公开(公告)号：EP1926784B1

公开(公告)日：2010-01-13

申请号：EP06793112.1

申请日：2006-08-31

Applicant: BASF SE

Inventor： SCHNEIDER, Norbert ,  LIPPERT, Gerald ,  LOCHTMAN, Rene ,  MAAS, Heiko ,  PFISTER, Jürgen ,  SOBOTKA, Bettina ,  WAGNER, Norbert

IPC: C09D5/24

CPC classification number: H01B1/22 ,  C09D5/24 ,  H05K1/095 ,  H05K3/246 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0272 ,  H05K2201/0347 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/258

Abstract: The invention relates to a dispersion for applying a metal layer to an electrically non-conductive substrate containing an organic binder component, a metal component with different metals and/or metal particle shapes, and a solvent component. The invention further relates to methods for producing said dispersion, methods for creating an optionally structured metal layer with the aid of the dispersion, the obtained substrate surfaces, and the use thereof.

公开(公告)号：EP2010699A2

公开(公告)日：2009-01-07

申请号：EP07728172.3

申请日：2007-04-17

Applicant: BASF SE

Inventor： LOCHTMAN, Rene ,  KACZUN, Jürgen ,  SCHNEIDER, Norbert ,  PFISTER, Jürgen ,  POHL, Gert ,  WAGNER, Norbert

IPC: C25D5/54 ,  C25D17/00 ,  C25D17/12

CPC classification number: C25D17/14 ,  C25D5/06 ,  C25D5/54 ,  C25D7/0621 ,  C25D17/005 ,  C25D17/12 ,  H05K3/241

Abstract: The invention relates to a device for electroplating at least one electrically conductive substrate (8), or an electrically conductive structure situated on a non-conductive substrate (8). Said device comprises at least one bath, an anode and a cathode (2). The bath contains an electrolyte solution, which comprises at least one metal salt and from which metal ions are deposited on electrically conductive surfaces of the substrate, as the cathode is brought into contact with the surface of the substrate to be coated and said substrate is conveyed through the bath. The cathode comprises at least one strip (2) with at least one electrically conductive segment (12) and is guided around at least two rotating shafts (3). The invention also relates to a method for electroplating at least one substrate that is carried out in a device according to the invention. According to said method, to produce the coating, the strip lies on the substrate and circulates at a speed corresponding to the speed at which the substrate is conveyed through the bath. The invention further relates to the use of said device for electroplating electrically conductive structures situated on an electrically non-conductive support.

Abstract translation: 本发明涉及用于电镀至少一个导电衬底（8）或位于不导电衬底（8）上的导电结构的装置。 所述装置包括至少一个浴，阳极和阴极（2）。 该浴含有电解质溶液，该电解质溶液包含至少一种金属盐，并且当阴极与待涂覆的基底的表面接触并且所述基底被传送时，电解质溶液从其中沉积金属离子在基底的导电表面上 通过洗澡。 阴极包括具有至少一个导电段（12）的至少一个带（2），并围绕至少两个旋转轴（3）被引导。 本发明还涉及一种用于电镀至少一个在根据本发明的装置中执行的基板的方法。 根据所述方法，为了产生涂层，条带位于基底上并以与基底通过浴槽的速度相对应的速度循环。 本发明进一步涉及所述装置用于电镀位于不导电支撑件上的导电结构的用途。

公开(公告)号：EP1025057B1

公开(公告)日：2017-08-23

申请号：EP98954417.6

申请日：1998-10-14

Applicant: BASF SE

Inventor： SIEMENSMEYER, Karl ,  SCHUHMACHER, Peter ,  MEYER, Frank ,  SCHNEIDER, Norbert ,  ISHIDA, Hiroki

IPC: C03C17/32 ,  G02B5/28

CPC classification number: G02B5/282 ,  C03C17/32 ,  G02B5/3016 ,  Y10T428/10 ,  Y10T428/1005

