01Q1/22 ,  H01Q1/243 ,  H01Q9/145 ,  H04B1/0458 ,  H04B1/18

Abstract: In an antenna (103, 103A) that has high sensitivity to frequencies of narrow bands and over a wide band and that can be small-sized, and in a wireless module (102, 108), wireless unit (102, 108) and wireless apparatus (101, 110) using this antenna, the antenna is comprised of a transmission line, (11, 12) and variable capacitance means (13, 13A, 13B) connected to this transmission line, and the variable capacitance means (13, 13A, 13B) controls the resonant frequency.

Abstract translation: 在对窄频带和宽频带的频率具有高灵敏度并且尺寸可以小的天线（103,103A）中，并且在无线模块（102,108）中，无线单元（102,108）和无线单元 使用该天线的装置（101,110）中，天线由连接到该传输线的传输线（11,12）和可变电容装置（13,13A，13B）组成，并且可变电容装置（13,13A ，13B）控制谐振频率。

公开(公告)号：EP1734659A1

公开(公告)日：2006-12-20

申请号：EP06252889.8

申请日：2006-06-05

Applicant: Hitachi, Ltd. ,  Hitachi Media Electronics Co., Ltd. ,  Hitachi Cable Ltd.

Inventor： Adachi, Satoshi, c/o Hitachi, Ltd., IP Group ,  Katagishi, Makoto, c/o Hitachi, Ltd., IP Group ,  Murata, Ikuo, c/o Hitachi, Ltd., IP Group ,  Iwamura, Masumi, c/o Hitachi, Ltd., IP Group ,  Takei, Ken, c/o Hitachi Cable Ltd. ,  Sugiyama, Takahiro, c/o Hitachi Cable Ltd. ,  Shirakawa, Yohei, c/o Hitachi Cable Ltd.

IPC: H04B1/38 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q9/04 ,  H01Q1/38

CPC classification number: H01Q1/38 ,  H01Q1/22 ,  H01Q1/243 ,  H01Q9/145 ,  H04B1/0458 ,  H04B1/18

Abstract: In an antenna (103, 103A) that has high sensitivity to frequencies of narrow bands and over a wide band and that can be small-sized, and in a wireless module (102, 108), wireless unit (102, 108) and wireless apparatus (101, 110) using this antenna, the antenna is comprised of a transmission line, (11, 12) and variable capacitance means (13, 13A, 138) connected to this transmission line, and the variable capacitance means (13, 13A, 13B) controls the resonant frequency.

Abstract translation: 在对窄带和宽带的频率具有高灵敏度并且可以是小尺寸的天线（103,103A）中，并且在无线模块（102,108）中，无线单元（102,108）和无线 装置（101,110），天线包括传输线（11,12）和连接到该传输线的可变电容装置（13,13A，138），以及可变电容装置（13,13A ，13B）控制谐振频率。

公开(公告)号：EP1445861A2

公开(公告)日：2004-08-11

申请号：EP04000078.8

申请日：2004-01-05

Applicant: Hitachi Ltd. ,  Hitachi Media Electronics Co., Ltd.

Inventor： Fujiwara, Shinichi, Hitachi, Ltd. Int.Prop.Group ,  Harada, Masahide, Hitachi, Ltd. Int.Prop.Group ,  Matsumoto, Kunio, Hitachi, Ltd. Int.Prop.Group ,  Matsuzaki, Eiji, Hitachi, Ltd. Int.Prop.Group

IPC: H03H9/10

CPC classification number: H03H9/059 ,  B81B7/007 ,  B81C1/00269 ,  B81C2203/019 ,  B81C2203/036 ,  H01L23/10 ,  H01L23/552 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/05671 ,  H01L2224/11462 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/29199 ,  H01L2224/29355 ,  H01L2224/29388 ,  H01L2224/29444 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/81139 ,  H01L2224/81203 ,  H01L2224/81411 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/8183 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3025 ,  H03H3/007 ,  H03H3/08 ,  H03H9/1078 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/01049 ,  H01L2924/00

Abstract: An electronic device of a chip size having improved airtightness is designed to be formed by a reduced number of process steps. An electronic component including a chip having a functional surface and electrodes at least on one side and a substrate having a portion which can be connected to the electrodes of the chip is designed as such an electronic device. In the electronic component, electroconductive glass or an intermetallic compound is used for connection portions to establish electrical connections between the chip and the substrate and to simultaneously seal the device surface on the chip.