公开(公告)号：EP2010700B1

公开(公告)日：2010-01-20

申请号：EP07727869.5

申请日：2007-04-05

Applicant: BASF SE

Inventor： LOCHTMAN, Rene ,  KACZUN, Jürgen ,  SCHNEIDER, Norbert ,  PFISTER, Jürgen ,  POHL, Gert ,  WAGNER, Norbert

IPC: C25D7/06 ,  C25D7/00 ,  C25D17/00

CPC classification number: C25D17/12 ,  C25D7/0657 ,  C25D17/005 ,  C25D17/06 ,  C25D17/28

公开(公告)号：EP1966431A1

公开(公告)日：2008-09-10

申请号：EP06830676.0

申请日：2006-12-18

Applicant: BASF SE

Inventor： RAFFAELE ADDAMO, Antonino ,  NÖRENBERG, Ralf ,  SOBOTKA, Bettina ,  DURIS, Tibor ,  LOCHTMAN, Rene ,  WAGNER, Norbert ,  SCHNEIDER, Norbert ,  PFISTER, Jürgen

IPC: D06M11/83 ,  D06M23/16 ,  C09D5/24 ,  H05B3/34

CPC classification number: D06M11/83 ,  D06M23/16 ,  D06M2200/00 ,  D06Q1/04 ,  H05B3/342 ,  H05B2203/007 ,  H05B2203/013 ,  H05B2203/017 ,  H05B2203/029 ,  H05K1/0234 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/167 ,  H05K2201/10098 ,  Y10T442/3382 ,  Y10T442/654

Abstract: The invention relates to a method for producing a planer metallised textile structure which is characterised in that a planar textile structure (A) is printed with a printing formula which contains at least one metal powder (a) as components, selected from a powder of Zn, Ni, Cu, Sn, Co, Mn, Fe, Mg, Pb, Cr and Bi, or mixtures and alloys of the above-mentioned metals, (B) is thermally treated in one or several steps, and (C) an additional metal is deposited on the planar textile structure.

公开(公告)号：EP1899414A2

公开(公告)日：2008-03-19

申请号：EP06754864.4

申请日：2006-04-26

Applicant: BASF SE

Inventor： SCHNEIDER, Norbert ,  LIPPERT, Gerald ,  LOCHTMAN, Rene ,  MAAS, Heiko ,  PFISTER, Jürgen ,  SOBOTKA, Bettina ,  WAGNER, Norbert ,  NIESSNER, Norbert ,  SCHEIBITZ, Matthias ,  DAHLKE, Michael ,  WARZELHAN, Volker

IPC: C08K13/02

CPC classification number: C08L51/003 ,  B29C47/0004 ,  B29C47/0011 ,  B29C47/0021 ,  B29C47/06 ,  B29C47/14 ,  B29C51/00 ,  B29K2105/0008 ,  B29K2105/0032 ,  B29K2105/0044 ,  B29K2105/005 ,  B29K2105/256 ,  B32B5/16 ,  B32B27/08 ,  B32B27/14 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2260/025 ,  B32B2260/046 ,  B32B2264/105 ,  B32B2274/00 ,  B32B2307/202 ,  B32B2307/416 ,  B32B2307/546 ,  B32B2307/558 ,  B32B2307/7242 ,  B32B2419/00 ,  B32B2509/00 ,  B32B2605/00 ,  C08J5/18 ,  C08K3/08 ,  C08K2201/008 ,  C08L23/02 ,  C08L53/02 ,  C08L55/02 ,  C08L71/02 ,  C08L2205/16 ,  C23C18/54 ,  C25D5/56 ,  H01Q15/141 ,  H01Q17/008 ,  H05K9/0083 ,  Y10T156/10 ,  Y10T428/25 ,  Y10T428/256 ,  C08L2666/04 ,  C08L2666/02

Abstract: Films or plates made of a plastic mixture and capable of being metal-plated are disclosed, comprising, in relation to the total weight of components A, B, C and D, which add up to 100 % by weight: (a) 5-50 % by weight of a thermoplastic polymer as component A; (b) 50-95 % by weight of a metal powder having an average particle diameter ranging from 0.01-100 νm (determined by the method defined in the description), the metal having a more negative normal potential in an acid solution than silver, as component B; (c) 0-10 % by weight of a dispersant as component C; and (d) 0-40 % by weight fibrous or particulate fillers or their mixtures as component D. The elongation at tear of component A (determined by the method defined in the description) is 1.1-100 times higher than the elongation at tear of the plastic mixture comprising components A, B and optionally C and D (determined by the method defined in the description). The tensile strength of component A (determined by the method defined in the description) is 0.5-4 times higher than the tensile strength of the plastic mixture comprising components A, B and optionally C and D (determined by the method defined in the description). Also disclosed are thermoplastic moulding compounds for producing these films or plates that can be metal-plated, a granulate comprising these thermoplastic moulding compounds, stratified composite films or plates and mouldings comprising these films or plates, metal-plated polymer bodies comprising these films or plates, stratified composite films or plates and mouldings, processes for producing these objects, the use of these objects as EMI shieldings and absorbers, dampers or reflectors for electromagnetic radiation, oxygen scavengers, electroconducting components, gas barriers, and decorative elements comprising these objects.

公开(公告)号：EP1966431B2

公开(公告)日：2014-03-05

申请号：EP06830676.0

申请日：2006-12-18

Applicant: BASF SE

Inventor： RAFFAELE ADDAMO, Antonino ,  NÖRENBERG, Ralf ,  SOBOTKA, Bettina ,  DURIS, Tibor ,  LOCHTMAN, Rene ,  WAGNER, Norbert ,  SCHNEIDER, Norbert ,  PFISTER, Jürgen

IPC: D06M11/83 ,  D06M23/16 ,  C09D5/24 ,  H05B3/34

CPC classification number: D06M11/83 ,  D06M23/16 ,  D06M2200/00 ,  D06Q1/04 ,  H05B3/342 ,  H05B2203/007 ,  H05B2203/013 ,  H05B2203/017 ,  H05B2203/029 ,  H05K1/0234 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/167 ,  H05K2201/10098 ,  Y10T442/3382 ,  Y10T442/654

公开(公告)号：EP2050321A1

公开(公告)日：2009-04-22

申请号：EP07788054.0

申请日：2007-07-31

Applicant: BASF SE

Inventor： LOCHTMAN, Rene ,  KACZUN, Jürgen ,  SCHNEIDER, Norbert ,  PFISTER, Jürgen ,  WAGNER, Norbert ,  HENTSCHEL, Dieter

IPC: H05K3/24 ,  H05K3/46

CPC classification number: H05K3/4685 ,  H05K3/1241 ,  H05K3/246 ,  H05K3/4664 ,  H05K2201/0347 ,  H05K2203/0796

Abstract: The invention relates to a method for producing structured, and/or the entire surface spanning, electrically conductive surfaces (3, 11) on an electrically nonconductive carrier 5 (1), wherein in a first step the surfaces (3) of a first level are applied to the carrier (1), in a second step the insulating layer (9) is applied at those positions, at which structured, and/or the entire surface spanning, electrically conductive surfaces (11) of a second level cross the structured, and/or the entire surface spanning, electrically conductive surfaces (3) of the first level, and no electrical contact is to occur between the structured, and/or the entire surface spanning, electrically conductive surfaces of the first level (3) and of the second level (11), in a third step the structured, and/or the entire surface spanning, electrically conductive surfaces (11) of the second level are applied according the first step, and the second and third steps are repeated, if necessary.