Abstract translation: 通过减少数量的工艺步骤来设计具有改进的气密性的芯片尺寸的电子装置。 将包括具有功能表面的芯片和至少一侧的电极的电子部件和具有可连接到芯片的电极的部分的基板设计为这样的电子设备。 在电子部件中，导电玻璃或金属间化合物用于连接部分，以在芯片和基板之间建立电连接并同时密封芯片上的器件表面。

公开(公告)号：EP1014592A2

公开(公告)日：2000-06-28

申请号：EP99124880.8

申请日：1999-12-16

Applicant: Hitachi Media Electronics Co., Ltd.

Inventor： HIKITA,Mitsutaka. CL of Hitachi,LTD ,  SHIBAGAKI, Nobuhiko.CL of Hitachi, LTD. ,  SAKIYAMA,Kazuyuki.Hitachi Media Elec.Co.LTD ,  MATSUURA Naoki Elec.Co.LTD

IPC: H04B1/52 ,  H01P1/213

CPC classification number: H03H9/0576 ,  H03H9/725

Abstract: An antenna duplexer is reduced in size, so that a dual-band/triple-band mobile radio terminal small in size and light in weight is realized. An off-set PLL modulation system is adopted, and a transmitting system of the antenna duplexer is constituted by switches. Further, in mounting an SAW filter, a multi-layer substrate is adopted, matching circuits and so on are formed by lumped-constant circuit elements, and the SAW filter is received in a space provided on the multi-layer substrate.

Abstract translation: 天线双工器的尺寸减小，从而实现了小型和重量轻的双频带/三频移动无线电终端。 采用偏置PLL调制方式，天线双工器的发送系统由开关构成。 此外，在安装SAW滤波器时，采用多层基板，由集总常数电路元件形成匹配电路等，并且SAW滤波器被接收在设置在多层基板上的空间中。

公开(公告)号：EP2288027A2

公开(公告)日：2011-02-23

申请号：EP10006770.1

申请日：2010-06-30

Applicant: Hitachi Media Electronics Co., Ltd.

Inventor： Isobe, Atsushi ,  Asai, Kengo

IPC: H03H9/02

CPC classification number: H03H9/0222 ,  H03H9/02559

Abstract: In a boundary elastic wave resonator formed with a cross finger type transducer (IDT) of a wave length λ of a boundary elastic wave, a silicon oxide film (5), and an aluminum nitride film (6) above a surface of a θYX-LN single-crystal piezoelectric substrate (1) having a predetermined cut angle θ, a film thickness h 1 and a cut angle θ or the like of the silicon oxide film are optimized. For example, the film thickness h 1 and the cut angle θ are made to be 127.5°≤ θ ≤ 129.5° and 20% ≤ h 1 /λ ≤ 100%.

Abstract translation: 在由边界弹性波的波长»的交叉指型传感器（IDT）形成的边界弹性波谐振器中，在¸YX的表面上方的氧化硅膜（5）和氮化铝膜（6） 优选具有预定切割角度的R N单晶压电基板（1），氧化硅膜的膜厚度h 1和切割角度¸等。 例如，膜厚度h 1和切割角度¸为127.5°‰¤¤129.5°和20％‰¤h 1 /‰¤100％。

公开(公告)号：EP1852979B1

公开(公告)日：2010-03-17

申请号：EP07016077.5

申请日：2006-06-05

Applicant: Hitachi, Ltd. ,  Hitachi Media Electronics Co., Ltd. ,  Hitachi Cable Ltd.

Inventor： Adachi, Satoshi ,  Katagishi, Makoto ,  Murata, Ikuo ,  Iwamura, Masumi ,  Takei, Ken ,  Sugiyama, Takahiro ,  Shirakawa, Yohei

IPC: H04B1/18 ,  H04B1/04 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q9/14

CPC classification number: H01Q1/38 ,  H01Q1/22 ,  H01Q1/243 ,  H01Q9/145 ,  H04B1/0458 ,  H04B1/18

Abstract: In an antenna (103, 103A) that has high sensitivity to frequencies of narrow bands and over a wide band and that can be small-sized, and in a wireless module (102, 108), wireless unit (102, 108) and wireless apparatus (101, 110) using this antenna, the antenna is comprised of a transmission line, (11, 12) and variable capacitance means (13, 13A, 138) connected to this transmission line, and the variable capacitance means (13, 13A, 13B) controls the resonant frequency.