公开(公告)号：EP2010700A2

公开(公告)日：2009-01-07

申请号：EP07727869.5

申请日：2007-04-05

Applicant: BASF SE

Inventor： LOCHTMAN, Rene ,  KACZUN, Jürgen ,  SCHNEIDER, Norbert ,  PFISTER, Jürgen ,  POHL, Gert ,  WAGNER, Nobert

IPC: C25D7/06 ,  C25D7/00 ,  C25D17/00

CPC classification number: C25D17/12 ,  C25D7/0657 ,  C25D17/005 ,  C25D17/06 ,  C25D17/28

Abstract: The invention relates to a device for electroplating at least one electrically conductive substrate or a structured or electrically conductive surface covering the whole area of a non-conductive substrate. Said device comprises at least one bath, an anode and a cathode. The bath contains an electrolyte solution, which comprises at least one metal salt and from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer, as the cathode is brought into contact with the surface of the substrate to be coated and said substrate is conveyed through the bath. The cathode comprises at least two discs (2, 4, 10) that are rotatably mounted on a respective shaft (1, 5, 14), said discs (2, 4, 10) intermeshing. The invention also relates to a method for electroplating at least one substrate, said method being carried out in a device according to the invention. The invention further relates to the use of said device for electroplating electrically conductive structures situated on an electrically non-conductive support.

Abstract translation: 本发明涉及一种用于电镀至少一个导电衬底或覆盖非导电衬底的整个区域的结构化或导电表面的装置。 所述装置包括至少一个浴，阳极和阴极。 该浴包含电解质溶液，该电解质溶液包含至少一种金属盐，并且当该阴极与待涂覆的基底的表面接触时，该电解质溶液包含至少一种金属盐并且金属离子从该金属盐沉积在该基底的导电表面上以形成金属层 并且所述衬底被传送通过浴。 阴极包括至少两个可旋转地安装在相应的轴（1,5,14）上的盘（2,4,10），所述盘（2,4,10）互相啮合。 本发明还涉及用于电镀至少一个衬底的方法，所述方法在根据本发明的装置中执行。 本发明进一步涉及所述装置用于电镀位于不导电支撑件上的导电结构的用途。

公开(公告)号：EP1966431B1

公开(公告)日：2010-09-22

申请号：EP06830676.0

申请日：2006-12-18

Applicant: BASF SE

Inventor： RAFFAELE ADDAMO, Antonino ,  NÖRENBERG, Ralf ,  SOBOTKA, Bettina ,  DURIS, Tibor ,  LOCHTMAN, Rene ,  WAGNER, Norbert ,  SCHNEIDER, Norbert ,  PFISTER, Jürgen

IPC: D06M11/83 ,  D06M23/16 ,  C09D5/24 ,  H05B3/34

CPC classification number: D06M11/83 ,  D06M23/16 ,  D06M2200/00 ,  D06Q1/04 ,  H05B3/342 ,  H05B2203/007 ,  H05B2203/013 ,  H05B2203/017 ,  H05B2203/029 ,  H05K1/0234 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/167 ,  H05K2201/10098 ,  Y10T442/3382 ,  Y10T442/654

Abstract: The invention relates to a method for producing a planer metallised textile structure which is characterised in that a planar textile structure (A) is printed with a printing formula which contains at least one metal powder (a) as components, selected from a powder of Zn, Ni, Cu, Sn, Co, Mn, Fe, Mg, Pb, Cr and Bi, or mixtures and alloys of the above-mentioned metals, (B) is thermally treated in one or several steps, and (C) an additional metal is deposited on the planar textile structure.

Abstract translation: 本发明涉及一种生产平面金属化织物结构的方法，其特征在于用平版印刷配方印刷平面织物结构（A），所述印刷配方包含至少一种金属粉末（a）作为组分，所述组分选自Zn ，Ni，Cu，Sn，Co，Mn，Fe，Mg，Pb，Cr和Bi，或上述金属的混合物和合金，（B）通过一个或多个步骤热处理，和（C） 金属沉积在平面纺织品结构上。